Abstract: An optical wiring substrate provides a slab optical waveguide having a refractive index different from a refractive index of other surrounding portions and a planar convex lens being provided continuously to a tip portion of an optical path of an optical wave guide including a core and cladding and formed on a substrate. The optical path of light passing through the planar convex lens is converted approximately by 90° with a mirror. The light reflected with the mirror is made as parallel light rays by use of a cylindrical lens.

Abstract: A core layer contains photonic crystals formed by ferroelectric members made of a ferroelectric substance and periodically disposed along a one-dimensional direction or two-dimensional directions. Electrodes apply an electric field to the core layer. An optical function device is provided which can be made compact and can set a wavelength at high speed.

Abstract: A reinforcing frame construction having ROPS and a rear axle casing projecting to the right and left from a tractor vehicle body. The construction includes a pair of right and left loader attaching members for detachably attaching a front loader, the loader attaching members being connected to an intermediate portion of the vehicle body and projecting therefrom to the lateral sides, a pair of right and left rear supporting members provided in the rear axle casing for supporting right and left legs of the ROPS, and a pair of right and left connecting members to which a rear implement is connected, the connecting members being fitted into the rear axle casing and being detachably connected to the rear supporting members. Extension portions of the connecting members extending forwardly therefrom are detachably connected to the loader attaching members.

Abstract: The optical device comprises a first substrate 10 having a control circuit formed on; optical waveguide layer 40 formed above the first substrate and having a refractive index changed by electro-optic effect; and second substrates 14a, 14b having prism electrodes 18 for applying voltages to the optical waveguide layer. The control circuit and the prism electrodes are electrically connected to each other via columnar conductors 20. Even in a case where thermal expansion coefficients of the control substrate and of the light deflection substrates are very different from each other, the pins are flexed corresponding to eternal forces, whereby junction is protected from being damaged in the joining processing. Thus, the optical switch can be highly reliable.

Abstract: A location management method manages the location of a member which move around carrying a GPS-equipped portable telephone. The method includes inquiring of the GPS-equipped portable telephone about its current location, making the GPS-equipped portable telephone return positional information of the current location measured by the GPS function, managing the returned positional information of the current location in a file, searching a map database based on the positional information of the current location, and preparing and displaying map data linked with the positional information of the current location.

Abstract: A prism pair is employed as an optical deflecting element. The prism pair is constructed by a slab waveguide, and first and second upper electrodes and first and second lower electrodes arranged on and under the slab waveguide. These electrodes are shaped into a wedge shape (e.g., triangular shape), and change the refractive index of a part of the slab waveguide by utilizing the electrooptic effect to change the propagation direction of light.

Abstract: A TLB includes a tractor body, a reinforcing frame disposed around the tractor body and supported by the tractor body, a pair of right and left side frames for pivotably supporting a pair of right and left booms having a loader bucket attached to distal ends thereof, and braces for connecting the side frames to the tractor body. The side frames are connected to the reinforcing frames by at least two connecting bosses attached to the side frames, at least two connecting bosses attached to the reinforcing frame, and pins inserted through bores of the connected bosses and bores of the connecting bosses. Rear positions of the reinforcing frame are attached to cylindrical portions of rear axle cases by holders rotatable about an axis of the cylindrical portions, and mounting members for connecting the holders to the reinforcing frame, respectively.

Abstract: An optical wiring substrate provides a slab optical waveguide having a refractive index different from a refractive index of other surrounding portions and a planar convex lens being provided continuously to a tip portion of an optical path of an optical wave guide including a core and cladding and formed on a substrate. The optical path of light passing through the planar convex lens is converted approximately by 90° with a mirror. The light reflected with the mirror is made as parallel light rays by use of a cylindrical lens.

Abstract: A prism pair is employed as an optical deflecting element. The prism pair is constructed by a slab waveguide, and first and second upper electrodes and first and second lower electrodes arranged on and under the slab waveguide. These electrodes are shaped into a wedge shape (e.g., triangular shape), and change the refractive index of a part of the slab waveguide by utilizing the electrooptic effect to change the propagation direction of light.

