Patents by Inventor Vincent C. Korthuis
Vincent C. Korthuis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240051292Abstract: In some examples, a fluidic die includes fluidic actuators, switches, and electrically conductive lines in an electrically conductive layer of the fluidic die. The electrically conductive lines electrically connect the switches to respective actuators. A first dimension of a first electrically conductive line is different from a second dimension of a second electrically conductive line to match a first resistance of the first electrically conductive line having a first length to a second resistance of the second electrically conductive line having a second length different from the first length.Type: ApplicationFiled: January 11, 2021Publication date: February 15, 2024Applicant: Hewlett-Packard Development Company, L.P.Inventors: Vincent C. KORTHUIS, Rogelio CICILI, Eric T. MARTIN, Kellie Susanne JENSEN, James R. PRZYBYLA
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Patent number: 11858269Abstract: According to examples, an apparatus may include a fluidic chamber, in which fluid is to be temporarily held. The apparatus may also include a heating component to generate heat to form a drive bubble in the fluid held in the fluidic chamber and a cavitation plate may be provided between the fluidic chamber and the heating component. The cavitation plate may be in communication with the fluidic chamber and may physically separate the fluidic chamber from the heating component to protect the heating component. In addition, a controller may determine a condition in the fluidic chamber based on an electrical signal received from the cavitation plate.Type: GrantFiled: June 17, 2019Date of Patent: January 2, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Eric Thomas Martin, Tsuyoshi Yamashita, Vincent C. Korthuis
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Publication number: 20230286262Abstract: A fluidic die includes fluid-transfer elements, and a temperature sensor to monitor a temperature on the fluidic die. The fluidic die includes a trickle-warming circuit to warm fluid transferrable by the fluid-transfer elements, and a pulse-warming circuit to warm the fluid. A warming control circuit selectively activates the trickle-warming and pulse-warming circuits.Type: ApplicationFiled: July 31, 2020Publication date: September 14, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Eric Thomas Martin, Garrett E. Clark, Jeremy Spencer, Vincent C. Korthuis, Rogelio Cicili
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Publication number: 20230230790Abstract: In example implementations, a printhead die is provided. The printhead die includes a substrate, a chamber layer formed on the substrate, a plurality of printing fluid ejection chambers coupled to opposite sides of the chamber layer and along a length of the chamber layer, and a top hat layer formed on the chamber layer and the plurality of printing fluid ejection chambers. The chamber layer includes a void to store printing fluid. The top hat layer includes an initial unsupported top hat layer portion over the void, wherein the initial unsupported top hat layer portion comprises a first end that is narrower than a second end.Type: ApplicationFiled: March 17, 2023Publication date: July 20, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Vincent C. Korthuis, Huyen Pham, Tsuyoshi Yamashita
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Patent number: 11648773Abstract: In example implementations, a printhead die is provided. The printhead die includes a substrate, a chamber layer formed on the substrate, a plurality of printing fluid ejection chambers coupled to opposite sides of the chamber layer and along a length of the chamber layer, and a top hat layer formed on the chamber layer and the plurality of printing fluid ejection chambers. The chamber layer includes a void to store printing fluid. The top hat layer includes an initial unsupported top hat layer portion over the void, wherein the initial unsupported top hat layer portion comprises a first end that is narrower than a second end.Type: GrantFiled: September 6, 2019Date of Patent: May 16, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Vincent C. Korthuis, Huyen Pham, Tsuyoshi Yamashita
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Patent number: 11390072Abstract: A fluidic die includes a number of actuators to eject fluid from the fluidic die. The number of actuators form a number of primitives. The fluidic die includes a plurality of delays within a column of the primitives, and a processing device to control the delays through which a number of activation pulses pass. The activation pulses activate each of the actuators associated with the primitives. The activation pulses are delayed between the primitives via at least one of the delays to reduce peak power demands of the fluidic die.Type: GrantFiled: July 12, 2017Date of Patent: July 19, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Scott A Linn, Eric Martin, Vincent C Korthuis, James Michael Gardner
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Patent number: 11383516Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes an array of firing subassemblies grouped into zones. Each firing subassembly includes 1) a firing chamber, 2) a fluid actuator disposed, and 3) a sensor plate. The fluidic die also includes a measurement device per zone to determine a state of a selected sensor plate. The fluidic die includes a selector per firing subassembly to couple the selected sensor plate to the measurement device. The fluidic die also includes a transmission path between each selector and its corresponding sensor plate. A first transmission path for a particular sensor plate has physical properties such that a parasitic capacitance along the first transmission path corresponds to a parasitic capacitance for a second transmission path of a second sensor plate in the zone, regardless of a difference in transmission path length.Type: GrantFiled: November 21, 2018Date of Patent: July 12, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Eric T. Martin, Vincent C. Korthuis
