Patents by Inventor Vladimir Tamarkin
Vladimir Tamarkin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11830863Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: GrantFiled: November 30, 2021Date of Patent: November 28, 2023Assignee: Intel CorporationInventors: Suresh V. Pothukuchi, Andrew Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao, Harinadh Potluri, David M. Bond, Sushrutha Reddy Gujjula, Donald Tiendung Tran, David Hui, Vladimir Tamarkin
-
Publication number: 20220085001Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: ApplicationFiled: November 30, 2021Publication date: March 17, 2022Inventors: Suresh V. POTHUKUCHI, Andrew ALDUINO, Ravindranath V. MAHAJAN, Srikant NEKKANTY, Ling LIAO, Harinadh POTLURI, David M. BOND, Sushrutha Reddy GUJJULA, Donald Tiendung TRAN, David HUI, Vladimir TAMARKIN
-
Patent number: 11217573Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: GrantFiled: March 4, 2020Date of Patent: January 4, 2022Assignee: Intel CorporationInventors: Suresh V. Pothukuchi, Andrew Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao, Harinadh Potluri, David M. Bond, Sushrutha Reddy Gujjula, Donald Tiendung Tran, David Hui, Vladimir Tamarkin
-
Publication number: 20210280566Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: ApplicationFiled: March 4, 2020Publication date: September 9, 2021Inventors: Suresh V. POTHUKUCHI, Andrew ALDUINO, Ravindranath V. MAHAJAN, Srikant NEKKANTY, Ling LIAO, Harinadh POTLURI, David M. BOND, Sushrutha Reddy GUJJULA, Donald Tiendung TRAN, David HUI, Vladimir TAMARKIN
-
Publication number: 20210210478Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: ApplicationFiled: March 3, 2021Publication date: July 8, 2021Inventors: Susheel JADHAV, Juan DOMINGUEZ, Ankur AGRAWAL, Kenneth BROWN, Yi LI, Jing CHEN, Aditi MALLIK, Xiaoyu HONG, Thomas LILJEBERG, Andrew C. ALDUINO, Ling LIAO, David HUI, Ren-Kang CHIOU, Harinadh POTLURI, Hari MAHALINGAM, Lobna KAMYAB, Sasanka KANUPARTHI, Sushrutha Reddy GUJJULA, Saeed FATHOLOLOUMI, Priyanka DOBRIYAL, Boping XIE, Abiola AWUJOOLA, Vladimir TAMARKIN, Keith MEASE, Stephen KEELE, David SCHWEITZER, Brent ROTHERMEL, Ning TANG, Suresh POTHUKUCHI, Srikant NEKKANTY, Zhichao ZHANG, Kaiyuan ZENG, Baikuan WANG, Donald TRAN, Ravindranath MAHAJAN, Baris BICEN, Grant SMITH
-
Patent number: 10176143Abstract: Some embodiments include apparatus and methods having a circuit board, a device located on the circuit board, a first Peripheral Component Interconnect Express (PCIe) connector located on the circuit board and coupled to the device, and a second PCIe connector located on the circuit board and coupled to the device. The first PCIe connector is arranged to couple to a first connector of an additional circuit board. The second PCIe connector is arranged to couple to a second connector of the additional circuit board.Type: GrantFiled: June 13, 2017Date of Patent: January 8, 2019Assignee: Intel CorporationInventors: Vladimir Tamarkin, Wayne Genetti, David Schweitzer
-
Patent number: 9954295Abstract: A cabled midplane interconnect system includes a cabled midplane interconnect having a first connection and a second connection. A first circuit board has a third connection configured to be coupled to the first connection. A second circuit board has a fourth connection configured to be coupled to the second connection. The connection orientations are assigned such that a midplane cable, having a plurality of conductors, couples the first connection to the second connection so that none of the plurality of conductors crosses another of the plurality of conductors.Type: GrantFiled: May 1, 2017Date of Patent: April 24, 2018Assignee: Intel CorporationInventors: Wayne Genetti, Vladimir Tamarkin
-
Patent number: 9917392Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.Type: GrantFiled: August 8, 2016Date of Patent: March 13, 2018Assignee: Intel CorporationInventors: Vladimir Tamarkin, Wayne Genetti, Keith Mease, Mark Wessel
-
Publication number: 20170286353Abstract: Some embodiments include apparatus and methods having a circuit board, a device located on the circuit board, a first Peripheral Component Interconnect Express (PCIe) connector located on the circuit board and coupled to the device, and a second PCIe connector located on the circuit board and coupled to the device. The first PCIe connector is arranged to couple to a first connector of an additional circuit board. The second PCIe connector is arranged to couple to a second connector of the additional circuit board.Type: ApplicationFiled: June 13, 2017Publication date: October 5, 2017Inventors: Vladimir Tamarkin, Wayne Genetti, David Schweitzer
-
Publication number: 20170237189Abstract: A cabled midplane interconnect system includes a cabled midplane interconnect having a first connection and a second connection. A first circuit board has a third connection configured to be coupled to the first connection. A second circuit board has a fourth connection configured to be coupled to the second connection. The connection orientations are assigned such that a midplane cable, having a plurality of conductors, couples the first connection to the second connection so that none of the plurality of conductors crosses another of the plurality of conductors.Type: ApplicationFiled: May 1, 2017Publication date: August 17, 2017Inventors: Wayne Genetti, Vladimir Tamarkin
-
