Abstract: A location search method using a mobile device in multiple locations. In one embodiment of the method, the mobile device receives a first radio frequency (RF) signal transmitted by a first device while the mobile device is at a first geographical location. The mobile device receives a second RF signal transmitted by the first device while the mobile device is at a second geographical location, which is different from the first mobile device geographical location. The mobile device determines a geographical location of the first device based on the first RF signal, the second RF signal, the first mobile device geographical location, and the second mobile device geographical location.

Abstract: A semiconductor laser module includes a semiconductor laser that outputs laser light; an optical fiber that guides the laser light; a lens that couples the laser light, which is output from the semiconductor laser, with the optical fiber; a base that is substantially tabular in shape and that has the semiconductor laser, the optical fiber, and the lens fixed thereon either directly or indirectly; and a housing which houses the base and fixes the base either directly or indirectly. Among faces of the base, a face on a side that is fixed either directly or indirectly to the housing includes a junction plane that is joined to the housing either directly or indirectly, and a detachment plane that is detached to remain unfixed from the housing.

Abstract: A transformer less battery charger system. In one embodiment, the battery charger system includes input terminals for receiving an AC voltage, output terminals for receiving terminals of a rechargeable battery pack, and a non-isolated DC-DC converter coupled between the input terminals and the output terminals. A device is also coupled somewhere between the input terminals and the output terminals. The device is configured to selectively and indirectly couple the input terminals to the output terminals. More particularly, the device indirectly couples the input terminals to the output terminals when the rechargeable battery pack terminals are received by the output terminals, and the device indirectly decouples the input terminals from the output terminals when the rechargeable battery pack terminals are separated from the output terminals.

Abstract: A semiconductor die is disclosed upon which is formed direct current (DC) isolated first and second circuits. The first circuit is configured for electrical connection to a first ground. The second circuit is configured for electrical connection to a second ground. The first and second grounds can be at different potentials. The first and second circuits were formed using front end of line (FEOL) and back end of line (BEOL) processes. The first circuit includes a plurality of first devices, such as transistors, which were formed during the FEOL process, and the second circuit includes only second devices, such as transistors, which were formed during the BEOL process.

Abstract: A transformer less battery charger system. In one embodiment, the battery charger system includes input terminals for receiving an AC voltage, output terminals for receiving terminals of a rechargeable battery pack, and a non-isolated DC-DC converter coupled between the input terminals and the output terminals. A device is also coupled somewhere between the input terminals and the output terminals. The device is configured to selectively and indirectly couple the input terminals to the output terminals. More particularly, the device indirectly couples the input terminals to the output terminals when the rechargeable battery pack terminals are received by the output terminals, and the device indirectly decouples the input terminals from the output terminals when the rechargeable battery pack terminals are separated from the output terminals.

Abstract: A semiconductor laser module includes a semiconductor laser element outputting a laser light; an optical fiber; an optical component disposed at an outer periphery of the optical fiber and fixing the optical fiber; a first-fixing agent fastening the optical component and the optical fiber; a light-absorbing element disposed at an outer periphery of the optical component and fixing the optical component; a first light-blocking portion disposed between an end into which the laser light is incident of the optical fiber and the optical component; and a housing accommodating therein the semiconductor laser element, an end into which the laser light is incident of the optical fiber and the first light-blocking portion. The optical component has an optical transmittance at a wavelength of the laser light, and the light-absorbing element has an optical absorptivity at a wavelength of the laser light.

Abstract: An apparatus and method for use in devices such as rechargeable battery packs. The apparatus, in one embodiment, includes an integrated circuit comprising a first circuit, a second circuit, and a thin film transistor (TFT). The first circuit is configured to generate a square wave signal. The second circuit is configured to convert the square wave signal to a direct current (DC) signal. The TFT is configured to activate and conduct current in response to the DC control signal.

Abstract: A semiconductor laser module includes: a semiconductor laser element emitting a laser light; an optical fiber, into which the laser light emitted from the semiconductor laser element is incident, guiding the laser light; and an optical-fiber-holding unit having a fixing agent and holding the optical fiber, the fixing agent being for fixing the optical fiber. The fixing agent is provided at an area in which a power of a leakage light of the laser light having been incident into the optical fiber and then emitted to outside the optical fiber is low.

Abstract: An optical fiber fixing structure includes: a cylindrical member; an optical fiber inserted into a hole of the cylindrical member; and a fixing material configured to fix the cylindrical member and the optical fiber, wherein the optical fiber is a polarization maintaining optical fiber having a polarization axis, and a center of the optical fiber is arranged so as to be eccentric to a center of the hole, and an angle formed by an eccentric direction connecting the center of the hole and the center of the optical fiber and the polarization axis is ?22.5° to 22.5°, or 67.5° to 112.5°.

Abstract: A transformer less battery charger system. In one embodiment, the battery charger system includes input terminals for receiving an AC voltage, output terminals for receiving terminals of a rechargeable battery pack, and a non-isolated DC-DC converter coupled between the input terminals and the output terminals. A device is also coupled somewhere between the input terminals and the output terminals. The device is configured to selectively and indirectly couple the input terminals to the output terminals. More particularly, the device indirectly couples the input terminals to the output terminals when the rechargeable battery pack terminals are received by the output terminals, and the device indirectly decouples the input terminals from the output terminals when the rechargeable battery pack terminals are separated from the output terminals.

