Patents by Inventor Wade D. Vinson

Wade D. Vinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7554228
    Abstract: A cooling fan with an outer rotor motor supported by a fan housing. A motor housing is disposed within a conduit through the fan housing, while the outer rotor motor is disposed within the motor housing. A plurality of support members coupled between the motor housing and the fan housing enable the fan housing to support the motor housing. A hub is rotatably coupled to the outer rotor motor and has a first portion disposed within the motor housing and a second portion disposed outside of the motor housing. A plurality of blades extends radially from the second portion said hub.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: June 30, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John P. Franz, Wade D. Vinson
  • Publication number: 20090016010
    Abstract: An electronic module includes an enclosure having front face and a rear face. An electronic circuit board is positioned in the enclosure and a processor is mounted to the electronic circuit board. A data storage device is positioned in the enclosure such that the processor is positioned between the data storage device and the electronic circuit board.
    Type: Application
    Filed: June 13, 2008
    Publication date: January 15, 2009
    Inventors: WADE D. VINSON, John P. Franz, Arthur K. Farnsworth, David W. Sherrod
  • Publication number: 20090009962
    Abstract: A computer system comprises a chassis, an electronic component disposed within the chassis, and a cooling fan that comprises a motor support fixed to a housing that is coupled to the chassis and a hub disposed within the housing. A plurality of blades extend radially from the hub. A motor is disposed within a motor enclosure formed by the motor support and the hub. The hub is rotatably coupled to the motor such that the plurality of blades generates a flow of air around the motor enclosure. The system comprises a motor cooler comprising a flow path through the motor enclosure, where the flow path has a first opening and a second opening, and where the second opening is disposed within an area of lowered downstream pressure so as to develop a differential pressure between the first and second openings and generate a flow of air through the motor enclosure.
    Type: Application
    Filed: September 16, 2008
    Publication date: January 8, 2009
    Inventors: Wade D. Vinson, John P. Franz, Troy Della Fiora, Jeffery M. Giardina
  • Publication number: 20090010771
    Abstract: A cooling fan comprises an outer housing. A motor support is fixed to the outer housing and a motor is mounted to the motor support. A hub is rotatably coupled to the motor and, with the motor support, forms a motor enclosure that substantially surrounds the motor. A plurality of blades extends radially from the hub and are arranged so as to generate a flow of air around the motor enclosure when the blades are rotated. The cooling fan also comprises a motor cooler comprising a flow path through the motor enclosure, wherein the flow path has a first opening and a second opening, wherein the second opening is disposed within an area of lowered downstream pressure so as to develop a differential pressure between the first and second openings and generate a flow of air through the motor enclosure as the motor operates.
    Type: Application
    Filed: September 16, 2008
    Publication date: January 8, 2009
    Inventors: Wade D. Vinson, John P. Franz, Troy Della Flora, Jeffery M. Giardina
  • Publication number: 20080316704
    Abstract: A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic modules are installed in the front section and the openings in the rear section can be open when operating fans are installed in the rear section.
    Type: Application
    Filed: June 12, 2008
    Publication date: December 25, 2008
    Inventors: WADE D. VINSON, David W. Sherrod, David W. Deis, Steve Novack
  • Publication number: 20080310107
    Abstract: An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum.
    Type: Application
    Filed: June 13, 2008
    Publication date: December 18, 2008
    Inventors: WADE D. VINSON, David W. Sherrod
  • Publication number: 20080310100
    Abstract: An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening.
    Type: Application
    Filed: June 12, 2008
    Publication date: December 18, 2008
    Inventors: David W. Sherrod, Wade D. Vinson, Michael E. Taylor, Arthur G. Volkmann, Troy A Della Fiora, George D. Megason, Chong Sin Tan, Alan B. Doerr
  • Publication number: 20080312888
    Abstract: A computer-implemented method is used for determining cooling requirements of a computer system enclosure, where the enclosure includes a number of installed modules, the modules including fan modules. The method includes the steps of determining an individual impedance curve of each installed module; determining fan curves for the installed fan modules; based on the individual impedance curves, determining an overall system impedance curve for the computer system; determining desired performance requirements for the computer system; based on the desired performance requirements, determining corresponding fan curves; and choosing a fan curve that intersects the system impedance curve.
    Type: Application
    Filed: June 16, 2008
    Publication date: December 18, 2008
    Inventors: Wade D. Vinson, Paul R. Culley, Thomas D. Rhodes
  • Publication number: 20080310967
    Abstract: An intelligent air moving apparatus for cooling an electronics enclosure includes a motor for driving a fan at a variable rotational speed and a microcontroller for controlling the rotational speed of the motor. The microcontroller includes a speed sensor for sensing the rotational speed such that when the sensed rotational speed deviates below a target speed, the microcontroller detects a locked rotor condition.
    Type: Application
    Filed: April 22, 2008
    Publication date: December 18, 2008
    Inventors: John P. Franz, Wade D. Vinson, Thomas D. Rhodes, David F. Heinrich, Stephen A. Kay
  • Publication number: 20080303225
    Abstract: A fan docking collar for sealing between a fan housing of a fan and an enclosure wall to improve fan performance by preventing flow recirculation. The docking collar includes a pliable body that defines an opening for air flow. The body has a seal for mating with the fan housing and a rim for sealing against the enclosure wall.
    Type: Application
    Filed: May 5, 2008
    Publication date: December 11, 2008
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY L.P.
