Abstract: Mixing gases within an adiabatic cooling unit can include allowing a first gas at a first temperature to enter a mixing chamber on a non-exposed side of an adiabatic cooling media and utilizing a first baffle to direct the first gas in a direction away from the adiabatic cooling media. Mixing gases within an adiabatic cooling unit can also include allowing a second gas at a second temperature to enter the mixing chamber on an exposed side of the adiabatic cooling media and allowing the first gas and the second gas to mix in the mixing chamber creating a mixed gas. Furthermore, mixing gases within an adiabatic cooling unit can include creating an inlet with the first baffle and a second baffle to direct the mixed gas away from the adiabatic cooling media and allowing the mixed gas to enter through the exposed side of the adiabatic cooling media.

Abstract: In accordance with at least some embodiments, a computer system includes an enclosure (202) configured to hold at least one resource unit (204). The computer system also comprises a plurality of mixed-flow ducted fans units (400) selectively attached to the enclosure (202). Each mixed-flow ducted fan unit (400) comprises a duct (102) having an intake diameter, a bellmouth diameter, and an exhaust diameter. The bellmouth diameter is less than the intake diameter and the exhaust diameter.

Abstract: An electronic module includes an enclosure having a front face and a rear face. An electronic circuit board is positioned in the enclosure and a processor is mounted to the electronic circuit board. A data storage device is positioned in the enclosure such that the processor is positioned between the data storage device and the electronic circuit board.

Abstract: A computer-implemented method is used for determining cooling requirements of a computer system enclosure, where the enclosure includes a number of installed modules, the modules including fan modules. The method includes the steps of determining an individual impedance curve of each installed module; determining fan curves for the installed fan modules; based on the individual impedance curves, determining an overall system impedance curve for the computer system; determining desired performance requirements for the computer system; based on the desired performance requirements, determining corresponding fan curves; and choosing a fan curve that intersects the system impedance curve.

Abstract: A system for cooling an electronics enclosure comprises a plurality of fan modules. Each fan module comprises, a motor for driving a fan at a variable rotational speed, a microcontroller for controlling the rotational speed of the motor, an interface for electronically communicating between the microcontroller and an infrastructure controller external to the fan module, the infrastructure controller providing a target speed to the microcontroller, a memory for storing data including speed avoidance zones, wherein when the target speed falls within one of the speed avoidance zones, the microcontroller controls the motor speed to be slightly outside the speed avoidance zone.

Abstract: In certain embodiments, an air-pressurizing device is positioned to discharge a computer system. A supply conduit pneumatically couples a cooled-air discharge conditioning system with an inlet of the air-pressurizing device.

Abstract: A cooling fan includes an outer housing. A motor support is fixed to the outer housing and a motor is mounted to the motor support. A hub is coupled to the motor and, with the motor support, forms a motor enclosure that substantially surrounds the motor. Multiple blades extend radially from the hub and are arranged so as to generate a flow of air around the motor enclosure when the blades are rotated. The cooling fan also includes a motor cooler including a flow path through the motor enclosure, wherein the flow path has a first opening and a second opening, wherein the second opening is disposed within an area of lowered downstream pressure so as to develop a differential pressure between the first and second openings and generate a flow of air through the motor enclosure as the motor operates.

Abstract: In at least some embodiments, an apparatus includes a pressurized air source and a tube coupled to the pressurized air source. The apparatus also includes an electronic component that is spot-cooled by moving air between the pressurized air source and the electronic component via the tube.

Abstract: A system and method for controlling cooling fans in a computing system using measured temperature and amperage load is disclosed. In one embodiment, a cooling fan control device (CFCD) includes a temperature sensing module for measuring an inside temperature of the computing system using a plurality of temperature sensors disposed within the computing system and for computing a temperature value during operation, a power measurement module for measuring amperage drawn by each of the plurality of cooling fans during operation, and a driving module coupled to the temperature sensing module and the power measurement module to adjust rotational speed of each of the plurality of cooling fans during operation to obtain a desired airflow across the inside of the computing system based on the computed temperature value, a desired temperature value, and a lookup table including temperature and amperage drawn versus airflow values associated with each cooling fan.

Abstract: An apparatus comprises a moving, continuously cleaning filter that removes contaminants from air as the air enters an equipment rack and discharges the contaminants into the air as the air exits the equipment rack.

Abstract: An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening.

Abstract: An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum.

Abstract: A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic modules are installed in the front section and the openings in the rear section can be open when operating fans are installed in the rear section.

Abstract: A cooling fan module is disclosed. The cooling fan module includes a module housing, a fan assembly, a fan control circuit board, and an electrical connector. The fan assembly is disposed within the module housing and includes a fan housing, a motor disposed within the fan housing, and a blade assembly coupled to the motor. The fan control circuit board is disposed between the module housing and the fan housing, and is coupled to the motor. The electrical connector is coupled to the fan control circuit board and projects outside of the module housing.

Abstract: A computer system comprises a chassis, an electronic component disposed within the chassis, and a cooling fan that comprises a motor support fixed to a housing that is coupled to the chassis and a hub disposed within the housing. A plurality of blades extend radially from the hub. A motor is disposed within a motor enclosure formed by the motor support and the hub. The hub is rotatably coupled to the motor such that the plurality of blades generates a flow of air around the motor enclosure. The system comprises a motor cooler comprising a flow path through the motor enclosure, where the flow path has a first opening and a second opening, and where the second opening is disposed within an area of lowered downstream pressure so as to develop a differential pressure between the first and second openings and generate a flow of air through the motor enclosure.

Abstract: A fan docking collar for sealing between a fan housing of a fan and an enclosure wall to improve fan performance by preventing flow recirculation. The docking collar includes a pliable body that defines an opening for air flow. The body has a seal for mating with the fan housing and a rim for sealing against the enclosure wall.

Abstract: Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.

Abstract: Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.

Abstract: A cooling fan module is disclosed. The cooling fan module includes a module housing, a fan assembly, a fan control circuit board, and an electrical connector. The fan assembly is disposed within the module housing and includes a fan housing, a motor disposed within the fan housing, and a blade assembly coupled to the motor. The fan control circuit board is disposed between the module housing and the fan housing, and is coupled to the motor. The electrical connector is coupled to the fan control circuit board and projects outside of the module housing.

Abstract: A cooling fan module comprising a module housing and a fan assembly. The fan assembly comprises a blade assembly coupled to a motor disposed within a fan housing that is disposed within the module housing. The fan housing has an inlet and an outlet that is disposed within the module housing. A fan control circuit board is disposed within the module housing and outside of the fan housing. The fan control circuit board is coupled to the motor. An electrical connector is coupled to the fan control circuit board and projects outside of the module housing.