Patent number: 9710421Abstract: Some embodiments include apparatus and methods having a circuit board, a device located on the circuit board, a first Peripheral Component Interconnect Express (PCIe) connector located on the circuit board and coupled to the device, and a second PCIe connector located on the circuit board and coupled to the device. The first PCIe connector is arranged to couple to a first connector of an additional circuit board. The second PCIe connector is arranged to couple to a second connector of the additional circuit board.Type: GrantFiled: December 12, 2014Date of Patent: July 18, 2017Assignee: Intel CorporationInventors: Vladimir Tamarkin, Wayne Genetti, David Schweitzer
-
Patent number: 9697160Abstract: A cabled midplane interconnect system includes a cabled midplane interconnect having a first connection and a second connection. A first circuit board has a third connection configured to be coupled to the first connection. A second circuit board has a fourth connection configured to be coupled to the second connection. The connection orientations are assigned such that a midplane cable, having a plurality of conductors, couples the first connection to the second connection so that none of the plurality of conductors crosses another of the plurality of conductors.Type: GrantFiled: December 23, 2014Date of Patent: July 4, 2017Assignee: Intel CorporationInventors: Wayne Genetti, Vladimir Tamarkin
-
Publication number: 20160352038Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.Type: ApplicationFiled: August 8, 2016Publication date: December 1, 2016Inventors: Vladimir Tamarkin, Wayne Genetti, Keith Mease, Mark Wessel
-
Patent number: 9413097Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.Type: GrantFiled: December 22, 2014Date of Patent: August 9, 2016Assignee: Intel CorporationInventors: Vladimir Tamarkin, Wayne Genetti, Keith Mease, Mark Wessel
-
Publication number: 20160181711Abstract: A cabled midplane interconnect system includes a cabled midplane interconnect having a first connection and a second connection. A first circuit board has a third connection configured to be coupled to the first connection. A second circuit board has a fourth connection configured to be coupled to the second connection. The connection orientations are assigned such that a midplane cable, having a plurality of conductors, couples the first connection to the second connection so that none of the plurality of conductors crosses another of the plurality of conductors.Type: ApplicationFiled: December 23, 2014Publication date: June 23, 2016Inventors: Wayne Genetti, Vladimir Tamarkin
-
Publication number: 20160181719Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.Type: ApplicationFiled: December 22, 2014Publication date: June 23, 2016Inventors: Vladimir Tamarkin, Wayne Genetti, Keith Mease, Mark Wessel
-
Publication number: 20160183402Abstract: An electrical device can include a printed circuit board (PCB), an electrical component integrated therewith, and connectors that are each integrated with a certain edge of the PCB. Traces can provide electrical channels between the connectors and the electrical component. Some of the connectors can be integrated at a first edge of the PCB and within a first plane, and other connectors can be integrated at a second edge of the PCB and within a second plane that is distinct from the first plane.Type: ApplicationFiled: December 23, 2014Publication date: June 23, 2016Inventors: Vladimir Tamarkin, William F. Federer, Thomas W. Genetti
-
Publication number: 20160170928Abstract: Some embodiments include apparatus and methods having a circuit board, a device located on the circuit board, a first Peripheral Component Interconnect Express (PCIe) connector located on the circuit board and coupled to the device, and a second PCIe connector located on the circuit board and coupled to the device. The first PCIe connector is arranged to couple to a first connector of an additional circuit board. The second PCIe connector is arranged to couple to a second connector of the additional circuit board.Type: ApplicationFiled: December 12, 2014Publication date: June 16, 2016Inventors: Vladimir Tamarkin, Wayne Genetti, David Schweitzer
-
Patent number: 8873236Abstract: An electronic device with a housing or enclosure. At least one heat-generating electronic component is contained within the housing. The electronic device further comprises a fan module configured to direct cooling air over the at least one heat-generating electronic component. The fan module is pivotably secured to the housing and capable of pivoting through at least 180°, such that the cooling air can be directed in a front-to-back flow path or a back-to-front flow path. Either of a manufacturer and a customer can reconfigure the direction of airflow.Type: GrantFiled: February 15, 2012Date of Patent: October 28, 2014Assignee: QLOGIC, CorporationInventors: Vladimir Tamarkin, Mark W. Wessel
-
Patent number: 8532086Abstract: Switch systems and method to configure switch systems are disclosed. A switch system includes a first leaf module and a first spine module. The first leaf module includes a plurality of internal ports and external ports. The first spine module includes a plurality of ports. A midplane is configured to couple each of the internal port of first leaf module to a port of a first spine module such that a subset of internal ports of the first leaf module are always coupled to a known subset of first spine module. Other switch systems and methods to configure switch systems are disclosed.Type: GrantFiled: June 7, 2011Date of Patent: September 10, 2013Assignee: Intel CorporationInventors: Wayne A. Genetti, Philip Murphy, Brent R. Rothermel, Vladimir Tamarkin