Abstract: An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.

Abstract: A semiconductor laser module includes a semiconductor laser element outputting a laser light; an optical fiber; an optical component disposed at an outer periphery of the optical fiber and fixing the optical fiber; a first-fixing agent fastening the optical component and the optical fiber; a light-absorbing element disposed at an outer periphery of the optical component and fixing the optical component; a first light-blocking portion disposed between an end into which the laser light is incident of the optical fiber and the optical component; and a housing accommodating therein the semiconductor laser element, an end into which the laser light is incident of the optical fiber and the first light-blocking portion. The optical component has an optical transmittance at a wavelength of the laser light, and the light-absorbing element has an optical absorptivity at a wavelength of the laser light.

Abstract: A semiconductor laser module 1 is mainly composed of a package 3, a semiconductor laser 5, lenses 7, 9, 13, reflecting mirrors 11, an optical fiber 15, and the like. The package 3 is composed of a bottom part and side surfaces 19a, 19b. The side surfaces 19a, 19b stand erect approximately vertical to the bottom part of the package. In the semiconductor laser module 1, a plurality of semiconductor laser installation surfaces 17 are formed in a step-like shape. On each semiconductor laser installation surface 17, a semiconductor laser 5 is installed. A lens 7 is arranged at the anterior (in the emission direction) of the semiconductor laser 5. Moreover, a lens 9 is arranged further to the anterior. A reflecting mirror 11 is fixed to the side surface 19a, which is provided facing the emission direction of the semiconductor laser 5.

Abstract: Provided is a grindstone tool capable of grinding with high precision and a method for manufacturing same, the grindstone tool having improved chip discharge characteristics to thereby prevent chips clogging of the chip pocket. The grinding tool comprises: dimples (14) formed in the external peripheral surface (13a) of a base metal (11) so that the quantity present in any position in the width direction of the external peripheral surface (13a) is the same in the peripheral direction; a grinding surface (21) formed by affixing a plurality of abrasive grains (22) to the external peripheral surface (13a) using a plating layer (23); and recess parts (24) into which chips produced by the grinding of the abrasive grains (22) are discharged, the recess parts being formed by portions that correspond to the dimples (14) in the grinding surface (21) being recessed.

Abstract: A semiconductor laser module includes: a semiconductor laser element emitting a laser light; an optical fiber, into which the laser light emitted from the semiconductor laser element is incident, guiding the laser light; and an optical-fiber-holding unit having a fixing agent and holding the optical fiber, the fixing agent being for fixing the optical fiber. The fixing agent is provided at an area in which a power of a leakage light of the laser light having been incident into the optical fiber and then emitted to outside the optical fiber is low.

Abstract: A storage system is migrated without stopping service provision by a host computer. By this means, in a migration-source storage system, data of the cache memory is destaged, and, next, data received from the host computer is directly written in a logical unit by bypassing the cache memory. On the other hand, in a migration-destination storage system, communication with the migration-source storage system is performed to set setting information of a logical unit of the migration object into a logical unit management table and set a writing mode for the cache memory to a cache-bypass mode. After that, the migration-source storage system blocks a path to the host computer. The migration-destination storage system receives a report of the path block from the migration-source storage system and then opens a path between the own system and the host computer.

Abstract: A semiconductor laser module 1 is mainly composed of a package 3, a semiconductor laser 5, lenses 7, 9, 13, reflecting mirrors 11, an optical fiber 15, and the like. The package 3 is composed of a bottom part and side surfaces 19a, 19b. The side surfaces 19a, 19b stand erect approximately vertical to the bottom part of the package. In the semiconductor laser module 1, a plurality of semiconductor laser installation surfaces 17 are formed in a step-like shape. On each semiconductor laser installation surface 17, a semiconductor laser 5 is installed. A lens 7 is arranged at the anterior (in the emission direction) of the semiconductor laser 5. Moreover, a lens 9 is arranged further to the anterior. A reflecting mirror 11 is fixed to the side surface 19a, which is provided facing the emission direction of the semiconductor laser 5.

Abstract: An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.

Abstract: The present invention enables program codes to be shared among processors 211. To prevent the debug operation of one processor 211 from affecting the debug operation of the other processors 211, when detecting a breakpoint during execution of a program code, a debugger 410 or a debugger stub 520 controls the execution of the program code while exchanging breakpoint information 800 with the other debuggers 410 or the other debugger stubs 520. Furthermore, a circuit 170 is created which prevents the program code being carelessly rewritten due to thermal runaway, a bug, and the like of a processor 211, and the protection setting by the protection logic 71 in the circuit 170 is released only in case the processor 211 accesses each of a plurality of registers from 65 to 67 in specified order.

Abstract: Provided is a grindstone tool capable of grinding with high precision and a method for manufacturing same, the grindstone tool having improved chip discharge characteristics to thereby prevent chips clogging of the chip pocket. The grinding tool comprises: dimples (14) formed in the external peripheral surface (13a) of a base metal (11) so that the quantity present in any position in the width direction of the external peripheral surface (13a) is the same in the peripheral direction; a grinding surface (21) formed by affixing a plurality of abrasive grains (22) to the external peripheral surface (13a) using a plating layer (23); and recess parts (24) into which chips produced by the grinding of the abrasive grains (22) are discharged, the recess parts being formed by portions that correspond to the dimples (14) in the grinding surface (21) being recessed.