Abstract: An electrical power system includes an electrical machine having one or more windings and an AC-DC power electronics converter including a commutation cell having a power circuit and a gate driver circuit. The power circuit includes a plurality of power semiconductor switching elements and a capacitor. The gate driver circuit is electrically connected to and configured to provide switching signals to a gate terminal of each power semiconductor switching element. A peak rated power output of the electrical machine and the AC-DC power electronics converter is greater than 25 kW, a maximum efficiency of the AC-DC power electronics converter is greater than 97%, and a value of parameter ? is greater than or equal to 0.3 PV/s2, where ? is a product of a maximum switching frequency of the switching signals and a maximum rate of change of a source-drain voltage of the plurality of power semiconductor switching elements.

Abstract: A power electronics converter may include a converter commutation cell having a power circuit and a gate driver circuit. The power circuit includes at least one power semiconductor switching element and at least one capacitor. Each power semiconductor switching element is included in a power semiconductor prepackage, each prepackage including one or more power semiconductor switching elements embedded in a solid insulating material, each power semiconductor switching element having at least three terminals including a gate terminal. The gate driver circuit is electrically connected to and configured to provide switching signals to the gate terminal of each of the at least one power semiconductor switching element. A peak rated power output of the power electronics converter is greater than 25 kW and a value of a converter parameter ? is less than or equal to 5 pHm3.

Abstract: Disclosed is a method of manufacturing a power semiconductor component arrangement or a power semiconductor component housing. The method involves a sintering process in which the plurality of layer-shaped unsintered ceramic substrates are converted into a sintered ceramic single layer or multilayer substrate or into a sintered ceramic single layer or multilayer interconnect device. Also disclosed is a power semiconductor component arrangement or a power semiconductor component housing that can be manufactured using the above method. Further disclosed are the uses of the power semiconductor component arrangement or the power semiconductor component housing.

Abstract: A power electronics converter includes a carrier substrate, and a converter commutation cell including a power circuit. The power circuit includes at least one power semiconductor switching element. Each power semiconductor switching element is comprised in a power semiconductor prepackage. One or more terminals of each power semiconductor switching element are connected to at least one conductive layer of the carrier substrate at an electrical connection side of the respective power semiconductor prepackage. The electrical connection side is spaced apart from the carrier substrate by a gap. At least a portion of the gap is filled with an electrically insulating material with voids. A peak rated power output of the power electronics converter is greater than 25 kW, and a converter parameter, which is defined as a product of a dielectric strength of the electrically insulating material and a maximum void size, is less than or equal to 10,000 V.

Abstract: An arrangement for cooling at least one power module of a power converter is disclosed herein. The arrangement includes power semiconductor components. The power module is arranged in a drive flow of an engine in such a way that the drive flow flows around cooling ribs of the power module. The disclosure also relates to a power converter, (e.g., an inverter), including an arrangement of this kind and an aircraft, (e.g., an airplane), including a power converter of this kind.

Abstract: An electrical vertical take-off and landing (eVTOL) aircraft includes a plurality of electrical propulsion units (EPUs), each EPU having a propeller or a fan configured to be driven to rotate by an electrical motor arranged to receive electrical power from a respective power electronics converter. Each power electronics converter includes a converter commutation cell having a power circuit and a gate driver circuit, the power circuit including at least one power semiconductor switching element and at least one capacitor. At least one terminal of each power conducting switching element is connected to at least one electrically conductive layer of a multi-layer planar carrier substrate at an electrical connection side of a power semiconductor prepackage, which includes at least one electrically conductive layer located on an opposite side of the power semiconductor switching element to the electrical connection side of the power semiconductor prepackage.

Abstract: The invention relates to a device having: —a circuit carrier board (3) and—a conductor element (2), which is designed to transfer an electric current from and/or to the circuit carrier board (3), characterized by: —an electrically conductive, elastically deformable, contoured, plate-like connection element (1), which connects the circuit carrier plate (3) to the conductor element (2) and is designed to create a local, dynamic resilience, as a result of which a force transmission (F) from the conductor element (2) to the circuit carrier plate (3) can be reduced, and—a plate thickness of the connection element (1) of at least 2 cm. The invention also relates to a power converter (4) and an aircraft (6) having such a device.

Abstract: A power electronics converter includes a carrier substrate, and a converter commutation cell including a power circuit. The power circuit includes a power semiconductor switching element. The power semiconductor switching element is comprised in a power semiconductor prepackage. The power semiconductor prepackage includes a power semiconductor switching element embedded in a solid insulating material, and an electrical connection extending from a terminal of the power semiconductor switching element through the solid insulating material to an electrical connection side of the power semiconductor prepackage. The power electronics converter includes a heat sink arranged to remove heat from the power semiconductor prepackage. The power electronics converter includes a thermal interface layer arranged between the heat removal side of the power semiconductor prepackage and the heat sink.