Abstract: The present invention relates to a semiconductor device in which inner leads of a lead frame are electrically connected to a semiconductor chip, a method for producing thereof and a lead frame used therein. The object of the present invention is to improve a strength of the lead frame and a heat release efficiency in a small-size multi-pin type semiconductor device. In the inner lead of the lead frame, a thin plate portion is formed. The thin plate portions are secured on a heat spreader. A semiconductor chip is mounted on the heat spreader. The semiconductor chip is bonded to the thin plate portions of the inner leads through wires.

Abstract: A semiconductor device includes a board having a lower surface, a container part created in the board, external-connection nodes provided on the lower surface of the board, a supporting member provided inside the container part and secured by the board, a semiconductor chip secured on the supporting member and electrically connected with the external-connection nodes, and a sealing resin fully filling the container part so as to completely cover the semiconductor chip.

Abstract: A thin semiconductor device in which a strength of a lead frame and a heat dissipation efficiency can be improved. The semiconductor device has a semiconductor chip, a lead having an inner lead and an a outer lead continuing to the inner lead, said inner lead having a thin plate portion thinner than the other portion therof, said thin plate portion being electrically connected to said semiconductor chip through a wire and said outer lead serving as an outer connecting terminal, and a sealing resin sealing said semiconductor chip and at least a part of said lead, wherin said inner lead of said lead is positioned on said semiconductor chip.

Abstract: A joint structure for jointing a small-diameter thin metal tube and a pressure rubber hose, comprising: a joint portion having a joint end portion of a metal tube, which is given a double wall by fitting a short inner tube therein, and having a plurality of annular comb-tooth faces formed at least in the metal tube at the double wall in the vicinity of the joint end portion; and a bottomed cylindrical socket member having its bottom wall portion retained on the side of the metal tube and caulking and fixing the overlapping portions of the metal tube and the pressure rubber being fitted on the joint portion.

Abstract: A substituted cyclic amine compound represented by the following general formula (1) ##STR1## wherein each of R.sup.1 to R.sup.5 represents a hydrogen atom, a halogen atom, a lower alkyl group, a lower alkoxy group or the like, A represents a carbonyl group or a sulfonyl group, B represents a methine moiety or a nitrogen atom, D represents a methine moiety, a nitrogen atom or .dbd.N(.fwdarw.O)-- and n is an integer of 2 to 3; and synthetic methods thereof. The inventive compound is useful in preventing and treating circulatory organ-related diseases such as hypertension, ischemic heart disease, cerebrovascular disease, peripheral circulatory disease and the like.

Abstract: A connecting joint for connection to a plastic tube comprising: a main body having proximal and distal ends with a flow passage and chamber between the ends in communication with each other. An engaging wall extends inwardly at the distal end defining a small diameter entry into the chamber, a support provided with a guard wall and resilient arms extending from the guard wall with projection walls on the terminal ends of the resilient arms having outwardly extending inclined surfaces and inwardly extending pawl walls is located in the chamber and a collar is secured in the chamber by the engaging walls. When the tube is inserted into the chamber, one of the guard wall, an annular friction ring or a seal located in the chamber engages the tube and as the tube is withdrawn the member engaging the tube moves the outwardly extending inclined surfaces into engagement with the collar thereby urging the pawls into engagement with the tube.

Abstract: Two semiconductor chips are coupled to outer leads by means of tape leads so that the chips are spaced apart from each other. A space between the chips is filled with a mold resin.

Abstract: A semiconductor device includes lead frames (21) respectively having first main surfaces and second main surfaces opposite to each other, bonding being able to be performed on the first and second main surfaces, a first semiconductor chip (22) arranged on first main surface sides of the lead frames, first tape leads (23) electrically connecting the first main surfaces of the lead frames to the first semiconductor chip, a second semiconductor chip (24) arranged on second main surface sides of the lead frames, and second tape leads (25) electrically connecting the second main surfaces of the lead frames to the second semiconductor.

Abstract: A process of manufacturing semiconductor device accommodated in a package including a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members is of spherical form, such that the terminal members roll substantially freely when placed on a flat surface, and of a substantially identical diameter.

Abstract: A semiconductor device accommodated in a package includes a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members is of spherical form, and of a substantially identical diameter.

Abstract: In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.