Abstract: In manufacturing a semiconductor integrated circuit device, an interconnect trench and a contact hole are formed in an interlayer insulating film formed over a first-level interconnect on a semiconductor substrate, a barrier film is formed inside of the trench and contact hole so that its film thickness increases from the center of the bottom of the hole toward the sidewalls all around the bottom of the contact hole, a copper film is formed over the barrier film, and a second-level interconnect and a connector portion (plug) are formed by polishing by CMP. In this way, the geometrically shortest pathway of an electrical current flowing from the second-level interconnect toward the first-level interconnect through a connector portion (plug) does not coincide with a thin barrier film portion which has the lowest electrical resistance, so that the current pathway can be dispersed and a concentration of electrons does not occur readily.

Abstract: The present invention provides a valve nozzle that can restrain property changes of an injecting melted resin by more strictly controlling the temperature of the injecting melted resin, wherein in the internal space or the rear space of a valve nozzle main body, a gate opening and closing mechanism is disposed which includes a torpedo provided with a coolant channel, a piston including a head portion, a shaft portion that is continued from the head portion and disposed in the internal space of the torpedo by being provided with a gap to serve as a resin flow channel on its outer circumferential surface, a tapered surface that is connected to the rear end of the shaft portion and serves as a surface for receiving the pressure of a resin in the resin flow channel, and a coil spring that presses the rear end part of the piston toward a gate, and when the pressure of the melted resin is at a predetermined value or less, the piston is pressed by the coil spring toward the gate to close the resin flow channel, and

Abstract: The valve nozzle according to the invention is constructed so that, in the internal space of a valve nozzle main body, a gate opening and closing mechanism is disposed in which a piston having a head part and a shaft part, a torpedo that is disposed in the internal space of the nozzle head and slidably supports the piston and guides the piston, and is provided with, on its outer circumferential surface, concaved grooves that are twisted with respect to a resin injection direction and serve as a plurality of wound resin flow channels, a coil spring that presses the piston in the direction toward a gate, and a cover that closes the rear end of the torpedo and serves as a spring receiving part of the coil spring are integrally assembled, and when the resin pressure is at a predetermined value or less, the entire circumference of the circular section of the head part of the piston comes into contact with the inner wall of the gate of the nozzle head to close the resin flow channels, and when the resin pressure be

Abstract: A disk device (10) comprises a case (11) for supporting the entire disk device (10), a base chassis (12) on which a spindle motor (21) for rotating the disk is set, a counterweight (13) for absorbing vibration of the base chassis (12), and a plurality of elastic bodies (14a-14d) for mutually supporting the case (11), the base chassis (12) and the counterweight (13). The case (11), the base chassis (12), and the counterweight (13) are supported by the common elastic bodies (14a-14d). As a result, there can be provided the dynamic vibration absorber in which the number of parts is not increased and a cost can be reduced, and the optical disk device (10) using the dynamic vibration absorber.

Abstract: An electromagnetic absorber formed of conductive fiber or the like, such as carbon fiber having an overall length corresponding to the wavelength of electromagnetic waves to be absorbed, is mixed into a base material to form an electromagnetic wave-absorbing pavement material. The electromagnetic wave-absorbing pavement material is used to form a pavement having an electromagnetic wave absorbing course. Further, an electromagnetic wave reflecting course is disposed under the electromagnetic wave absorbing course, and the electric length of the electromagnetic wave reflecting course is set to a predetermined value in relation to the dielectric constant so that electromagnetic waves reflecting off the surface of the electromagnetic wave absorbing course and electromagnetic waves reflecting off the electromagnetic wave reflecting course have opposite phases and thereby cancel each other out, whereby the electromagnetic waves are absorbed well.

Abstract: In manufacturing a semiconductor integrated circuit device, an interconnect trench and a contact hole are formed in an interlayer insulating film formed over a first-level interconnect on a semiconductor substrate, a barrier film is formed inside of the trench and contact hole so that its film thickness increases from the center of the bottom of the hole toward the sidewalls all around the bottom of the contact hole, a copper film is formed over the barrier film, and a second-level interconnect and a connector portion (plug) are formed by polishing by CMP. In this way, the geometrically shortest pathway of an electrical current flowing from the second-level interconnect toward the first-level interconnect through a connector portion (plug) does not coincide with a thin barrier film portion which has the lowest electrical resistance, so that the current pathway can be dispersed and a concentration of electrons does not occur readily.

