Abstract: A display area for displaying images and a camera area surrounded by the display area are both founded on an array substrate. The camera area defines a transparent area and a wire-routing area surrounding the transparent area. The array substrate includes first data lines, second data lines, and first scan lines. Each first data line, each second data line, and each first scan line avoid the transparent area and cross the wire-routing area. Each second data line includes an auxiliary data line and a data line lead. The first scan lines and the auxiliary data lines are defined by a first conductive layer, the first data lines and the data line leads are defined in a second conductive layer insulated and spaced from the first conductive layer, such a stacked arrangement allows an optically-clear path for the camera to collect light.

Abstract: A device with a display uninterrupted by a camera includes a display panel and the camera. The display device defines a display area for displaying images and a light transmission area surrounded by the display area. The camera is in the light transmission area and can collect light for images through the light transmission area.

Abstract: A gate scanning unit circuit is applied in a display panel including a number of gate lines and a driver configured to output clock signals. The gate scanning unit circuit is configured to scan the number of gate lines. The gate scanning unit circuit includes a flip-flop and at least two output units. The flip-flop is configured to output a trigger signal. Each output unit is connected to the flip-flop and the driver. Each of the at least two output units is connected to the number of gate lines one-to-one. The output unit is configured to output a gate scan signal to the corresponding connected gate line according to the trigger signal and the clock signals.

Abstract: A chip packaging method includes followings steps. A plurality of first chips are disposed on a carrier, wherein each of the first chips has a first active surface, and a plurality of first conductive pillars are disposed on the first active surface. A second active surface of a second chip is electrically connected to the first active surfaces of the first chips through a plurality of second conductive pillars. An encapsulated material is formed, wherein the encapsulated material covers the plurality of first chips, the plurality of first conductive pillars, the second chip and the plurality of second conductive pillars. The encapsulated material is partially removed to expose each of the plurality of first conductive pillars. A redistribution structure is formed on the encapsulated material, wherein the redistribution structure connects with the first conductive pillars.

Abstract: A multi-layered circuit board structure includes a first circuit board, a second circuit board, and a heat dissipation plate. The first circuit board includes a first surface. The second circuit board includes a second surface facing the first surface. The heat dissipation plate is located between the first circuit board and the second circuit board. The heat dissipation plate includes a substrate and a fixing base integrally extending from the substrate and bent. The fixing base includes a connecting plate, a first plate, and a second plate spaced apart from the first plate. The connecting plate is connected between the first plate and the second plate. The first surface is bonded to a surface of the first plate, the second surface is bonded to a surface of the second plate, and the substrate is in contact with neither the first surface nor the second surface.

Abstract: A device with a display uninterrupted by a camera includes a display panel and the camera. The display device defines a display area for displaying images and a light transmission area surrounded by the display area. The camera is in the light transmission area and can collect light for images through the light transmission area.

Abstract: A multi-layered circuit board structure includes a first circuit board, a second circuit board, and a heat dissipation plate. The first circuit board includes a first surface. The second circuit board includes a second surface facing the first surface. The heat dissipation plate is located between the first circuit board and the second circuit board. The heat dissipation plate includes a substrate and a fixing base integrally extending from the substrate and bent. The fixing base includes a connecting plate, a first plate, and a second plate spaced apart from the first plate. The connecting plate is connected between the first plate and the second plate. The first surface is bonded to a surface of the first plate, the second surface is bonded to a surface of the second plate, and the substrate is in contact with neither the first surface nor the second surface.

Abstract: A chip package structure includes a plurality of first chips, a plurality of first conductive pillars, a second chip, a plurality of second conductive pillars, an encapsulated material and a redistribution structure. Each first chip has a first active surface. Each of the first conductive pillars is disposed on the first active surface of the corresponding first chip. A second active surface of the second chip is electrically connected to the first active surfaces of the first chips through the second conductive pillars. The encapsulated material partially covers the first chips, the first conductive pillars, the second chip and the second conductive pillars. The redistribution structure is disposed on the encapsulated material and connects the first conductive pillars. A chip package structure array is also provided.

Abstract: A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.

