Abstract: A system for virtual capital operation over a network such as the internet includes a platform for a transaction between a first user and a second user of the system, a data processor for processing the flow of virtual currency occurred at the transaction between the first user and second user, and a trust company to allow real currency to be stored therein or withdrew therefrom in response to the flow of real currency occurred at the transaction, wherein the data processor generates an amount of virtual currency in response to an amount of real currency entrusted to the trust company.

Abstract: An automatic warning light control device is applicable to an automobile and includes a controller electrically coupled to directional signal lights of the automobile. The controller is electrically coupled to a warning light system, a windshield wiper system, at least one door of the automobile, and a trunk lid. When the windshield is activated in a rain condition, or when the door or the trunk lid is not properly closed, the controller automatically activates the warning light system, wherein both directional signal lights blink simultaneously. When the directional signal lights are used for indication of direction, the directional signal lights are automatically switched from the warning mode to a direction indication mode where only the designated directional signal light blinks. Once the direction indication operation is completed, the directional signal lights automatically go back to the warning mode to blink simultaneously.

Abstract: An automatic warning light control device is applicable to an automobile and includes a controller electrically coupled to directional signal lights of the automobile. The controller is electrically coupled to a warning light system, a windshield wiper system, at least one door of the automobile, and a trunk lid. When the windshield is activated in a rain condition, or when the door or the trunk lid is not properly closed, the controller automatically activates the warning light system, wherein both directional signal lights blink simultaneously. When the directional signal lights are used for indication of direction, the directional signal lights are automatically switched from the warning mode to a direction indication mode where only the designated directional signal light blinks. Once the direction indication operation is completed, the directional signal lights automatically go back to the warning mode to blink simultaneously.

Abstract: A 3C frame manufacturing method including materials feeding, punching, coating, lapping, and curing processes provides a top quality technical production features of the present invention while avoiding problems of paint peeling or corrosion found with the conventional welding process; and allowing automated production, optimal use of human resources, significantly reduction of manual and labor costs, and shortening of production flow.

Abstract: A method for thermal processing a semiconductor wafer is disclosed. A rapid thermal processing (RTP) chamber encompasses a heating means, a rotation means, and a cooling system for cooling walls of said RTP chamber. A semiconductor wafer is loaded into the RTP chamber just being cooling down to a first temperature by using the cooling system. When loading the semiconductor wafer, it has a temperature that is lower than the first temperature, thereby causing a tendency of particle deposition from the walls of the RTP chamber onto the semiconductor wafer. The semiconductor wafer is pre-heated to a second temperature higher than the first temperature with the heating means, thereby eliminating the tendency of particle deposition. Upon reaching the second temperature, the rotation means is activated to start to rotate the semiconductor wafer, while the semiconductor wafer being ramped up to a third temperature.

Abstract: The present invention discloses a frame structure for mounting a liquid crystal display panel, and a frame with such structure is combined by a bonding technique, so that the assembled frame can provide enhanced bonding sides for supporting and mounting an LCD panel. The frame structure of this sort can avoid wasting raw materials and lower material costs significantly.

Abstract: A method for thermal processing a semiconductor wafer is disclosed. A rapid thermal processing (RTP) chamber encompasses a heating means, a rotation means, and a cooling system for cooling walls of said RTP chamber. A semiconductor wafer is loaded into the RTP chamber just being cooling down to a first temperature by using the cooling system. When loading the semiconductor wafer, it has a temperature that is lower than the first temperature, thereby causing a tendency of particle deposition from the walls of the RTP chamber onto the semiconductor wafer. The semiconductor wafer is pre-heated to a second temperature higher than the first temperature with the heating means, thereby eliminating the tendency of particle deposition. Upon reaching the second temperature, the rotation means is activated to start to rotate the semiconductor wafer, while the semiconductor wafer being ramped up to a third temperature.

Abstract: A system for virtual capital operation over a network such as the internet includes a platform for a transaction between a first user and a second user of the system, a data processor for processing the flow of virtual currency occurred at the transaction between the first user and second user, and a trust company to allow real currency to be stored therein or withdrew therefrom in response to the flow of real currency occurred at the transaction, wherein the data processor generates an amount of virtual currency in response to an amount of real currency entrusted to the trust company.

Abstract: A wafer is provided, and a circuit layout including a first piezoresistive device layout and a second piezoresistive device layout is formed on the front surface of the wafer. The first piezoresistive device layout includes a plurality of first nodes and the second piezoresistive device layout includes a plurality of second nodes. Subsequently, a dielectric layer is formed on the circuit layout, and the dielectric layer is patterned to expose either the first nodes or the second nodes. Thereafter, a connection pattern is formed on the dielectric layer to electrically connect the first nodes or the second nodes.

Abstract: A method for thermal processing a semiconductor wafer is disclosed. A rapid thermal processing (RTP) chamber encompasses a heating means, a rotation means, and a cooling system for cooling walls of said RTP chamber. A semiconductor wafer is loaded into the RTP chamber just being cooling down to a first temperature by using the cooling system. When loading the semiconductor wafer, it has a temperature that is lower than the first temperature, thereby causing a tendency of particle deposition from the walls of the RTP chamber onto the semiconductor wafer. The semiconductor wafer is pre-heated to a second temperature higher than the first temperature with the heating means, thereby eliminating the tendency of particle deposition. Upon reaching the second temperature, the rotation means is activated to start to rotate the semiconductor wafer, while the semiconductor wafer being ramped up to a third temperature.

Abstract: A method for thermal processing a semiconductor wafer is disclosed. A rapid thermal processing (RTP) chamber encompasses a heating means, a rotation means, and a cooling system for cooling walls of said RTP chamber. A semiconductor wafer is loaded into the RTP chamber just being cooling down to a first temperature by using the cooling system. When loading the semiconductor wafer, it has a temperature that is lower than the first temperature, thereby causing a tendency of particle deposition from the walls of the RTP chamber onto the semiconductor wafer. The semiconductor wafer is pre-heated to a second temperature higher than the first temperature with the heating means, thereby eliminating the tendency of particle deposition. Upon reaching the second temperature, the rotation means is activated to start to rotate the semiconductor wafer, while the semiconductor wafer being ramped up to a third temperature.

Abstract: An attaching apparatus for attaching an optical film to a workpiece includes a workbench (11) for supporting the workpiece and the optical film; a roller device (40) for rolling the optical film into attachment with the workpiece. Either or both the roller device and the workbench are movable relative to the other. Aligning the optical film and turning the workpiece manually can be reduced. The attaching apparatus reduces manual labor and costs, and increases efficiency.