Patents by Inventor Tse-An CHEN

Tse-An CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240161818
    Abstract: The invention provides a layout pattern of static random access memory (SRAM), which at least comprises a plurality of gate structures located on a substrate and spanning the plurality of fin structures to form a plurality of transistors distributed on the substrate, wherein the plurality of transistors comprise two pull-up transistors (PU), two pull-down transistors (PD) to form a latch circuit, and two access transistors (PG) connected to the latch circuit. In each SRAM memory cell, the fin structure included in the pull-up transistor (PU) is defined as a PU fin structure, the fin structure included in the pull-down transistor (PD) is defined as a PD fin structure, and the fin structure included in the access transistor (PG) is defined as a PG fin structure, wherein a width of the PD fin structure is wider than a width of the PG fin structure.
    Type: Application
    Filed: November 30, 2022
    Publication date: May 16, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Hsien Huang, Yu-Tse Kuo, Shu-Ru Wang, Li-Ping Huang, Yu-Fang Chen, Chun-Yen Tseng, Tzu-Feng Chang, Chun-Chieh Chang
  • Publication number: 20240164062
    Abstract: A heat dissipation device of electronic equipment has a base, a heat dissipation group, and a cover. The base has an opening, a chamber, and a boss formed in the chamber. The heat dissipation group is connected to the base and has a circuit board and a cooling blade. The circuit board is mounted in the chamber, abuts against the boss, and has a heat source area and at least one non-heat-source area. The heat source area has a first surface facing the boss and a second surface facing the opening. The cooling blade is connected to the base and is located at the second surface. The first surface and the second surface of the heat source area respectively correspond to the boss and the cooling blade in location to provide a guiding direction for heat conduction. The cover is connected to the base.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 16, 2024
    Inventors: Fu Hsiang Chung, Hong Fang Chen, Chun Tse Chan
  • Patent number: 11983956
    Abstract: There is provided a recognition system adaptable to a portable device or a wearable device. The recognition system senses a body heat using a thermal sensor, and performs functions such as the living body recognition, image denoising and body temperature prompting according to detected results.
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: May 14, 2024
    Inventors: Nien-Tse Chen, Yi-Hsien Ko, Yen-Min Chang
  • Publication number: 20240151578
    Abstract: A proximity sensing device includes: a light source, a sensing unit, a light guide unit, and a window. The light source emits light, which is guided by the light guide unit to the window. The emitted light reflected by an object is received by the same window. The light guide unit includes a partial-transmissive-partial-reflective (PTPR) optical element, whereby the light emitted from the light source is reflected by the PTPR optical element, while the light reflected by the object passes through the PTPR optical element. There is only one window required.
    Type: Application
    Filed: May 16, 2023
    Publication date: May 9, 2024
    Inventors: Hui-Hsuan Chen, Nien-Tse Chen
  • Publication number: 20240139337
    Abstract: The present disclosure relates to a method for treating a cancer and/or cancer metastasis in a subject comprising administering to the subject irinotecan loaded in a mesoporous silica nanoparticle. The present disclosure also provides a conjugate comprising an agent loaded in a mesoporous silica nanoparticle (MSN) defining at least one pore and having at least one functional group on a sidewall of the at least one pore.
    Type: Application
    Filed: November 2, 2022
    Publication date: May 2, 2024
    Inventors: Cheng-Hsun WU, SI-HAN WU, YI-PING CHEN, RONG-LIN ZHANG, CHUNG-YUAN MOU, Yu-Tse LEE
  • Patent number: 11953913
    Abstract: There is provided a smart detection system including multiple sensors and a central server. The central server confirms a model of every sensor and a position thereof in an operation area. The central server confirms an event position and predicts a user action according to event signals sent by the multiple sensors.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: April 9, 2024
    Assignee: PIXART IMAGING INC.
    Inventors: Yi-Hsien Ko, Yen-Min Chang, Nien-Tse Chen
  • Patent number: 11955460
    Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Patent number: 11955527
    Abstract: A method includes forming a first sacrificial layer over a substrate, and forming a sandwich structure over the first sacrificial layer. The sandwich structure includes a first isolation layer, a two-dimensional material over the first isolation layer, and a second isolation layer over the two-dimensional material. The method further includes forming a second sacrificial layer over the sandwich structure, forming a first source/drain region and a second source/drain region on opposing ends of, and contacting sidewalls of, the two-dimensional material, removing the first sacrificial layer and the second sacrificial layer to generate spaces, and forming a gate stack filling the spaces.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chao-Ching Cheng, Yi-Tse Hung, Hung-Li Chiang, Tzu-Chiang Chen, Lain-Jong Li, Jin Cai
  • Patent number: 11954259
    Abstract: Glasses with gesture recognition function include a glasses frame and a gesture recognition system. The gesture recognition system is disposed on the glasses frame and configured to detect hand gestures in front of the glasses thereby generating a control command. The gesture recognition system transmits the control command to an electronic device to correspondingly control the electronic device.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: April 9, 2024
    Assignee: PIXART IMAGING INC.
    Inventors: Horng-Goung Lai, En-Feng Hsu, Meng-Huan Hsieh, Yu-Hao Huang, Nien-Tse Chen
  • Publication number: 20240113172
    Abstract: A semiconductor device includes a substrate, a channel layer, a gate structure, source/drain regions, and an insulating layer. The channel layer is disposed over the substrate. The gate structure is disposed over the channel layer. The source/drain regions are disposed over the substrate and disposed at two opposite sides of the channel layer. The insulating layer is disposed between the channel layer and the source/drain regions.
    Type: Application
    Filed: March 5, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Tse Hung, Meng-Zhan Li, Tzu-Chiang Chen, Chao-Ching Cheng, Iuliana Radu
  • Patent number: 11947090
    Abstract: A lens module includes a plurality of lenses, an annular body and a reflective element. The reflective element, the lenses and the annular are sequentially arranged along an optical axis from an object side to an image side. The lenses include a first lens that is disposed closest to the object side, and a second lens that is disposed closest to the image side. The reflective element is disposed between the object side and the first lens. The annular body is disposed between the object side and the first lens, between the lenses, or between the second lens and the image side. The lens module satisfies 0.5 mm<EPA/PL<5.5 mm where EPA is an area of an entrance pupil of the lens module, and PL is a length of the reflective element.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: April 2, 2024
    Assignees: SINTAI OPTICAL (SHENZHEN) CO., LTD., ASIA OPTICAL CO., INC.
    Inventors: Chun-Yu Hsueh, Tsung-Tse Chen, Chun-Hung Huang
  • Patent number: 11948941
    Abstract: A semiconductor device includes a gate layer, a channel material layer, a first dielectric layer and source/drain terminals. The gate layer is disposed over a substrate. The channel material layer is disposed over the gate layer, where a material of the channel material layer includes a first low dimensional material. The first dielectric layer is between the gate layer and the channel material layer. The source/drain terminals are in contact with the channel material layer, where the channel material layer is at least partially disposed between the source/drain terminals and over the gate layer, and the gate layer is disposed between the substrate and the source/drain terminals.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Tse Hung, Ang-Sheng Chou, Hung-Li Chiang, Tzu-Chiang Chen, Chao-Ching Cheng
  • Patent number: 11943935
    Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: March 26, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Yen Tseng, Shu-Ru Wang, Yu-Tse Kuo, Chang-Hung Chen, Yi-Ting Wu, Shu-Wei Yeh, Ya-Lan Chiou, Chun-Hsien Huang
  • Publication number: 20240095177
    Abstract: A computing system performs partial cache deactivation. The computing system estimates the leakage power of a cache based on operating conditions of the cache including voltage and temperature. The computing system further identifies a region of the cache as a candidate for deactivation based on cache hit counts. The computing system then adjusts the size of the region for the deactivation based on the leakage power and a bandwidth of a memory hierarchy device. The memory hierarchy device is at the next level to the cache in a memory hierarchy of the computing system.