Abstract: A chip packaging method includes followings steps. A plurality of first chips are disposed on a carrier, wherein each of the first chips has a first active surface, and a plurality of first conductive pillars are disposed on the first active surface. A second active surface of a second chip is electrically connected to the first active surfaces of the first chips through a plurality of second conductive pillars. An encapsulated material is formed, wherein the encapsulated material covers the plurality of first chips, the plurality of first conductive pillars, the second chip and the plurality of second conductive pillars. The encapsulated material is partially removed to expose each of the plurality of first conductive pillars. A redistribution structure is formed on the encapsulated material, wherein the redistribution structure connects with the first conductive pillars.

Abstract: A chip package structure includes a plurality of first chips, a plurality of first conductive pillars, a second chip, a plurality of second conductive pillars, an encapsulated material and a redistribution structure. Each first chip has a first active surface. Each of the first conductive pillars is disposed on the first active surface of the corresponding first chip. A second active surface of the second chip is electrically connected to the first active surfaces of the first chips through the second conductive pillars. The encapsulated material partially covers the first chips, the first conductive pillars, the second chip and the second conductive pillars. The redistribution structure is disposed on the encapsulated material and connects the first conductive pillars. A chip package structure array is also provided.

Abstract: The present invention discloses an electronic device charger, mainly comprising: a voltage converting module, a microprocessor, a low voltage detecting unit, and an over voltage sensing unit. When a rated output voltage of a vehicle battery of an electric vehicle is detected to be lower than a first threshold voltage by the low voltage detecting unit or found to be higher than a second threshold voltage by the over voltage sensing unit, the microprocessor immediately stops the vehicle battery providing electrical power to at least one portable electronic device owned by the driver of the electric vehicle. Therefore, the electronic device charger can not only save the energy of the vehicle battery while the vehicle battery is at a low voltage state, but also protect the portable electronic devices from being damaged by the electrical power as the rated output voltage of the vehicle battery exceed a normal voltage level.

Abstract: A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.

Abstract: A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.

Abstract: A computer-implemented method is disclosed for speeding up database access of electronic design automation (EDA) tool which utilizes a database manager for file access. The EDA tool accesses a plurality of design files, and each of the plurality of design files is associated with one of a plurality of design units for an integrated circuit (IC). The plurality of design files are encapsulated into an archive file which comprises a plurality of data units, wherein each of the data units corresponds to a design file. A request to access a design file will be redirected to access the archive file. The design file is then accessed by accessing the corresponding data unit in the archive file.

Abstract: A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.

Abstract: A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.

Abstract: A method of cleaning and drying a semiconductor wafer including inserting a semiconductor wafer into a chamber of a cleaning tool, spinning the semiconductor wafer in a range of about 300 revolutions per minute to about 1600 revolutions per minute, and simultaneously spraying the semiconductor wafer with de-ionized water and a mixture of isopropyl alcohol and nitrogen.

Abstract: The present invention discloses an electronic device charger, mainly comprising: a voltage converting module, a microprocessor, a low voltage detecting unit, and an over voltage sensing unit. When a rated output voltage of a vehicle battery of an electric vehicle is detected to be lower than a first threshold voltage by the low voltage detecting unit or found to be higher than a second threshold voltage by the over voltage sensing unit, the microprocessor immediately stops the vehicle battery providing electrical power to at least one portable electronic device owned by the driver of the electric vehicle. Therefore, the electronic device charger can not only save the energy of the vehicle battery while the vehicle battery is at a low voltage state, but also protect the portable electronic devices from being damaged by the electrical power as the rated output voltage of the vehicle battery exceed a normal voltage level.

Abstract: A rapid screening device has a sensing unit, a processing unit and a carrier, the processing unit is connected to the sensing unit, the sensing unit and the processing unit are disposed on the carrier, the sensing unit captures an image of an eyeball and outputs an image signal of the eyeball, the image of the eyeball is resolved from the image signal of the eyeball, the processing unit retrieves a plurality of images from the sensing unit within a predetermined time interval and executes an algorithm to generate a calculated result by the images of the image signals of the eyeball, and the calculated result is used to diagnose or predict a disease.