Abstract: A trackball device comprising a housing having a circular opening formed in a top wall thereof, a ball received in the housing and partially projecting through the circular opening, a pair of rotatable members arranged orthogonally to each other and rotatable in accordance with rotation of the ball, detectors capable of detecting the amounts of rotation of the respective rotatable members, and elastic members arranged in the vicinity of the edge of the circular opening and capable of suppressing vibration of the ball.

Abstract: In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.

Abstract: A magnetic rotary encoder which is reduced in overall size and production cost and wherein little torsional force around an axis of a rotary shaft is applied to a bearing for the rotary shaft from a force from an object member for detection and the detection sensitivity does not fluctuate even if the rotary shaft is yielded. The rotary shaft includes a fixed shaft fixedly supported at least at one portion thereof and having an inner race of the bearing secured to an outer periphery thereof, a cylindrical member having an outer race of the bearing secured to an inner periphery thereof, and a magnetic member provided on an outer periphery of the cylindrical member and having magnetic poles formed thereon. A magnetic sensor for detecting a magnetic flux from the magnetic member is supported on the fixed shaft by means of a mounting plate, and a detecting member is mounted in sliding contact with the cylindrical member and rotates, when it is rotated, the magnetic member around the axis of the rotary shaft.

Abstract: A resin-molded semiconductor device applying an insulation plate unit mounted on a metal die-stage of a metal lead-frame. On the insulating plate unit, an integrated circuit semiconductor chips or a plurality of integrated circuit semiconductor chips are mounted and a plurality of relay-pads for relaying wire bonding connection between the semiconductor chip or chips and inner leads of the lead-frame are formed and arranged so as to correspond to the inner-leads, for electrically insulating the semiconductor chip or chips and the relay-pads from the metal die-stage.

Abstract: Lead frame for mounting a semiconductor chip and improving the packing density of devices such as a plastic chip carrier type IC is disclosed. A portion of inner leads, located parallel to the chip stage and the edge of a molded case is made as thin as possible and held by inner lead supporting bars to tie bars until the molding process is finished. After molding process is finished, these bars supporting the leads and stage are cut away. Packing density is improved an amount ranging from 20% to 30%.

Abstract: An image display apparatus having an A/D converter which samples a television signal a plurality of times in each horizontal effective display period and converts the sampled signal into digital data, and a gradation signal generator combines gradation signals produced in a plurality of horizontal effective display periods according to the digital data to produce a new gradation signal. An image display panel is driven for display according to the new gradation signal.

Abstract: PLCC (Plastic Leaded Chip Carrier) for a LSI having protuberances on the bottom along its lateral side, is provided with interconnectors between leg portions of adjacent protuberances. Each interconnector is a swelling from the bottom surface of the main body of PLCC to fill the gap, i.e. a channel, between the protuberances. The height of the filling, namely the height of the interconnector, is lower than that of prior art protuberance to leave some space. This space, a channel, serves as a duct for solvent to flow therein smoothly to and from the narrow gap between the soldered lead and the top of the protuberance and is located adjoining this narrow gap. Therefore, the undesirably remaining flux in this narrow gap is perfectly removed by this smooth flow of the solvent. The leg portion of the protuberance is strengthened by the interconnector so that the occurrence of a crack of the protuberance when the moled PLCC is ejected from the molding cavities is considerably reduced.

Abstract: A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side surfaces of the main body of a resin-molded package, which grooves correspond to a plurality of external leads. The external leads are folded, the tips of the external leads are positioned in the grooves, and the middle portions of the external leads are located above the main surface of the package so that a predetermined standoff distance is maintained between the middle portions of the external leads and the package.

Abstract: In a device wherein electric components and rotary knobs for operating them are disposed in a case with the rotary knobs extending partially through respective slots formed in the upper surface of the case, the improvement comprising the fact that the rotary knobs are arranged in two rows and staggered with a barrier formed between the two rows.

Abstract: A pile-surfaced textile structure comprising a composite characterized in that a low-melting point thermoplastic resin material is fused to a backing material of an air-permeable textile structure which is not softened and thus remains substantially intact upon heating at a given temperature, and in that piles are formed from said resin material in the fibrous form.