Abstract: Methods of making packages for integrated circuit devices, and in particular for attaching a plurality of integrated circuit die to a substrate strip, are disclosed. The substrate includes a plurality of die mounting sites. A B-staged epoxy film is on each site. An exemplary method includes placing an integrated circuit die on the adhesive film of each site. After a plurality of integrated circuit die are individually placed on the substrate, the adhesive films of a plurality of sites are cured simultaneously in a batch process. The curing permanently attaches the die to the substrate. Subsequently, the die are wire bonded to their respective substrate sites and encapsulated. The encapsulated substrate is cut to form individual packages.

Abstract: There is provided a semiconductor package and method for fabricating the same.

Abstract: A circuit board for semiconductor packages capable of fabricating a large number of semiconductor packages in a single circuit board, the circuit board including: a resin layer in the form of a rectangular sheet with first and second sides, the resin layer having a plurality of through holes arranged in rows and columns sharing a sub slot of a predetermined length as a common boundary to form one sub strip for mounting a semiconductor chip, a plurality of the sub strips being arranged in a row and sharing a main slot of a predetermined length as a common boundary to form one main strip; a plurality of circuit patterns each formed in the resin layer between the through hole of the individual sub strip and the sub slot; and a cover coat coated on the resin layer for the purpose of protecting the circuit patterns against external environments.

Abstract: A semiconductor package and method for manufacturing the same is disclosed. The semiconductor package comprises a semiconductor chip, a circuit board, an electrical connection means, an encapsulation material and a plurality of conductive balls. The semiconductor chip has a first surface and a second surface. A plurality of input and output pads are formed on one of the first and second surfaces. The circuit board comprises a thin film having a first surface and a second surface and being provided with a center hole in which the semiconductor chip is positioned, a plurality of circuit patterns being formed on the first surface of the thin film and including a plurality of bond fingers and ball lands, and a cover coat covering the circuit board except for the bond fingers and the ball lands. The electric connection means electrically connects the input and output pads of the semiconductor chip with the bond fingers of the circuit board.

Abstract: A semiconductor package and method for manufacturing the same is disclosed. The semiconductor package comprises a semiconductor chip, a circuit board, an electrical connection means, an encapsulation material and a plurality of conductive balls. The semiconductor chip has a first surface and a second surface. A plurality of input and output pads are formed on one of the first and second surfaces. The circuit board comprises a thin film having a first surface and a second surface and being provided with a center hole in which the semiconductor chip is positioned, a plurality of circuit patterns being formed on the first surface of the thin film and including a plurality of bond fingers and ball lands, and a cover coat covering the circuit board except for the bond fingers and the ball lands. The electric connection means electrically connects the input and output pads of the semiconductor chip with the bond fingers of the circuit board.

Abstract: This invention provides a method for making a semiconductor package with stacked dies that eliminates fracturing of the upper die(s) during the wire bonding process. One embodiment of the method includes the provision of a substrate and pair of semiconductor dies, each having opposite top and bottom surfaces and a plurality of wire bonding pads around the peripheries of their respective top surfaces. One die is attached and wire bonded to a top surface of the substrate. A measured quantity of an uncured, fluid adhesive is dispensed onto the top surface of the first die, and the adhesive is squeezed toward the edges of the dies by pressing the bottom surface of the second die down onto the adhesive until the two dies are separated by a layer of the adhesive. The adhesive is cured, the second die is then wire bonded to the substrate, and the dies are then molded over with an encapsulant.

Abstract: Semiconductor devices and methods of manufacturing such devices are disclosed. In one embodiment of this invention, a semiconductor chip is bonded to a first surface of a substrate. The substrate extends beyond the edge of the chip. Signal input/output pads on the chip are juxtaposed with an opening in the substrate. A molded support is formed on the portion of the first surface of the substrate that extends beyond between the sidewall of the edge of the chip. The support prevents bending of the substrate, and allows solder balls to be formed on the entire area of a second surface of the substrate opposite the first surface of the substrate. A heat dissipating plate is mounted on a surface of the chip opposite the substrate. The heat dissipating plate is attached to the support.

