Abstract: A circuit board H10 according to the present invention is a circuit board H10 in which an electric circuit H6 including a wiring section H6a and a pad section H6b is provided in the surface of an insulating base substrate H1. The electric circuit H6 is configured such that a conductor H5 is embedded in a circuit recess H3 formed in the surface of the insulating base substrate H1, and the surface roughness of the conductor H5 is different in the wiring section H6a and the pad section H6b of the electric circuit H6. In this case, it is preferable that the surface roughness of the conductor H5 in the pad section H6b is greater than the surface roughness of the conductor H5 in the wiring section H6a.

Abstract: A lens-fitted film unit includes: a main body; a photographic lens provided in the main body, having an aperture value; an aperture provided in the main body; a shutter provided in the main body, having a shutter speed; a photographic film loaded in the main body, having image frames each including an unexposed portion and a pre-exposed portion on which a latent image has been formed; and a masking member for masking the pre-exposed portion of the photographic film when a photographing operation is conducted. The latent image has been formed on the photographic film with a same exposure amount as that obtained when an object to be photographed having a brightness of not less than 10 and not more than 12.5 in terms of light values in which a photographic film whose ISO sensitivity is 100, is exposed to light with an aperture value of the photographic lens set by the aperture and with the shutter speed of the shutter.