Abstract: The invention relates to an arrangement for the coating of substrates, which comprises an evaporation source and a vapor barrier between the evaporation source and the substrate. The vapor barrier is maintained at a temperature which is at least equal to or above the vaporization temperature of the material to be vaporized. The vapor barrier is implemented as a quartz valve, which includes a spherical closure part connected with a movable rod. In a first position this spherical closure part closes a vapor conducting tube, which is connected with the evaporation source, and, in a second position, the spherical closure part abuts a spherical calotte which seals off a quartz tube.

Abstract: A method and system for operating a motor vehicle is described. In one example, spring rates for suspension springs and damping rates for shock absorbers are adjusted in response to vertical acceleration, longitudinal angular acceleration, and lateral angular acceleration of a vehicle body in the absence of accelerometers. The system and method may improve vehicle driving dynamics and lower system cost as compared to other systems.

Abstract: An apparatus for coating an areal substrate, for example a rectangular plate comprises a vaporizer source and a distributor system for the supply of vaporized material onto the substrate. The distributor system comprises a line source, with this line source and the substrate is movable relative to one another. The apparatus serves preferably for the production of flat screens with organic light-emitting diodes.

Abstract: A method of cleaning a patterning device, the patterning device having at least organic coating material (OLED material) deposited thereon, where the method includes the step of providing a cleaning plasma for removing the coating material from the patterning device by means of a plasma etching process. During the step of removing the coating material from the patterning device, the temperature of the patterning device does not exceed a critical temperature causing damage to the patterning device, while maintaining a plasma etching rate of at least 0.2 ?m/min. In order to generate a pulsed cleaning plasma, pulsed energy is provided. The method can be carried out in a direct plasma etching process or in a remote plasma etching process. Different etching processes may be combined or carried out subsequently.

Abstract: An evaporator for applying vapor to a substrate at a coating rate is described. The evaporator includes an evaporator tube having a distribution pipe with at least one nozzle outlet, wherein the evaporator tube includes a pressure measurement device, the pressure measurement device comprising an optical diaphragm gauge.

Abstract: The present invention refers to a method as well as an apparatus for depositing a layer at a substrate, the layer containing at least two components co-deposited by at least two evaporation sources, wherein the mixture of the components regarding the content of the components is set by tilting the evaporation sources to predetermined angle and/or by positioning the evaporation sources at a predetermined distance with respect to the substrate and/or wherein evaporation plumes of the evaporation sources are arranged such that the maxima of the evaporation plumes are separated locally with respect to the substrate.

Abstract: The invention relates to an arrangement for the vaporization of materials, and specifically of organic materials, such as are utilized for example in the production of OLEDs. A heating element and a device for transporting a carrier for a layer to be vaporized are herein provided. The carrier with the layer to be vaporized is guided over the heating element where the layer is vaporized and deposited on a substrate.

Abstract: A method of cleaning a patterning device, the patterning device having at least organic coating material (OLED material) deposited thereon, comprises the step of providing a cleaning plasma for removing the coating material from the patterning device by means of a plasma etching process. During the step of removing the coating material from the patterning device, the temperature of the patterning device does not exceed a critical temperature causing damage to the patterning device, while maintaining a plasma etching rate of at least 0.2 ?m/min. In order to generate a pulsed cleaning plasma, pulsed energy is provided. The method can be carried out in a direct plasma etching process or in a remote plasma etching process. Different etching processes may be combined or carried out subsequently.

Abstract: A coating system or encapsulation module 1 is coupled with a substrate handling module 2, wherein substrates 3a to be encapsulated and substrates 3b that already have an encapsulation layer stack deposited thereon are handled in a nitrogen atmosphere. The substrate handling module 2 comprises a magazine 4 for storing substrates 3a to be coated and encapsulated substrates 3b. A handling device 5 unloads the substrates 3a to be coated from the magazine 4 and loads encapsulated substrates 3b into the magazine 4. The encapsulation module 1 has a first ink-jet coating chamber 10a. In said first ink-jet coating chamber 10a a photoresist layer is deposited on the substrate 3a by means of an ink-jet printing method. The ink-jet printing method is carried out in an atmosphere of about 10 mbar. Then the substrate 3a is transported into a first CVD (chemical vapor deposition) coating chamber 11a. In the CVD coating chamber 11a a first silicon nitride layer is deposited on the substrate 3a, i.e.

Abstract: The present invention concerns a thin-film encapsulation structure for electronic devices with organic substances, especially OLEDs or other organic optoelectronic devices as well as corresponding components and a process for the production with a primary, inorganic barrier layer (5), which is directly arranged on the device or the surface to be encapsulated; a planarization layer (6) arranged on the primary, inorganic barrier layer, the thickness of said planarization layer selected such that it is thicker than the simple value of the distance between highest peak and deepest valley of the surface of the primary barrier layer or the surface of the device under the primary barrier layer or the surface to be encapsulated, as well as a secondary barrier layer (14) arranged on the planarization layer.