    Inventors: John P. Franz, Joseph R. Allen, Wade D. Vinson, Eric Mei
  • Publication number: 20080304230
    Abstract: A heat-sink structure includes a base and fins, the latter defining gaps with a cross-sectional area less than 24 mm2.
    Type: Application
    Filed: April 23, 2008
    Publication date: December 11, 2008
    Inventors: John P. FRANZ, Christian L. Belady, Wade D. Vinson
  • Publication number: 20080303360
    Abstract: A motor with improved bearing life has a shaft rotatably supported by a pair bearings. The motor further has a stator and a rotor, wherein one of the stator and the rotor is mounted to the shaft and the other of the stator and the rotor surrounds the shaft so that the stator and rotor can rotate with respect to one another. The motor has one or more features to protect at least one of the bearings from heat emitted by at least one of the stator and the rotor.
    Type: Application
    Filed: April 9, 2008
    Publication date: December 11, 2008
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY L.P.
    Inventors: Wade D. Vinson, John P. Franz, George A. Ozuna
  • Patent number: 7447019
    Abstract: A computer comprising a chassis supporting an electronic component. A fan housing with an axial duct is mounted to the chassis. A blade assembly is rotatably disposed within the duct and comprises a plurality of fan blades that extend radially from a hub to a fan diameter. The axial duct has a chord length at least equal to the fan diameter.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: November 4, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wade D. Vinson, John P. Franz, Ronald D. Noblett, Joseph R. Allen
  • Patent number: 7443063
    Abstract: A cooling fan comprising an outer housing. A motor support is fixed to the outer housing and a motor is mounted to the motor support. A hub is rotatably coupled to the motor and, with the motor support, forms a motor enclosure that substantially surrounds the motor. A plurality of blades extend radially from the hub and are arranged so as to generate a flow of air around the motor enclosure when the blades are rotated. The cooling fan also comprises a motor cooler comprising a flow path through the motor enclosure, wherein the flow path has a first opening and a second opening, wherein the second opening is disposed within an area of lowered downstream pressure so as to develop a differential pressure between the first and second openings and generate a flow of air through the motor enclosure as the motor operates.
    Type: Grant
    Filed: October 11, 2005
    Date of Patent: October 28, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wade D. Vinson, John P. Franz, Troy Della Fiora, Jeffery M. Giardina
  • Patent number: 7443671
    Abstract: A cooling fan comprising a housing that connects to a chassis that is operable to support an electronic component. An axial duct runs through the housing. A blade assembly is rotatably disposed within the duct and comprises a plurality of fan blades that extend radially from a hub to a fan diameter. The axial duct has a chord length at least equal to the fan diameter. A motor assembly is disposed within the axial duct and coupled to said blade assembly. The cooling fan provides a cooling capacity of at least 1.5 air horsepower per cubic inch volume of the cooling fan.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: October 28, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wade D. Vinson, John P. Franz, Ronald D. Noblett, Joseph R. Allen
  • Publication number: 20080239665
    Abstract: A cooling fan module comprising a module housing and a fan assembly. The fan assembly comprises a blade assembly coupled to a motor disposed within a fan housing that is disposed within the module housing. The fan housing has an inlet and an outlet that is disposed within the module housing. A fan control circuit board is disposed within the module housing and outside of the fan housing. The fan control circuit board is coupled to the motor. An electrical connector is coupled to the fan control circuit board and projects outside of the module housing.
    Type: Application
    Filed: August 4, 2006
    Publication date: October 2, 2008
    Inventors: John P. Franz, Troy A. Della Fiora, Joseph R. Allen, Wade D. Vinson
  • Patent number: 7382613
    Abstract: A computer system comprising a chassis supporting a processor, memory, and a power supply. An inlet allows air to flow into the chassis and an outlet allows air to flow out of the chassis. An air mover is operable to generate an airflow through said chassis between the inlet and the outlet and in thermal communication with the processor, memory, and power supply. The air mover is disposed external to said chassis.
    Type: Grant
    Filed: May 19, 2005
    Date of Patent: June 3, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wade D. Vinson, Christopher A. Taylor, Christian L. Belady, Eric C. Peterson
  • Patent number: 7327571
    Abstract: Systems and methods for implementing thermal load balancing are disclosed. In an exemplary embodiment, a thermal load balancing system for a multiprocessor computer having a plurality of processors may comprise a heat sink network having a plurality of local heat sinks. The local heat sinks are thermally coupled to separate processors in the multiprocessor computer. At least one heat pipe thermally couples each of the plurality of local heat sinks in the heat sink network.
    Type: Grant
    Filed: September 6, 2005
    Date of Patent: February 5, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jeffery M. Giardina, Wade D. Vinson, Thomas G. Bumby, Jr.
  • Patent number: 7326032
    Abstract: A cooling fan comprising a fan housing and a plurality of blades rotatably disposed within a conduit through the fan housing. Each of the plurality of blades extends radially outward from a hub to a tip. The radial gap between the tips of the blades and the conduit defines a tip clearance. The cooling fan further comprises an tip clearance reduction system operable to control the tip clearance.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: February 5, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wade D. Vinson, John P. Franz, Troy A. Della Fiora
  • Patent number: 7289321
    Abstract: The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The ventilated casing further includes a suspension for suspending the fan relative to the housing and for damping transmission of vibration originating from the fan.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: October 30, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chandrakant D. Patel, Wade D. Vinson, Rich Bargerhuff