Patents by Inventor Wai-Yan Ho

Wai-Yan Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5581562
    Abstract: An integrated circuit (IC) device implemented according to an architectural design that specifies that the IC device is required to have one functional module, to perform a first function, connected to another functional module, to perform a second function. The IC device includes a first IC chip having a plurality of first functional modules implemented thereon. Some of the first functional modules are defective and others of the first functional modules are non-defective. At least one of the non-defective first functional modules is operable to perform the first function. The IC device also includes a second IC chip having a plurality of second functional modules implemented thereon. Some of the second functional modules are defective and others of the second functional modules are non-defective. At least one of the non-defective second functional modules is operable to perform the second function.
    Type: Grant
    Filed: October 19, 1994
    Date of Patent: December 3, 1996
    Assignee: Seiko Epson Corporation
    Inventors: Chong M. Lin, Wai-Yan Ho, Le T. Nguyen
  • Patent number: 5581742
    Abstract: A simulation system for a microelectronic device having two or more functional modules from a megacell library, the simulation system utilizing actual physically implemented versions of each functional module (or block) from the megacell library so as to provide a more accurate and much faster simulation than a comparable software- or field programmable gate array-based simulation. The simulation system comprises means for providing a physically-based implementation of each functional module of a proposed design for a microelectronic device, the physically-based implementation being disposed on one or more test microelectronic devices used by the simulation system. Interconnecting means is used for electrically coupling together each of the physically-based implemented functional modules so as to produce the proposed design of the proposed microelectronic device.
    Type: Grant
    Filed: November 30, 1994
    Date of Patent: December 3, 1996
    Assignee: Seiko Epson Corporation
    Inventors: Chong M. Lin, Wai-Yan Ho, Le Trong Nguyen