Abstract: In two inverters included in a latch in a memory cell, the source or drain of a PMOS load transistor connected to a memory node is cut off, and the source or drain of an NMOS drive transistor connected to another memory node is cut off, whereby internal data is fixed or permanently stored in the memory cell while ensuring a resistance to damage to the gate of the transistor and without impairing the regularity of the layout.

Abstract: A power feeding device includes a network analyzer that measures measurement of S-parameters of a resonant system that includes an electromagnetic induction coil and a resonance coil, and an electronic control unit (ECU). The ECU adjusts the resonant frequency of the resonance coils to the power supply frequency in accordance with the measured S-parameters. Specifically, the ECU controls variable capacitors to adjust the resonant frequency of resonance coils and, after adjusting the resonant frequency, controls an impedance matching device to match the input impedance of the resonant system with the impedance on a high-frequency power supply device side viewed from the input port of the resonant system.

Abstract: A memory cell (100) includes a read circuit (30) whose output wiring is a read bit line (RBIT) and which has a switching transistor (31), a reset transistor (32), and an output wiring driving transistor (33). The switching transistor (31) connects a data holding node (MD) of a storage circuit (10) and a control line (DR) in accordance with a control signal on a read word line (/RWL0). The reset transistor (32) resets the control line (DR) in accordance with a reset control signal (RST). The output wiring driving transistor (33) has a gate connected to the control line (DR), a drain connected to the read bit line (RBIT), and a source connected to a ground power supply.

Abstract: A power supply control circuit which can cut off a power supply independently is provided for each column in a memory cell array. The power supply control circuit is controlled by a circuit which is provided for each column and determines whether or not it is necessary to hold information, whereby a power supply for a memory cell which does not need to hold information is cut off.

Abstract: In a semiconductor memory device, an update data control circuit is provided, which selectively couples a physical address input data line or an effective address input data line to a common input data line coupled to a physical address cell that stores a physical address page number. A control terminal of an update circuit of the physical address cell is coupled to a page size cell that stores page size information via an update control circuit, to control a write port of the physical address cell with the page size cell.

Abstract: In two inverters included in a latch in a memory cell, the source or drain of a PMOS load transistor connected to a memory node is cut off, and the source or drain of an NMOS drive transistor connected to another memory node is cut off, whereby internal data is fixed or permanently stored in the memory cell while ensuring a resistance to damage to the gate of the transistor and without impairing the regularity of the layout.

Abstract: The abnormality detection system is provided for detecting an abnormality of an object. The abnormality detection system includes a high-frequency power source, a primary coil, a secondary coil and a controller. The high-frequency power source supplies power. The primary coil receives the power supplied from the high-frequency power source. The secondary coil is mounted to the object in noncontact with the primary coil for receiving power supplied from the primary coil. The controller is operable to detect the power received by the secondary coil and also to determine whether or not an abnormality is present in the object based on the detected power.

Abstract: A voltage of a bit line connected to a memory cell is stepped up to a power supply voltage by a precharge circuit. Before data is read from the memory cell, the voltage of the bit line is stepped down to a voltage level lower than the power supply voltage by a step-down circuit. A precharge switching element controls a connection between a high-potential-side power supply and the precharge circuit and a connection between a low-potential-side power supply and the precharge circuit. A power supply connecting circuit is provided between the precharge switching element and the high-potential-side power supply. A ground connecting circuit is provided between a connecting point at which the precharge switching element is connected to the power supply connecting circuit and the low-potential-side power supply.

Abstract: A dummy memory cell for detection of write completion timing is provided as a replica of a memory cell. When assisting a write operation by power supply control and substrate potential control of the memory cell, the timing of ending the write assist operation is determined by a voltage control circuit based on information about the dummy memory cell. For example, the voltage control circuit performs, in a data write operation in the memory cell, the write assist operation of decreasing the voltage of a source power supply allocated to P-channel MOS load transistors using a pull-down transistor. Thereafter, at the time when completion of the data write operation in the dummy memory cell is detected, the voltage control circuit ends the write assist operation and restores the voltage of the source power supply to the original level using a pull-up transistor.

Abstract: A voltage of a bit line connected to a memory cell is stepped up up to a power supply voltage by a precharge circuit. Before data is read from the memory cell, the voltage of the bit line is stepped down to a voltage level lower than the power supply voltage by a step-down circuit. A precharge switching element controls a connection between a high-potential-side power supply and the precharge circuit and a connection between a low-potential-side power supply and the precharge circuit. A power supply connecting circuit is provided between the precharge switching element and the high-potential-side power supply. A ground connecting circuit is provided between a connecting point at which the precharge switching element is connected to the power supply connecting circuit and the low-potential-side power supply.