    Type: Application
    Filed: August 17, 2023
    Publication date: March 21, 2024
    Inventors: Yu-Pin Chen, Jia-Ming Chen, Chien-Yuan Lai, Ya Ting Chang, Cheng-Tse Chen
  • Publication number: 20240095168
    Abstract: A computing system performs shared cache allocation to allocate cache resources to groups of tasks. The computing system monitors the bandwidth at a memory hierarchy device that is at a next level to the cache in a memory hierarchy of the computing system. The computing system estimates a change in dynamic power from a corresponding change in the bandwidth before and after the cache resources are allocated. The allocation of the cache resources are adjusted according to an allocation policy that receives inputs including the estimated change in the dynamic power and a performance indication of task execution.
    Type: Application
    Filed: August 17, 2023
    Publication date: March 21, 2024
    Inventors: Yu-Pin Chen, Jia-Ming Chen, Chien-Yuan Lai, Ya Ting Chang, Cheng-Tse Chen
  • Publication number: 20240089581
    Abstract: An electronic system including an image sensor, a face detection engine, an eye detection engine and an eye protection engine is provided. The image sensor captures an image. The face detection engine recognizes a user face in the image. The eye detection engine recognizes user eyes in the image. The eye protection engine turns off a display device when the user eyes are recognized in the image but the user face is not recognized in the image.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: HAN-CHANG LIN, GUO-ZHEN WANG, NIEN-TSE CHEN
  • Patent number: 11929115
    Abstract: A memory device and an operation method thereof are provided. The memory device includes memory cells, each having a static random access memory (SRAM) cell and a non-volatile memory cell. The SRAM cell is configured to store complementary data at first and second storage nodes. The non-volatile memory cell is configured to replicate and retain the complementary data before the SRAM cell loses power supply, and to rewrite the replicated data to the first and second storage nodes of the SRAM cell after the power supply of the SRAM cell is restored.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jer-Fu Wang, Hung-Li Chiang, Yi-Tse Hung, Tzu-Chiang Chen, Meng-Fan Chang
  • Publication number: 20240079239
    Abstract: A method includes implanting impurities in a semiconductor substrate to form an etch stop region within the semiconductor substrate; forming a transistor structure on a front side of the semiconductor substrate; forming a front-side interconnect structure over the transistor structure; performing a thinning process on a back side of the semiconductor substrate to reduce a thickness of the semiconductor substrate, wherein the thinning process is slowed by the etch stop region; and forming a back-side interconnect structure over the back side of the semiconductor substrate.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 7, 2024
    Inventors: Bau-Ming Wang, Liang-Yin Chen, Wei Tse Hsu, Jung-Tsan Tsai, Ya-Ching Tseng, Chunyii Liu
  • Patent number: 11922710
    Abstract: A character recognition method includes the following operations: determining that the image of character to be identified corresponds to a matching character of several registered characters according to several vector distances to be identified between a vector of an image of character to be identified and several vectors of several registered character images of several registered characters, and storing a matching vector distance between the vector of the image of character to be identified and a vector of the matching character by a processor; and storing a data of the matching character according to the image of character to be identified when the matching vector distance is less than a vector distance threshold by the processor.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: March 5, 2024
    Assignee: Realtek Semiconductor Corporation
    Inventors: Chien-Hao Chen, Chao-Hsun Yang, Shih-Tse Chen
  • Publication number: 20240071523
    Abstract: A memory device and a programming method thereof are provided. The programming method includes the following steps. According to a step value, based on an incremental step pulse programming scheme, multiple programming operations are performed for a selected memory page. In a setting mode, multiple program verify operations are respectively performed corresponding to the programming operations to respectively generate multiple pass bit numbers. In the setting mode, a pass bit number difference value of two pass bit numbers corresponding to two programming operations is calculated. In the setting mode, an amount of the step value is adjusted according to the pass bit number difference value.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Applicant: MACRONIX International Co., Ltd.
    Inventors: Kun-Tse Lee, Han-Sung Chen, Shih-Chang Huang