Abstract: In manufacturing a semiconductor integrated circuit device, an interconnect trench and a contact hole are formed in an interlayer insulating film formed over a first-level interconnect on a semiconductor substrate, a barrier film is formed inside of the trench and contact hole so that its film thickness increases from the center of the bottom of the hole toward the sidewalls all around the bottom of the contact hole, a copper film is formed over the barrier film, and a second-level interconnect and a connector portion (plug) are formed by polishing by CMP. In this way, the geometrically shortest pathway of an electrical current flowing from the second-level interconnect toward the first-level interconnect through a connector portion (plug) does not coincide with a thin barrier film portion which has the lowest electrical resistance, so that the current pathway can be dispersed and a concentration of electrons does not occur readily.

Abstract: In manufacturing a semiconductor integrated circuit device, an interconnect trench and a contact hole are formed in an interlayer insulating film formed over a first-level interconnect on a semiconductor substrate, a barrier film is formed inside of the trench and contact hole so that its film thickness increases from the center of the bottom of the hole toward the sidewalls all around the bottom of the contact hole, a copper film is formed over the barrier film, and a second-level interconnect and a connector portion (plug) are formed by polishing by CMP. In this way, the geometrically shortest pathway of an electrical current flowing from the second-level interconnect toward the first-level interconnect through a connector portion (plug) does not coincide with a thin barrier film portion which has the lowest electrical resistance, so that the current pathway can be dispersed and a concentration of electrons does not occur readily.

Abstract: The input signal X of one channel is divided by a multi-stage delay processing device Z?1 and each of the outputs is superimposed by a specified coefficient by a coefficient processing device W0, W1, . . . , Wk. The results are added by an adder , thereby providing a correlation eliminating filter for extracting a signal component from the input signal X of one channel having a high correlation with the input signal Y of the other channel. There is provided a coefficient updating processing device 5 for successively changing the feature of the correlation eliminating filter according to an error signal e obtained from the output signal RES and the input signal Y from the other channel, and the input signal X of one channel. A surround signal is obtained from a difference between the output RES from the correlation eliminating filter and the input signal Y of the othe channel.

Abstract: In order to prevent rattling and avoid generation of chips at the time of assembly in a storage case for a power steering control unit of a vehicle, a storage case includes a base having a plate-shaped substrate member, and a box-shaped cover having an opening on the lower side and being mounted on the base so as to cover the upper surface of the substrate member, wherein rattling preventing projections are provided at a plurality of positions on the peripheral edge of the substrate member so as to come into abutment with an opening-side edge of the cover, which is positioned at a mounting position with respect to the base, from the outside; on the inner side of the rattling-preventing projections bevels are formed, which press the opening-side edge to resiliently deform the peripheral wall of the cover inward and causes a reaction force to act in a direction in which the cover moves away from the substrate member and comes apart from the base; and the opening-side edge is formed with a crimping projection fo

Abstract: A disk device (10) comprises a case (11) for supporting the entire disk device (10), a base chassis (12) on which a spindle motor (21) for rotating the disk is set, a counterweight (13) for absorbing vibration of the base chassis (12), and a plurality of elastic bodies (14a-14d) for mutually supporting the case (11), the base chassis (12) and the counterweight (13). The case (11), the base chassis (12), and the counterweight (13) are supported by the common elastic bodies (14a-14d). As a result, there can be provided the dynamic vibration absorber in which the number of parts is not increased and a cost can be reduced, and the optical disk device (10) using the dynamic vibration absorber.

Abstract: The valve nozzle according to the invention is constructed so that, in the internal space of a valve nozzle main body, a gate opening and closing mechanism is disposed in which a piston having a head part and a shaft part, a torpedo that is disposed in the internal space of the nozzle head and slidably supports the piston and guides the piston, and is provided with, on its outer circumferential surface, concaved grooves that are twisted with respect to a resin injection direction and serve as a plurality of wound resin flow channels, a coil spring that presses the piston in the direction toward a gate, and a cover that closes the rear end of the torpedo and serves as a spring receiving part of the coil spring are integrally assembled, and when the resin pressure is at a predetermined value or less, the entire circumference of the circular section of the head part of the piston comes into contact with the inner wall of the gate of the nozzle head to close the resin flow channels, and when the resin pressure be

Abstract: Provided are a three-dimensional audio signal processing system using a rigid sphere and a method thereof. The three-dimensional audio signal processing system of the present research simplifies the shape of a human head into a rigid sphere, acquires three-dimensional audio signals by setting up mikes on the rigid sphere, and applies the acquire three-dimensional audio signals to diverse existing reproduction systems. The system includes a three-dimensional audio signal acquiring unit for acquiring audio signals by using a predetermined number of mikes set up on the rigid sphere; and a three-dimensional audio signal post-processing unit for converting the acquired audio signals to reproduce in diverse reproduction environments such as five-channel, four-channel, headphone, stereo, and stereo dipole reproduction environments.