Abstract: A memory cell (100) includes a read circuit (30) whose output wiring is a read bit line (RBIT) and which has a switching transistor (31), a reset transistor (32), and an output wiring driving transistor (33). The switching transistor (31) connects a data holding node (MD) of a storage circuit (10) and a control line (DR) in accordance with a control signal on a read word line (/RWL0). The reset transistor (32) resets the control line (DR) in accordance with a reset control signal (RST). The output wiring driving transistor (33) has a gate connected to the control line (DR), a drain connected to the read bit line (RBIT), and a source connected to a ground power supply.

Abstract: A precharge circuit steps up a voltage of a bit line connected to a memory cell to a power supply voltage. A plurality of step-down circuits step down the voltage of the bit line to a voltage level lower than the power supply voltage before data is read from the memory cell. The plurality of step-down circuits are connected to the bit line, and the plurality of step-down circuits are controlled by step-down control signals different to each other.

Abstract: A bit line potential monitor circuit is provided in a bit line, and a step-down circuit of the bit line is controlled base on information from the monitor circuit. As a result, the bit line is easily stepped down to an optimal potential level in accordance with a potential and a load capacity thereof without being affected by variability in devices or operation conditions.

Abstract: In a memory cell having a first and a second load transistor, a first and a second drive transistor, and a first and a second access transistor, a third access transistor provided between a first bit line and a first memory node and having a gate terminal connected to a first column line and a fourth access transistor provided between a second bit line and a second memory node and having a gate terminal connected to a second column line, are additionally provided.

Abstract: A bit line potential monitor circuit is provided in a bit line, and a step-down circuit of the bit line is controlled base on information from the monitor circuit. As a result, the bit line is easily stepped down to an optimal potential level in accordance with a potential and a load capacity thereof without being affected by variability in devices or operation conditions.

Abstract: A voltage of a bit line connected to a memory cell is stepped up up to a power supply voltage by a precharge circuit. Before data is read from the memory cell, the voltage of the bit line is stepped down to a voltage level lower than the power supply voltage by a step-down circuit. A precharge switching element controls a connection between a high-potential-side power supply and the precharge circuit and a connection between a low-potential-side power supply and the precharge circuit. A power supply connecting circuit is provided between the precharge switching element and the high-potential-side power supply. A ground connecting circuit is provided between a connecting point at which the precharge switching element is connected to the power supply connecting circuit and the low-potential-side power supply.

Abstract: A precharge circuit steps up a voltage of a bit line connected to a memory cell to a power supply voltage. A plurality of step-down circuits step down the voltage of the bit line to a voltage level lower than the power supply voltage before data is read from the memory cell. The plurality of step-down circuits are connected to the bit line, and the plurality of step-down circuits are controlled by step-down control signals different to each other.

Abstract: In a memory cell having a first and a second load transistor, a first and a second drive transistor, and a first and a second access transistor, a third access transistor provided between a first bit line and a first memory node and having a gate terminal connected to a first column line and a fourth access transistor provided between a second bit line and a second memory node and having a gate terminal connected to a second column line, are additionally provided.

Abstract: An FM receiver which can be used by being switched between stereophonic and monophonic, and comprises detecting unit for detecting a received signal, two routes over which a detected signal is transmitted to an output buffer, and a switching unit for selecting either one of the two routes. The two routes consist of a route passing through a stereophonic demodulator unit and a route bypassing the stereophonic demodulator unit; and the switching unit selects either one of the two routes based on a control signal indicating the selection of either one of stereophonic and monophonic, and, when the route bypassing the stereophonic demodulator unit is selected, turns off power supply to the stereophonic demodulator unit based on the above control signal.

Abstract: A dummy memory cell for detection of write completion timing is provided as a replica of a memory cell. When assisting a write operation by power supply control and substrate potential control of the memory cell, the timing of ending the write assist operation is determined by a voltage control circuit based on information about the dummy memory cell. For example, the voltage control circuit performs, in a data write operation in the memory cell, the write assist operation of decreasing the voltage of a source power supply allocated to P-channel MOS load transistors using a pull-down transistor. Thereafter, at the time when completion of the data write operation in the dummy memory cell is detected, the voltage control circuit ends the write assist operation and restores the voltage of the source power supply to the original level using a pull-up transistor.