Abstract: A network device includes an airflow baffle. The baffle redirects cooling air toward a transceiver cage to increase a rate of heat transfer from electronic devices on the transceiver. The baffle is bi-directional, so that cooling air is redirected regardless of whether it flows in a front-to-back or back-to-front direction.

Abstract: System and method to configure switch systems are disclosed. A switch system includes leaf modules with internal ports and spine modules with ports. A midplane includes first layers closer to a first side, second layers closer to a second side and third layers between the first layers and the second layers. The midplane receives the leaf modules and the spine modules about both the first side and the second side. Conductors of the third layers couple internal ports of the leaf modules about one side to a port of spine modules about the other side. Conductors of the first layers couple internal ports of the leaf modules with ports of the spine modules about the first side. Conductors of the second layers couple internal ports of the leaf modules with ports of the spine modules about the second side.

Abstract: Switch systems and method to configure switch systems are disclosed. A switch system includes a first leaf module and a first spine module. The first leaf module includes a plurality of internal ports and external ports. The first spine module includes a plurality of ports. A midplane is configured couple each of the internal port of first leaf module to a port of a first spine module such that a subset of internal ports of the first leaf module are always coupled to a known subset of first spine module. Other switch systems and methods to configure switch systems are disclosed.

Abstract: A network device including a module. A chassis supports the module. A lever is secured to an enclosure of the module by a pivot. In one embodiment a pivot axis of the lever is parallel to a major axis of the module. In another embodiment the enclosure includes a clearance through which a portion of a lever from an adjacent module may pass. In another embodiment the lever includes a handle portion and a claw portion. A portion of the handle defines a first plane, the claw defines a second plane, and the first and second planes are parallel and spaced from one another. In another embodiment at least part of the claw portion protrudes outward from an envelope of the module enclosure.

Abstract: A computer system that includes a plurality of servers, and a shared I/O subsystem coupled to each of the servers and to one or more I/O interfaces. The shared I/O subsystem services I/O requests made by two or more of the servers. Each I/O interface may couple to a network, appliance, or other device. The I/O requests serviced by the shared I/O subsystem may alternatively include software initiated or hardware initiated I/O requests. Different servers coupled to the shared I/O subsystem may use different operating systems, and each I/O interface may be used by two or more servers.

Abstract: The disclosed embodiments include a plurality of plenums for distributing cooling air throughout the switch. The switch is divided into separate cooling domains. Each PCB receives a separate supply of cooling air, so that no PCB is located upstream or downstream from another PCB. The present embodiments thus eliminate the problem of stack rise, which can decrease switch performance.

Abstract: One embodiment of the present computer network device comprises a subassembly. The subassembly includes a support plate, a standoff extending from the support plate, a printed circuit board (PCB) secured to the standoff, an electromechanical connector secured to the PCB, an electromagnetic interference (EMI) cage secured to the PCB, and an EMI gasket engaging the EMI cage. The computer network device further comprises a guiding and retaining member that engages the support plate and assists in securing the subassembly within an enclosure. In a method of assembling the computer network device, the subassembly is first assembled before the subassembly is secured within an enclosure. Relative motion of the PCB and the standoffs is thus eliminated during the assembly process.

Abstract: The disclosed embodiments include a plurality of plenums for distributing cooling air throughout the switch. The switch is divided into separate cooling domains. Each PCB receives a separate supply of cooling air, so that no PCB is located upstream or downstream from another PCB. The present embodiments thus eliminate the problem of stack rise, which can decrease switch performance.

Abstract: A computer system that includes a plurality of servers, and a shared I/O subsystem coupled to each of the servers and to one or more I/O interfaces. The shared I/O subsystem services I/O requests made by two or more of the servers. Each I/O interface may couple to a network, appliance, or other device. The I/O requests serviced by the shared I/O subsystem may alternatively include software initiated or hardware initiated I/O requests. Different servers coupled to the shared I/O subsystem may use different operating systems, and each I/O interface may be used by two or more servers.

Abstract: A computer system that includes a plurality of servers, and a shared I/O subsystem coupled to each of the servers and to one or more I/O interfaces. The shared I/O subsystem services I/O requests made by two or more of the servers. Each I/O interface may couple to a network, appliance, or other device. The I/O requests serviced by the shared I/O subsystem may alternatively include software initiated or hardware initiated I/O requests. Different servers coupled to the shared I/O subsystem may use different operating systems, and each I/O interface may be used by two or more servers.

Abstract: A computer system that includes a plurality of servers, and a shared I/O subsystem coupled to each of the servers and to one or more I/O interfaces. The shared I/O subsystem services I/O requests made by two or more of the servers. Each I/O interface may couple to a network, appliance, or other device. The I/O requests serviced by the shared I/O subsystem may alternatively include software initiated or hardware initiated I/O requests. Different servers coupled to the shared I/O subsystem may use different operating systems, and each I/O interface may be used by two or more servers.