Abstract: A power electronics converter includes a converter commutation cell having a power circuit and a gate driver circuit. The power circuit includes at least one power semiconductor switching element and at least one capacitor. Each power semiconductor switching element is included in a power semiconductor prepackage. The gate driver circuit is configured to provide switching signals to a gate terminal of each power semiconductor switching element, and a peak rated power output of the power electronics converter is greater than 25 kW and a value of a converter parameter ? is less than or equal to 150 fFs/W, where the converter parameter ? is a total rated capacitance of the at least one capacitor of the power circuit divided by a product of the peak rated power output of the power electronics converter and a maximum switching frequency of the switching signals.

Abstract: The disclosure relates to an arrangement with a power module including power semiconductor components. The arrangement further includes a component having a curved surface. The power module is arranged on the curved surface of the component and is non-positively detachably connected to the component. The disclosure also relates to a power converter with the arrangement and to a vehicle with a power converter.

Abstract: The invention relates to an arrangement for a power converter (12) comprising at least one power module (1) comprising power semiconductor components (5) and a cooler (10), wherein the cooler (10) has a curved surface and the power module (1) is arranged on the surface and is connected in a positive fit to the cooler (10). The invention also relates to an associated manufacturing method as well as to a power converter with said type of arrangement and to a vehicle with a power converter.

Abstract: The invention relates to a method for joining a power semiconductor component (1.1) to a heat pipe (2), wherein, during joining, the external pressure (p2) acting on the heat pipe (2) is changed proportionally to the internal pressure (p1) of the heat pipe (2), which internal pressure changes under heat during joining. The invention also relates to a device for carrying out the method, a power module, a converter and a vehicle.

Abstract: The invention specifies an arrangement having at least one electrical module (2) which is arranged on a heat sink (3). The arrangement has: —first deflection elements (4) which are formed in or on the electrical module (2), —second deflection elements (5) which are formed in or on the heat sink (3), and—at least one flexible, cable- or strip-like tensioning element (1), —which is arranged between the first and second deflection elements (4, 5) under tension (F) in such a way that the electrical module (2) is pressed onto the heat sink (3). A converter and an aircraft having an arrangement of this kind and also a method for producing an arrangement of this kind are likewise specified.

Abstract: A power semiconductor module, as well as a corresponding method of manufacture, are provided. The power semiconductor module has a plurality of power switches. A first subset of the power switches forms part of a first electrical current branch. A second subset of the power switches forms part of a second electrical current branch. Within the current branches, the associated power switches are arranged symmetrically with respect to the DC voltage contacts and are connected in such a way that a current density which is formed in the individual current paths which are respectively assigned to one of the power switches is at least substantially homogeneously distributed during the high frequency operation of the power semiconductor module and/or in the operation of the power switches with high voltage gradients.

Abstract: A device is provided for supplying electric power to electric and/electronic components of a power converter. The device includes at least one power module, at least one capacitor, at least one heat sink between the power module and the capacitor, a first DC conductor element having a first potential, and at least one additional, second DC conductor element having a second potential. The first and second DC conductor elements are configured to supply electric power to the power module and the capacitor. The first and second DC conductor elements extend coaxially to each other by the heat sink. The disclosure also relates to a power converter and an aircraft.

Abstract: Disclosed is a method of manufacturing a power semiconductor component arrangement or a power semiconductor component housing. The method involves a sintering process in which the plurality of layer-shaped unsintered ceramic substrates are converted into a sintered ceramic single layer or multilayer substrate or into a sintered ceramic single layer or multilayer interconnect device. Also disclosed is a power semiconductor component arrangement or a power semiconductor component housing that can be manufactured using the above method. Further disclosed are the uses of the power semiconductor component arrangement or the power semiconductor component housing.

Abstract: The invention specifies an arrangement having at least one electrical module (2) which is arranged on a heat sink (3). The arrangement has:—first deflection elements (4) which are formed in or on the electrical module (2),—second deflection elements which are formed in or on the heat sink (3), and—at least one flexible, cable- or strip-like tensioning element (1),—which is arranged between the first and second deflection elements (4, 5) under tension (F) in such a way that the electrical module (2) is pressed onto the heat sink (3). A converter and an aircraft having an arrangement of this kind and also a method for producing an arrangement of this kind are likewise specified.

Abstract: An arrangement for cooling at least one power module of a power converter is disclosed herein. The arrangement includes power semiconductor components. The power module is arranged in a drive flow of an engine in such a way that the drive flow flows around cooling ribs of the power module. The disclosure also relates to a power converter, (e.g., an inverter), including an arrangement of this kind and an aircraft, (e.g., an airplane), including a power converter of this kind.

Abstract: The disclosure specifies an arrangement including a circuit carrier board on which is mounted at least one electrical/electronic component. At least one heat pipe is formed in the circuit carrier board. The disclosure also specifies a power converter including the arrangement, and an aircraft including a power converter.

Abstract: An organic circuit carrier including an organic insulation layer and at least one metallization layer arranged on an upper side, a lower side, or the upper side and the lower side of the organic insulation layer is provided. Side surfaces of the at least one metallization layer are embodied in a convexly curved fashion. A circuit arrangement and a power converter including such an organic circuit carrier are also provided. A vehicle such as an aircraft, including such a power converter, is also provided.