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Publication number: 20220184946Abstract: In example implementations, a printhead die is provided. The printhead die includes a substrate, a chamber layer formed on the substrate, a plurality of printing fluid ejection chambers coupled to opposite sides of the chamber layer and along a length of the chamber layer, and a top hat layer formed on the chamber layer and the plurality of printing fluid ejection chambers. The chamber layer includes a void to store printing fluid. The top hat layer includes an initial unsupported top hat layer portion over the void, wherein the initial unsupported top hat layer portion comprises a first end that is narrower than a second end.Type: ApplicationFiled: September 6, 2019Publication date: June 16, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Vincent C. Korthuis, Huyen Pham, Tsuyoshi Yamashita
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Publication number: 20220134745Abstract: According to examples, an apparatus may include a fluidic chamber, in which fluid is to be temporarily held. The apparatus may also include a heating component to generate heat to form a drive bubble in the fluid held in the fluidic chamber and a cavitation plate may be provided between the fluidic chamber and the heating component. The cavitation plate may be in communication with the fluidic chamber and may physically separate the fluidic chamber from the heating component to protect the heating component. In addition, a controller may determine a condition in the fluidic chamber based on an electrical signal received from the cavitation plate.Type: ApplicationFiled: June 17, 2019Publication date: May 5, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Eric Thomas Martin, Tsuyoshi Yamashita, Vincent C. Korthuis
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Patent number: 11318737Abstract: A fluidic die includes primitives arranged to form a number of primitive zones, each primitive zone including a memory to store adjustment data, and at least one signal adjuster to receive a fire signal, and to adjust the received fire signal based on the stored adjustment data to provide an adjusted fire signal to each primitive of the primitive zone. The fluidic die includes an address bus and a set of data lines, each data line corresponding to a different one of the primitives. Mode circuitry directs address data from the address bus to each primitive and print data from each data line to the corresponding primitive when a mode signal has a first value, and directs data representing adjustment data from one of the address bus and the set of data lines to at least one of the memories when the mode signal has a second value.Type: GrantFiled: July 2, 2018Date of Patent: May 3, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Vincent C. Korthuis, Rodrigo N. Henriquez, Eric T. Martin
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Publication number: 20220118763Abstract: Example implementations relate to fluid feed holes. For example, a method of forming a fluid feed hole can include forming a via of a threshold size in a plurality of thin films of a fluid ejection die by removing a portion of the plurality of thin films, forming a fluid-attack-resistant material on the plurality of thin films and in the via, planarizing the fluid-attack-resistant material using chemical mechanical planarization (CMP), and forming the fluid feed hole by removing a portion of the planarized fluid-attack-resistant material in the via.Type: ApplicationFiled: July 3, 2019Publication date: April 21, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Vincent C. Korthuis, Stanley Jonathan Wang
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Patent number: 11260653Abstract: In some examples, a fluid ejection device includes a communication interface comprising a plurality of communication channel circuits capable of communicating over respective communication channels, and a configuration controller, responsive to an input, to selectively activate at least one communication channel circuit of the plurality of communication channel circuits, wherein different inputs to the configuration controller are to cause selective activation of different numbers of the plurality of communication channel circuits. The fluid ejection device further includes a nozzle controller responsive to data received through the activated at least one communication channel circuit to cause activation of at least one corresponding nozzle to eject fluid.Type: GrantFiled: January 20, 2017Date of Patent: March 1, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Eric Martin, Vincent C Korthuis
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Patent number: 11241879Abstract: A fluid ejection device may include fluid ejectors, fluid pumps to circulate fluid to the fluid ejectors, a first actuation signal line and at least one second actuation signal line. The first actuation signal line is connected to each of the fluid ejectors and each of the fluid pumps along which a first signal is transmittable to actuate a selected one of fluid ejectors and the fluid pumps. The at least one second actuation signal line is connected to the fluid pumps along which a second signal is transmittable to actuate a selected one of the fluid pumps.Type: GrantFiled: January 19, 2017Date of Patent: February 8, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Vincent C Korthuis, Eric T Martin
