Abstract: A semiconductor device according to the present disclosure includes a gate-all-around (GAA) transistor in a first device area and a fin-type field effect transistor (FinFET) in a second device area. The GAA transistor includes a plurality of vertically stacked channel members and a first gate structure over and around the plurality of vertically stacked channel members. The FinFET includes a fin-shaped channel member and a second gate structure over the fin-shaped channel member. The fin-shaped channel member includes semiconductor layers interleaved by sacrificial layers.

Abstract: A method of exposing a wafer to a high-tilt angle ion beam and an apparatus for performing the same are disclosed. In an embodiment, a method includes forming a patterned mask layer over a wafer, the patterned mask layer including a patterned mask feature; exposing the wafer to an ion beam, a surface of the wafer being tilted at a tilt angle with respect to the ion beam; and moving the wafer along a scan line with respect to the ion beam, a scan angle being defined between the scan line and an axis perpendicular to an axis of the ion beam, a difference between the tilt angle and the scan angle being less than 50°.

Abstract: Present invention is related to an extrusion equipment for processing a fibre composite. The extrusion equipment comprises a decompression and a melt tank arranged and operated vertically along with the direction of gravity. The melt tank comprises a melt tank impregnation section and a melt tank control section with a melt tank cavity as a channel condition defined within. The channel has its inner diameter or passage gradually decreased from top to bottom. The extrusion equipment provided by the present invention is configured in the direction of gravity for processing the melted thermoplastic resin and the fibre vertically for avoiding fibre fracture or breakage and improving the quality of the final products. As the melted plastic is processed vertically along with the gravity, the melted plastic could transfer or pass through the channel quickly without resulting decomposition due to the high heat and the long retention time in the cavity.

Abstract: A toolbox handle of a combination screwdriver. A handle includes a barrel and a plate seat. The barrel includes a chamber and an embedding slot. A receiving seat is movably disposed in the chamber and includes an outer sleeve and a resisting base. An outer spring elastically abuts the resisting base. A retractable assembly is inserted in the outer sleeve and includes an inner spring, a positioning rod, and an inner sleeve. A ball is disposed on the positioning recess of the positioning rod to abut the receiving seat. A pressing plate is combined to abut the positioning rod. Therefore, the receiving seat is stably positioned in the handle and is ejectable for use after being pressed.

Abstract: A toolbox handle of a combination screwdriver. A handle includes a barrel and a plate seat. The barrel includes a chamber and an embedding slot. A receiving seat is movably disposed in the chamber and includes an outer sleeve and a resisting base. An outer spring elastically abuts the resisting base. A retractable assembly is inserted in the outer sleeve and includes an inner spring, a positioning rod, and an inner sleeve. A ball is disposed on the positioning recess of the positioning rod to abut the receiving seat. A pressing plate is combined to abut the positioning rod. Therefore, the receiving seat is stably positioned in the handle and is ejectable for use after being pressed.

Abstract: Present invention is related to an extrusion equipment for processing a fibre composite. The extrusion equipment comprises a decompression and a melt tank arranged and operated vertically along with the direction of gravity. The melt tank comprises a melt tank impregnation section and a melt tank control section with a melt tank cavity as a channel condition defined within. The channel has its inner diameter or passage gradually decreased from top to bottom. The extrusion equipment provided by the present invention is configured in the direction of gravity for processing the melted thermoplastic resin and the fibre vertically for avoiding fibre fracture or breakage and improving the quality of the final products. As the melted plastic is processed vertically along with the gravity, the melted plastic could transfer or pass through the channel quickly without resulting decomposition due to the high heat and the long retention time in the cavity.

Abstract: The present application provides a gesture determining method and an electronic device. The gesture determining method includes: sensing a control gesture through at least one motion sensor, and correspondingly generating sensing data; sequentially segmenting the sensing data into a plurality of streaming windows according to a unit of time, each streaming window including a group of sensing values; determining whether a sensing value in a streaming window is greater than a critical value, and triggering subsequent gesture recognition when the sensing value is greater than the critical value; and performing a recognition operation on the streaming window by using a gesture recognition model to consecutively output a recognition result; and determining whether the recognition result meets an output condition, and outputting a predicted gesture corresponding to the recognition result when the recognition result meets the output condition.

Abstract: A calibration device includes a main control unit, an interface conversion unit and an electronic load generation unit. The electronic load generation unit provides an electronic load, so that a USB control chip generates a constant load current. The USB control chip uses at least one preset conversion parameter to generate an analog-to-digital conversion value according to the constant load current. The main control unit generates a to-be-calibrated output current according to the analog-to-digital conversion value. The main control unit generates at least one calibrated conversion parameter according to the constant load current and the to-be-calibrated output current. The USB control chip uses the at least one calibrated conversion parameter to generate a calibrated analog-to-digital conversion value, so that an over current protection mechanism is accurately enabled.

Abstract: The product detection system includes a computing device, at least one power detection instrument and a product detection device. The product detection device includes a processing unit, plural USB-C transmission ports and plural detection connection ports. A product detection method includes following steps. Firstly, at least one USB-C under-test product is connected with the plural USB-C transmission ports, and the at least one power detection instrument is connected with the plural detection connection ports. Then, the USB-C transmission port is set as a first role or a second role. Then, the USB-C transmission port corresponding to the first role is cyclically operated at plural designated voltages under control of the processing unit, and the processing unit issues an output voltage to the USB-C transmission port corresponding to the second role. Then, an operation status of the USB-C under-test product is detected.