Abstract: A sputter coating device comprises a vacuum coating chamber, substrates arranged within the coating chamber, a cylindrical hollow cathode including a rotatable target rotating around a central axis A, and a magnet assembly which is arranged within the hollow cathode such that confining plasma zones are generated in an area above the surface of the target. At least one substrate is to be coated. The substrate has an OLED layer deposited on the substrate surface. An intermediate area is arranged between the surface of the target and a shield that shields particles sputtered from the surface of the target that move in a direction toward the shield. On each side of the shield, passages are provided between the intermediate area and coating area. Through the passage, only sputtered particles that have been scattered in the intermediate area may enter the coating area via the passage, and impinge the OLED layer.

Abstract: The invention relates to a clamping apparatus comprising a base body and two clamping straps which are arranged opposite one another on one side of the base body, are made flexible at least sectionally, extend convexly to one another in a non-clamping state of the clamping apparatus and can be brought into engagement by being pressed together in order thereby to fasten an object located between the clamping straps and the base body to the clamping apparatus of a clamping fit.

Abstract: A processing device for producing a layer system including at least one layer of an organic light emitting semiconductor material (OLED), comprises (1) a configuration of one or more treatment stations for processing the substrate in the treatment stations and (2) a first encapsulation module for providing an encapsulation element on the layer system deposited on the substrate. Furthermore, the processing device comprises at least a second encapsulation module, and is configured to provide the encapsulation element on the coated substrate in the first or second encapsulation module alternatively. By providing two encapsulation modules, the second module may be cleaned during a continuous operation of the processing device, while the first encapsulation module is generating an encapsulation on a coated substrate. In this way, a continuous operation of a coating device for depositing an OLED coating and an encapsulation element on the OLED coating is provided.

Abstract: The present invention concerns a thin-film encapsulation structure for electronic devices with organic substances, especially OLEDs or other organic optoelectronic devices as well as corresponding components and a process for the production with a primary, inorganic barrier layer (5), which is directly arranged on the device or the surface to be encapsulated; a planarization layer (6) arranged on the primary, inorganic barrier layer, the thickness of said planarization layer selected such that it is thicker than the simple value of the distance between highest peak and deepest valley of the surface of the primary barrier layer or the surface of the device under the primary barrier layer or the surface to be encapsulated, as well as a secondary barrier layer (14) arranged on the planarization layer.

Abstract: An object of the invention is to determine the position of a transport medium in a printing machine in a simple manner. Provided is a method for the control of a transport medium for a printing machine, whereby at least one mark is applied to the transport medium and whereby a single sensor detects a seam of the transport medium, as well as the mark. Also provided is a sensor device for the control of a transport medium for a printing machine, said device comprising a sensor for the detection of a seam of a transport medium and at least one mark on said transport medium.

Abstract: The invention relates to an evaporator arrangement with a crucible, wherein the crucible is divided into at least two zones, each of which is heated to different temperatures. The first zone is a melt-down zone and the second zone the evaporation zone proper. The evaporator arrangement is preferably for the evaporation of metals. If metals are evaporated, a metal wire is preferably guided into the melt-down zone. However, metal alloys can also be evaporated thereby that one or several metal wires comprised of different materials are guided into the melt-down zone. Between the melt-down zone and the evaporator zone a heating zone may be provided.

Abstract: A vapor deposition device for the vapor deposition of a substrate, and specifically particular of a substrate comprising heat-sensitive substances, for example OLEDs. To keep heat away from these substances, the vapor deposition device includes an evaporator tube with a special nozzle bar. This nozzle bar, which comprises several linearly arranged openings, projects with respect to the evaporator tube in the direction toward the substrate to be coated.

Abstract: An evaporator device for coating substrates, in particular for applying an aluminum layer of OLEDs. To attain high evaporator tube temperatures, such as are required for example for the vaporization of materials with low vapor pressure, the heating system is placed into the interior of the evaporator tube. The thermal losses are thereby minimized and higher tube temperatures are possible at comparably coupled-in heating power.

Abstract: Aspects of the present invention concern a device and a process for continuous production of substrates provided with organic electroluminescent materials (OLED), especially OLED displays, screens, panels or other lighting elements, in which the device has a vacuum space and a transport device for transporting the substrates to be coated, which is at least partially arranged along the vacuum space and comprises carriers for the substrates, with the transport device comprising at least one endless loop for transport of the carriers and with the vacuum space being divided at least into two with a first part, in which is provided a first section of the transport device for transporting the carriers in a first direction (substrate-transport direction), and with a second part, in which is provided a second section of the transport device for transport of the carriers in a second direction (carrier-return-transport direction).

Abstract: The invention relates to an arrangement for the coating of substrates, which comprises an evaporation source and a vapor barrier between the evaporation source and the substrate. The vapor barrier is maintained at a temperature which is at least equal to or above the vaporization temperature of the material to be vaporized. The vapor barrier is implemented as a quartz valve, which includes a spherical closure part connected with a movable rod. In a first position this spherical closure part closes a vapor conducting tube, which is connected with the evaporation source, and, in a second position, the spherical closure part abuts a spherical calotte which seals off a quartz tube.