Abstract: A quantum dot film article includes a first barrier layer; a second barrier layer; and a quantum dot layer between the first barrier layer and the second barrier layer. The quantum dot layer has quantum dots dispersed in a matrix including a cured adhesive composition, wherein the adhesive composition includes: an epoxide; an amino-functional compound of Formula I: wherein A is a monocyclic or a polycyclic alkylene group, or a monocyclic or a polycyclic heteroalkylene group, and m and n are integers each independently selected from 0 to 5; and a radiation curable methacrylate compound.

Abstract: An adhesive composition for joining optical components is described. The adhesive composition comprises at least one epoxy resin, a visible light photoinitiating system comprising at least one of a cationic photoinitiator and a sensitizer, a polyol and at least 50 wt. % of a nanoparticle filler. The visible light photoinitiating system includes at least one of a cationic photoinitiator and a sensitizer and the nanoparticle filler comprises a first nanoparticle having a first nominal size and a second nanoparticle having a second size. The adhesive composition has a refractive index between 1.44 and 1.47 and a dn/dT of less than ?2E?4 when cured.

Abstract: An optical network comprises a fiber distribution cable and a terminal assembly. The terminal assembly receives a plurality of optical fibers from the fiber distribution cable and distributes one or more individual fibers to one or more single fiber bare-fiber holders that hold and protect each single fiber prepared and configured for splicing via an individual splicing element. The splicing element includes an alignment mechanism having a base plate and a clamp plate. At least one of the base plate and clamp plate is formed from a silica material and at least one of the base plate and clamp plate includes an alignment groove or channel configured to receive the first and second optical fibers in an end-to-end manner. The splice element also comprises an optical adhesive disposed in at least a portion of the alignment groove, wherein the optical adhesive is curable via actinic radiation.

Abstract: A splice element for splicing a first and a second optical fiber comprises an alignment mechanism having a base plate and a clamp plate. At least one of the base plate and clamp plate is formed from a silica material and at least one of the base plate and clamp plate includes an alignment groove configured to receive the first and second optical fibers in an end-to-end manner. The splice element also comprises an optical adhesive disposed in at least a portion of the alignment groove, wherein the optical adhesive is curable via actinic radiation.

Abstract: Optically clear curable adhesive films that are heat conformable prior to setting include a reactive composition. The curable films are flexible and free-standing, and have a complex viscosity of greater than 100,000 poise (10,000 Pascal seconds) at 25° C. and less than 100 poise (10 Pascal seconds) at 85° C., prior to setting. The set film has an adhesive shear strength of greater than 100 Newtons per square centimeter (N/cm2) to a glass substrate when measured according to the Shear Adhesion Test Method. The reactive composition includes an ethylenically unsaturated polyester-containing oligomeric composition that is the reaction product of a saturated, amorphous co-polyester polyol and a compound with a terminal polyol-reactive group and a terminal ethylenically unsaturated group, a (meth)acrylate functional material, and at least one initiator.

Abstract: A pre-adhesive composition is described comprising an acid- and epoxy-functional (meth)acryloyl copolymer, which when crosslinked with or without using an ionic photoacid generator (PAG) provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles having desirable properties.

Abstract: A quantum dot film article including a first barrier layer, a second barrier layer; and a quantum dot layer between the first barrier layer and the second barrier layer. The quantum dot layer includes quantum dots dispersed in a matrix including a cured adhesive composition. The adhesive composition includes an epoxide and a curing agent including: (a) a compound of Formula I: wherein A is a monocyclic or a polycyclic alkylene group, or a monocylic or a polycyclic heteroalkylene group, and m and n are integers each independently selected from 0 to 5; and (b) a polyether amine compound including at least one of primary and secondary amino groups attached to a polyether backbone. The adhesive composition further includes a radiation curable methacrylate compound.

Abstract: A quantum dot film article includes a first barrier layer; a second barrier layer; and a quantum dot layer between the first barrier layer and the second barrier layer. The quantum dot layer has quantum dots dispersed in a matrix including a cured adhesive composition, wherein the adhesive composition includes: an epoxide; an amino-functional compound of Formula I: wherein A is a monocyclic or a polycyclic alkylene group, or a monocyclic or a polycyclic heteroalkylene group, and m and n are integers each independently selected from 0 to 5; and a radiation curable methacrylate compound.

Abstract: Adhesives compositions and methods of preparing adhesive compositions are described. The methods generally comprise a) providing a syrup composition comprising i) a free-radically polymerizable solvent monomer; and ii) a solute (meth)acrylic copolymer; and b) radiation curing the syrup composition in the absence of an ionic photoacid generator. In one embodiment, the solute (meth)acrylic copolymer as provided or during curing comprises repeat units derived from at least one alkyl(meth)acrylate monomer, at least one ethylenically unsaturated monomer comprising an acid-functional group; and at least one (meth)acryloyl monomer comprising an epoxy-functional group; and the acid-functional groups crosslink with the epoxy-functional groups.