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Publication number: 20210331465Abstract: A fluidic die includes a number of actuators to eject fluid from the fluidic die. The number of actuators form a number of primitives. The fluidic die includes a plurality of delays within a column of the primitives, and a processing device to control the delays through which a number of activation pulses pass. The activation pulses activate each of the actuators associated with the primitives. The activation pulses are delayed between the primitives via at least one of the delays to reduce peak power demands of the fluidic die.Type: ApplicationFiled: July 12, 2017Publication date: October 28, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Scott A Linn, Eric Martin, Vincent C Korthuis, James Michael Gardner
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Patent number: 11155085Abstract: A thermal fluid ejection heating element may include a first conductive trace, and an at least partially perforated resistive thin film material electrically coupling the first conductive trace to a second conductive trace. The perforations within the perforated resistive thin film material defines a resistance of the thermal fluid ejection heating element.Type: GrantFiled: July 17, 2017Date of Patent: October 26, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Stanley J Wang, Erik D Torniainen, Vincent C Korthuis
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Publication number: 20210283907Abstract: In some examples, a fluid ejection device includes a communication interface comprising a plurality of communication channel circuits capable of communicating over respective communication channels, and a configuration controller, responsive to an input, to selectively activate at least one communication channel circuit of the plurality of communication channel circuits, wherein different inputs to the configuration controller are to cause selective activation of different numbers of the plurality of communication channel circuits. The fluid ejection device further includes a nozzle controller responsive to data received through the activated at least one communication channel circuit to cause activation of at least one corresponding nozzle to eject fluid.Type: ApplicationFiled: January 20, 2017Publication date: September 16, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Eric Martin, Vincent C Korthuis
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Publication number: 20210283909Abstract: A fluid ejection device may include fluid ejectors, fluid pumps to circulate fluid to the fluid ejectors, a first actuation signal line and at least one second actuation signal line. The first actuation signal line is connected to each of the fluid ejectors and each of the fluid pumps along which a first signal is transmittable to actuate a selected one of fluid ejectors and the fluid pumps. The at least one second actuation signal line is connected to the fluid pumps along which a second signal is transmittable to actuate a selected one of the fluid pumps.Type: ApplicationFiled: January 19, 2017Publication date: September 16, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Vincent C Korthuis, Eric T Martin
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Patent number: 11110702Abstract: In some examples, a fluid ejection device includes a nozzle to dispense fluid, and a recirculation controller to control recirculating of the nozzle. The recirculation controller is to receive, from a fluid ejection controller, an indication corresponding to a start of a sampling time interval, determine, during the sampling time interval, whether a firing event corresponding to firing of the nozzle has occurred, and in response to determining that the firing event has not occurred, cause activation of a recirculation pump to recirculate fluid through a chamber of the nozzle.Type: GrantFiled: April 24, 2020Date of Patent: September 7, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Eric Martin, Vincent C Korthuis
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Publication number: 20210268797Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes an array of firing subassemblies grouped into zones. Each firing subassembly includes 1) a firing chamber, 2) a fluid actuator disposed, and 3) a sensor plate. The fluidic die also includes a measurement device per zone to determine a state of a selected sensor plate. The fluidic die includes a selector per firing subassembly to couple the selected sensor plate to the measurement device. The fluidic die also includes a transmission path between each selector and its corresponding sensor plate. A first transmission path for a particular sensor plate has physical properties such that a parasitic capacitance along the first transmission path corresponds to a parasitic capacitance for a second transmission path of a second sensor plate in the zone, regardless of a difference in transmission path length.Type: ApplicationFiled: November 21, 2018Publication date: September 2, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: Eric T. Martin, Vincent C. Korthuis
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Publication number: 20210229427Abstract: A fluidic die includes primitives arranged to form a number of primitive zones, each primitive zone including a memory to store adjustment data, and at least one signal adjuster to receive a fire signal, and to adjust the received fire signal based on the stored adjustment data to provide an adjusted fire signal to each primitive of the primitive zone. The fluidic die includes an address bus and a set of data lines, each data line corresponding to a different one of the primitives. Mode circuitry directs address data from the address bus to each primitive and print data from each data line to the corresponding primitive when a mode signal has a first value, and directs data representing adjustment data from one of the address bus and the set of data lines to at least one of the memories when the mode signal has a second value.Type: ApplicationFiled: July 2, 2018Publication date: July 29, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: Vincent C. Korthuis, Rodrigo N. Henriquez, Eric T. Martin