Abstract: This invention provides a method for making a semiconductor package with stacked dies that eliminates fracturing of the upper die(s) during the wire bonding process. One embodiment of the method includes the provision of a substrate and pair of semiconductor dies, each having opposite top and bottom surfaces and a plurality of wire bonding pads around the peripheries of their respective top surfaces. One die is attached and wire bonded to a top surface of the substrate. A measured quantity of an uncured, fluid adhesive is dispensed onto the top surface of the first die, and the adhesive is squeezed toward the edges of the dies by pressing the bottom surface of the second die down onto the adhesive until the two dies are separated by a layer of the adhesive. The adhesive is cured, the second die is then wire bonded to the substrate, and the dies are then molded over with an encapsulant.

Abstract: Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.

Abstract: A package for one or more semiconductor die is disclosed, along with a method of making the package. In one embodiment, the package includes a substrate having opposed top and bottom surfaces and an aperture therebetween. The substrate includes an insulative layer and top and bottom metal layers on the insulative layer around the aperture. The metal layers are electrically connected through the insulative layer. At least one die is supported within the aperture by an insulative encapsulant material. The bottom surface of the die is exposed. In alternative embodiments, a stack including a plurality of die (e.g., two die) are supported in the aperture. Rectangular metal are provided in a single row on the bottom surface of the substrate along at least two edges of the package.

Abstract: Methods of making packages for integrated circuit devices are described. An exemplary method includes providing a substrate sheet having an array of package sites at which individual integrated circuit packages will be assembled. A continuous sheet of an adhesive film is placed on the substrate strip so as to cover the plurality of package sites. The adhesive film sheet is then cured by applying heat or pressure or heat and pressure to the substrate strip and the sheet of adhesive film. The pressure and/or heat cause the sheet of adhesive film to be permanently attached to the substrate strip. A subsequent step forms one or more apertures though the joined substrate strip and adhesive film at each package site. An integrated circuit die is mounted on the adhesive film at each package site, and bond wires are attached through the aperture between metallizations of the substrate and the integrated circuit device.

Abstract: Embodiments of integrated circuit packages for housing a plurality of integrated circuits are disclosed, along with methods of making the packages. One integrated circuit package comprises a substrate having a first surface having first metallizations thereon, an opposite second surface, and a plurality of apertures between the first and second surfaces. A first integrated circuit having a first surface with first bond pads thereon and an opposite second surface is mounted on the second surface of the substrate so that the first bond pads are superimposed with an aperture. Each first bond pad is electrically connected by a first bond wire extending through the superimposing aperture to a first metallization. A second integrated circuit having a first surface with conductive second bond pads thereon is mounted on the second surface of the first integrated circuit.

Abstract: The invention provides a manufacturing process for making chip-size semi-conductor packages (“CSPs”) at the wafer-level without the added size, cost, and complexity of substrates in the packages or the need to overmold them with plastic. One embodiment of the method includes the provision of a semiconductor wafer with opposite top and bottom surfaces and a plurality of dies integrally defined therein. Each die has an electronic device formed in a top surface thereof, and one or more electrically conductive vias extending therethrough that electrically connect the electronic device to the bottom surface of the die. The openings for the vias are formed ablatively with a laser and plated through with a conductive material. In a BGA form of the CSP, the vias connects the electronic device to lands on the bottom surface of the die. The lands may each have a bump of a conductive metal, e.g., solder, attached to it that functions as an input-output terminal of the CSP.

Abstract: Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed.

Abstract: This invention provides a method for making a semiconductor package with stacked dies that substantially reduces risk of fracturing of the dies and prevents breakage of the wire bonds caused by wire sweep. One embodiment of the method includes the provision of a substrate and a pair of semiconductor dies, each having opposite top and bottom surfaces and a plurality of wire bonding pads around the peripheries of their respective top surfaces. One die is attached and wire bonded to a top surface of the substrate. A measured quantity of an uncured, fluid adhesive is dispensed onto the top surface of the first die, and the adhesive is squeezed out to the edges of the dies by pressing the bottom surface of the second die down onto the adhesive until the two dies are separated by a layer of the adhesive. The adhesive is cured and the second die is wire bonded to the substrate. A bead of an adhesive is dispensed around the periphery of the dies such that it covers the wire bonds and bonding pads on the second die.

Abstract: Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed.