Abstract: Silicon-controlled rectifier (SCR) based circuit for ECG protection under defibrillator pulse is disclosed. The SCR-based clamp is a symmetric structure for dual-direction voltage tolerance protection based on two anti-series P-well/N-well lateral blocking junctions isolated from P-substrate by the N-buried layer. The injector regions (n+/p+) are substantially lengthened in order to accommodate a larger number of contact rows than typically used for ESD pulses specification. A stack of metal layers may also be used to provide high current and heat-sink capability with each electrode metal layer fully filled with VIAs.

Abstract: In a dual direction ESD protection circuit formed from multiple base-emitter fingers that include a SiGe base region, and a common sub-collector region, the I-V characteristics are adjusted by including P+ regions to define SCR structures that are operable to sink positive and negative ESD pulses, and adjusting the layout and distances between regions and the number of regions.

Abstract: A DMOS transistor with a lower on-state drain-to-source resistance and a higher breakdown voltage utilizes a slanted super junction drift structure that lies along the side wall of an opening with the drain region at the bottom of the opening and the source region near the top of the opening.

Abstract: In an ultra high voltage lateral GaN structure having a 2DEG region extending between two terminals, an isolation region is provided between the two terminals to provide for reversible snapback.

Abstract: In a dual direction ESD protection circuit formed from multiple base-emitter fingers that include a SiGe base region, and a common sub-collector region, the I-V characteristics are adjusted by including P+ regions to define SCR structures that are operable to sink positive and negative ESD pulses, and adjusting the layout and distances between regions and the number of regions.

Abstract: In an extended drain MOS device used in high voltage applications, switching characteristics are improved by providing for at least one base contact in the active region in the extended drain space.

Abstract: In an SCR ESD protection circuit, the n-type emitter of the SCR is controlled to receive electron current only during an ESD event, thereby defining PNP characteristics during normal operation and SCR characteristics during an ESD event.

Abstract: In the case of adjacent high voltage nodes in which one node is protected by a lateral BJT clamp, the irreversible burnout due to transient latch-up between the two adjacent high voltage pins of the structure is avoided by increasing the base contact region by including a sinker connected to the base.

Abstract: A lateral DMOS transistor formed on a silicon-on-insulator (SOI) structure has a higher breakdown voltage that results from a cavity that is formed in the bulk region of the SOI structure. The cavity exposes a portion of the bottom surface of the insulator layer of the SOI structure that lies directly vertically below the drift region of the DMOS transistor.

Abstract: In an LVTSCR, an avalanche diode based control circuit controls both the base of the internal PNP of the LVTSCR as well as the gate of the LVTSCR.

Abstract: A high voltage ESD protection diode wherein the p-n junction is defined by a p-well and an n-well and includes a RESURF region, the diode including a field oxide layer formed on top of the p-well and n-well, wherein the parameters of the diode are adjustable by controlling one or more of the junction width, the length of the RESURF region, or the length of the field oxide layer.

Abstract: In a DIAC-like device that includes an n+ and a p+ region connected to the high voltage node, and an n+ and a p+ region connected to the low voltage node, at least two MOS devices are formed between the n+ and p+ region connected to the high voltage node, and the n+ and p+ region connected to the low voltage node.

Abstract: In an active clamp implemented in a 5V complementary BiCMOS process, the footprint of the active clamp, which includes at least one NMOS clamp stack, is reduced by introducing a BJT into the circuit to allow the number of NMOS clamp stacks to be reduced.

Abstract: In a gated diode ESD protection structure, the gate is split into two parts to divide the total reverse voltage between two gate regions.

Abstract: A circuit includes multiple doped regions in a substrate. A first of the doped regions has a tip proximate to a second of the doped regions and is separated from the second doped region by an intrinsic region to form a P-I-N structure. The circuit also includes first and second electrodes electrically coupled to the first and second doped regions, respectively. The electrodes are configured to supply voltages to the first and second doped regions to reverse bias the P-I-N structure and generate light. The first doped region could include multiple tips, the second doped region could include multiple tips, and each tip of the first doped region could be proximate to one of the tips of the second doped region to form multiple P-I-N structures. The P-I-N structure could also be configured to operate in double avalanche injection conductivity mode with internal positive feedback.

Abstract: A photodiode comprises a first terminal formed in a surface of a semiconductor substrate; a second terminal formed in the substrate surface and spaced apart from the first terminal; and a plurality of adjacent alternating N-type and P-type diffusion regions formed in the substrate surface between the first terminal and the second terminal.

Abstract: Methods and structures provide galvanic isolation for electrical systems using a wide oxide filled trench, and that allows power across the system divide with a transformer, and that transmits data at a high baud rate using an optical link. The system solution allows the integration of all of these elements onto a single semiconductor substrate in contrast to currently available galvanic isolation systems that require multiple individual silicon die that are connected by wire bonds and are relatively slow.

Abstract: In an ultra high voltage lateral DMOS-type device (UHV LDMOS device), a central pad that defines the drain region is surrounded by a racetrack-shaped source region with striations of alternating n-type and p-type material radiating outwardly from the pad to the source to provide for an adjustable snapback voltage.

Abstract: A lateral DMOS transistor formed on a silicon-on-insulator (SOI) structure has a higher breakdown voltage that results from a cavity that is formed in the bulk region of the SOI structure. The cavity exposes a portion of the bottom surface of the insulator layer of the SOI structure that lies directly vertically below the drift region of the DMOS transistor.

Abstract: In a snapback NMOS ESD protection structure, the output voltage presented to an internal circuit for ESD protection is limited by providing for a separate output terminal at a lower voltage than the input terminal. The voltage drop between the two terminals is achieved by connecting the input and output terminals to different parts of a ballast region of the structure and using the saturation resistance of the portion of the ballast region between the terminals to achieve the voltage drop.