Abstract: An electromagnetic absorber formed of conductive fiber or the like, such as carbon fiber having an overall length corresponding to the wavelength of electromagnetic waves to be absorbed, is mixed into a base material to form an electromagnetic wave-absorbing pavement material. The electromagnetic wave-absorbing pavement material is used to form a pavement having an electromagnetic wave absorbing course. Further, an electromagnetic wave reflecting course is disposed under the electromagnetic wave absorbing course, and the electric length of the electromagnetic wave reflecting course is set to a predetermined value in relation to the dielectric constant so that electromagnetic waves reflecting off the surface of the electromagnetic wave absorbing course and electromagnetic waves reflecting off the electromagnetic wave reflecting course have opposite phases and thereby cancel each other out, whereby the electromagnetic waves are absorbed well.

Abstract: A metal working fluid composition for use as a spray in the mist form, which comprises (a) a base oil comprising at least one of mineral oils and synthetic oils and, based on an amount of an entire composition, (b) 1 to 50% by mass of a sulfur-based extreme pressure agent and (c) 0 to 30% by mass of an ester of a carboxylic acid and a process for metal working which comprises supplying the metal working fluid composition in the mist form. The metal working fluid is inexpensive and exhibits the excellent property for working.

Abstract: A method for injection molding of resin or rubber at an insert positioned in a lower mold injects and fills melted resin or rubber into a cavity of an upper mold through a gate. The lower metal mold has a flexible supporting member supporting the mold insert. The supporting member is vertically movable in a recess formed on the upper surface of the lower mold. The underside thereof is supported by the tip ends of shafts of pressing members that operate independently. The movable supporting member is moved while being pressed by the respective shafts of the pressing members to the upper mold at a plurality of positions. The resin or rubber is molded when the upper surface of the insert uniformly contacts the underside of the upper mold by bending of the movable supporting member.

Abstract: The present invention relates to an in-mold gate opening and closing mechanism in which it is easy to adjust the gate balance, more specially, in an in-mold gate opening and closing mechanism, in which a gate pin disposed in a gate in a mold is moved in line with resin pressure in the gate, the gate is opened by the gate pin escaping from the gate when the resin pressure exceeds an appointed pressure level when filling resin, and the gate is closed by the gate pin moving the gate direction when the resin pressure is lowered from the appointed pressure level when a filling of the resin is completed, wherein the gate is opened by a gate pin escaping from the gate when the resin pressure exceeds a pressing force of a spring adjusted by a mechanism for adjusting the spring pressure when filling resin.

Abstract: An insert molding method and mold has an upper mold and a lower mold disposed to oppose each other. The cavity at the upper mold side is filled with molten resin or rubber material injected through a gate to perform injection molding of the resin or rubber around an insert set at the lower mold side. A movable supporting member sets the insert, and is fitted in a recessed part formed on the upper face of the lower mold. The position of the center of gravity at the lower face of the movable supporting member is supported and pressed towards the upper mold side by the tip of a shaft of a pressing mechanism. A gap is between the side face part of the recessed part and the side face part of the movable supporting member to cause the movable supporting member to tilt about the point at which the movable supporting member is pressed and supported by the shaft inside the recessed part so that the upper face of the insert will be in uniform surface contact with the lower face of the upper mold.

Abstract: In a manufacturing a semiconductor integrated circuit device, an interconnect trench and a contact hole are formed in an interlayer insulating film formed over a first-level interconnect on a semiconductor substrate, a barrier film is formed inside of the trench and contact hole so that its film thickness increases from the center of the bottom of the hole toward the sidewalls all around the bottom of the contact hole, a copper film is formed over the barrier film, and a second-level interconnect and a connector portion (plug) are formed by polishing by CMP. In this way, the geometrically shortest pathway of an electrical current flowing from the second-level interconnect toward the first-level interconnect through a connector portion (plug) does not coincide with a thin barrier film portion which has the lowest electrical resistance, so that the current pathway can be dispersed and a concentration of electrons does not occur readily.

Abstract: Provided are a manufacturing method of a semiconductor integrated circuit device, which comprises forming an interconnect trench and a contact hole in an interlayer insulating film formed over a first-level interconnect on a semiconductor substrate, forming a barrier film inside of the trench and hole so that its film thickness increases from the center of the bottom of the hole toward the sidewalls all around the bottom of the contact hole, forming a copper film over the barrier film, and forming the second-level interconnect and a connector portion (plug) by polishing by CMP; and the semiconductor integrated circuit device manufactured by this method.