Abstract: A camera module includes a circuit board, an image sensor, a filter removable switch, a camera lens, and a thermally conductive structure. The circuit board has a surface. The image sensor is disposed on the surface. The filter removable switch is located over the surface. The camera lens is on the light-sensing path of the image sensor. The thermally conductive structure is contacted between the circuit board and the filter removable switch and has a channel. The image sensor is located in the channel.

Abstract: The present disclosure relates to a method for use with an electronic design. Embodiments may include performing, using a processor, an electronic design process on a portion of an electronic design. Embodiments may also include automatically monitoring the electronic design process on a periodic basis using a pulse monitor to acquire one or more sampling results and storing the one or more sampling results. Embodiments may further include providing, during the electronic design process, the one or more sampling results to a graphical user interface.

Abstract: The product detection system includes a computing device, at least one power detection instrument and a product detection device. The product detection device includes a processing unit, plural USB-C transmission ports and plural detection connection ports. A product detection method includes following steps. Firstly, at least one USB-C under-test product is connected with the plural USB-C transmission ports, and the at least one power detection instrument is connected with the plural detection connection ports. Then, the USB-C transmission port is set as a first role or a second role. Then, the USB-C transmission port corresponding to the first role is cyclically operated at plural designated voltages under control of the processing unit, and the processing unit issues an output voltage to the USB-C transmission port corresponding to the second role. Then, an operation status of the USB-C under-test product is detected.

Abstract: An array substrate carrying a display area and a camera area surrounded by the display area provides connections to both areas free of electrical interference. The camera area includes a transparent area and a routing area surrounding the transparent area. The array substrate includes a first conductive layer and a second conductive layer. The first conductive layer includes first wires and first capacitance compensation patterns. The second conductive layer includes second wires. Each first capacitance compensation pattern is between adjacent first wires. Along a thickness direction of the array substrate, a projection of each first capacitance compensation pattern on the substrate overlaps with a projection of at least one second wire. A display panel and a display device are also disclosed.

Abstract: A chip package array including a plurality of chip packages is provided. The chip packages are suitable for array arrangement to form the chip package array. Each of the chip packages includes a redistribution structure, a supporting structure, a chip, and an encapsulated material. The supporting structure is disposed on the redistribution structure and has an opening. The chip is disposed on the redistribution structure and located in the opening. The encapsulated material is located between the opening and the chip, wherein the encapsulated material is filled between the opening and the chip, and the chip and the supporting structure are respectively connected to the redistribution structure.

Abstract: The present invention provides a neurological disorders decision support system that can assist an examiner to diagnose an examinee. The neurological disorders decision support system includes a user module, a screening module, an intelligent calculation module and a diagnosis module. The user module sends an inquiry to the examinee, receives a response message from the examinee, and retrieves a physiological characteristic signal of the examinee. The screening module executes a neurological examination application program to indicate to the examinee to obtain physiological characteristic signals. The screening module outputs response messages and physiological characteristic signals for the intelligent calculation module to execute an algorithm to generate an analysis report. The analysis report assists the examiner for diagnosis, and sends a diagnosis notification to the user module through the diagnosis module. The invention also provides a neurological disorders decision support method.

Abstract: A gate scanning unit circuit is applied in a display panel including a number of gate lines and a driver configured to output clock signals. The gate scanning unit circuit is configured to scan the number of gate lines. The gate scanning unit circuit includes a flip-flop and at least two output units. The flip-flop is configured to output a trigger signal. Each output unit is connected to the flip-flop and the driver. Each of the at least two output units is connected to the number of gate lines one-to-one. The output unit is configured to output a gate scan signal to the corresponding connected gate line according to the trigger signal and the clock signals.

Abstract: A chip package process includes the following steps. A supporting structure and a carrier plate are provided. The supporting structure has a plurality of openings. The supporting structure is disposed on the carrier plate. A plurality of chips is disposed on the carrier plate. The chips are respectively located in the openings of the supporting structure. An encapsulated material is formed to cover the supporting structure and the chips. The supporting structure and the chips are located between the encapsulated material and the carrier plate. The encapsulated material is filled between the openings and the chips. The carrier plate is removed. A redistribution structure is disposed on the supporting structure, wherein the redistribution structure is connected to the chips.

Abstract: An array substrate carrying a display area and a camera area surrounded by the display area provides connections to both areas free of electrical interference. The camera area includes a transparent area and a routing area surrounding the transparent area. The array substrate includes a first conductive layer and a second conductive layer. The first conductive layer includes first wires and first capacitance compensation patterns. The second conductive layer includes second wires. Each first capacitance compensation pattern is between adjacent first wires. Along a thickness direction of the array substrate, a projection of each first capacitance compensation pattern on the substrate overlaps with a projection of at least one second wire. A display panel and a display device are also disclosed.

Abstract: An array substrate which can carry a camera in a camera area seamlessly surrounded by a display area is disclosed, the camera area defines a transparent area, a first routing area adjacent to the transparent area, and a second routing area surrounding the first routing area. The array substrate includes a first substrate, a first conductive layer, a second conductive layer, a common electrode layer, a third conductive layer, a planarization layer, and a photo spacer. The planarization layer in the transparent area is in direct contact with the first substrate. The photo spacer is in the first routing area. The third conductive layer is around the transparent area and the first routing area.

Abstract: A camera module includes a circuit board, an image sensor, a filter removable switch, a camera lens, and a thermally conductive structure. The circuit board has a surface. The image sensor is disposed on the surface. The filter removable switch is located over the surface. The camera lens is on the light-sensing path of the image sensor. The thermally conductive structure is contacted between the circuit board and the filter removable switch and has a channel. The image sensor is located in the channel.