Abstract: Adhesive compositions and methods of preparing an adhesive composition are described. The method comprises providing a syrup composition comprising a free-radically polymerizable solvent monomer and a solute (meth)acrylic copolymer, and radiation curing the syrup composition in the absence of an ionic photoacid generator. The solute (meth)acrylic copolymer comprises epoxy-functional groups, acid-functional groups, or a combination thereof. In some embodiments, an epoxy resin having on average greater than one polymerizable epoxy group per molecule or an acid comprising at least two carboxylic acid groups is utilized. The epoxy-functional groups and acid-functional groups of the (meth)acrylic copolymer or the adhesive composition can readily crosslink in the absence of an ionic photoacid generator (PAG).

Abstract: A pre-adhesive composition is described comprising an acid-functional (meth)acryloyl copolymer and epoxy resin, which when crosslinked with or without using an ionic photoacid generator (PAG) provides a (e.g. pressure-sensitive) adhesive.

Abstract: A hybrid laminated body is provided that includes a light-transmitting support, a latent release layer disposed upon the light-transmitting support, a joining layer disposed upon the latent release layer, and a polyamide thermoplastic priming layer disposed upon the joining layer. The hybrid laminated body can further include a substrate to be processed such as, for example, a silicon wafer to be ground. Also provided is a method for manufacturing the provided laminated body.

Abstract: A laminate body, method, and materials for temporary substrate support are provided. The laminate body can hold N and protect thin, brittle substrates such as flexible glass or thin semiconductor wafers during further processing such as vapor deposition or thinning by grinding. The provided laminate body, in one embodiment, includes a support, a release layer disposed upon the support, a joining layer disposed upon and in contact with the release layer, and a substrate disposed upon and in contact with the joining layer. The release layer can include an acrylic adhesive and an adhesion modifying agent.

Abstract: A hybrid laminated body is provided that includes a light-transmitting support, a latent release layer disposed upon the light-transmitting support, a joining layer disposed upon the latent release layer, and a polyamide thermoplastic priming layer disposed upon the joining layer. The hybrid laminated body can further include a substrate to be processed such as, for example, a silicon wafer to be ground. Also provided is a method for manufacturing the provided laminated body.

Abstract: A method for building three-dimensional articles using a thermal polymerization process in provided. The articles are built by using a composition that includes a thermally polymerizable composition, a thermal initiator, and a nonlinear light-to-heat conversion material such as a reverse saturable dye. The article is built by the sequential exposure of adjacent voxels with a laser beam. Microlens arrays can be used to expose more than one voxel at a time.

Abstract: Adhesives compositions and methods of preparing adhesive compositions are described. The methods generally comprise a) providing a syrup composition comprising i) a free-radically polymerizable solvent monomer; and ii) a solute (meth)acrylic copolymer; and b) radiation curing the syrup composition in the absence of an ionic photoacid generator. In one embodiment, the solute (meth)acrylic copolymer as provided or during curing comprises repeat units derived from at least one alkyl(meth)acrylate monomer, at least one ethylenically unsaturated monomer comprising an acid-functional group; and at least one (meth)acryloyl monomer comprising an epoxy-functional group; and the acid-functional groups crosslink with the epoxy-functional groups.

Abstract: A pre-adhesive composition is described comprising an acid- and epoxy-functional (meth)acryloyl copolymer, which when crosslinked using an ionic photoacid generator (PAG) provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles having desirable properties.

Abstract: A curable adhesive composition is disclosed comprising: at least one free radically polymerizable oligomer component; optionally at least one diluent monomer; at least one perfluorinated ether monomer; and a photoinitiator. The curable liquid adhesive is easily removable with low force and low adhesive transfer.

Abstract: A pre-adhesive composition is described comprising an acid- and epoxy-functional (meth)acryloyl copolymer, which when crosslinked using an ionic photoacid generator (PAG) provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles having desirable properties.

Abstract: The present invention is an article useful in the field of wafer processing, for example. The article includes a substrate, a leveling layer, a joining layer, a photothermal conversion layer and a temporary carrier. The substrate has a first major surface, a second major surface and at least one three dimensional topographical feature extending from the first major surface and having an initial step height. The leveling layer is positioned adjacent to the first major surface and reduces a topography of the substrate to between about 5% and about 95% of the initial step height. The joining layer is positioned adjacent to the leveling layer and further reduces the topography of the substrate to less than about 20% of the initial step height. The photothermal conversion layer is positioned adjacent to the joining layer and the temporary carrier is positioned adjacent the photothermal conversion layer.