Patents by Inventor WEI CHIH LEE

WEI CHIH LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11983370
    Abstract: A two dimensional touch sensor panel can be thermoformed or curved by another process to a three-dimensional touch sensor panel, and the three-dimensional touch sensor panel can be laminated to a three-dimension surface having a highly curved or spherical shape. In some examples, thermoforming a two-dimensional touch sensor panel into a three-dimensional touch sensor panel can result in strain of the touch electrodes, and can result in non-uniform three-dimensional touch electrodes (distortion of the two-dimensional touch electrode pattern). The strain can be a function of the curved touch-sensitive surface and/or process related mechanical strain from thermoforming. In some examples, a three-dimensional touch sensor panel can be formed with uniform area touch electrodes using a two-dimensional touch sensor panel pattern with non-uniform area touch electrodes in accordance with the strain pattern expected for a given curved surface and thermoforming technique.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: May 14, 2024
    Assignee: Apple Inc.
    Inventors: Supratik Datta, Karan Jain, Zhiyuan Sun, Ho Hyung Lee, Da Yu, Wei Lin, Nathan K. Gupta, Chun-Chih Chang
  • Publication number: 20240139301
    Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 2, 2024
    Inventors: Ming-Tain LAI, Cheng-Der Tony YU, I-Ju CHEN, Wei-Han LEE, Chueh-Hao YANG, Chun-Yen TSAO, Chang-Lin HSIEH, Chien-Chih OU, Chen-En TSAI
  • Publication number: 20240132496
    Abstract: An ionic compound, an absorbent and an absorption device are provided. The ionic compound has a structure represented by Formula (I): ABn, ??Formula (I) wherein A is B is R1, R2, R3, R4, R5, and R6 are independently H, C1-6 alkyl group; and n is 1 or 2.
    Type: Application
    Filed: June 9, 2023
    Publication date: April 25, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Wei-Chih LEE, Yi-Hsiang CHEN, Chih-Hao CHEN, Ai-Yu LIOU, Jyi-Ching PERNG, Jiun-Jen CHEN
  • Patent number: 11968856
    Abstract: Exemplary subpixel structures include a directional light-emitting diode structure characterized by a full-width-half-maximum (FWHM) of emitted light having a divergence angle of less than or about 10°. The subpixel structure further includes a lens positioned a first distance from the light-emitting diode structure, where the lens is shaped to focus the emitted light from the light-emitting diode structure. The subpixel structure still further includes a patterned light absorption barrier positioned a second distance from the lens. The patterned light absorption barrier defines an opening in the barrier, and the focal point of the light focused by the lens is positioned within the opening. The subpixels structures may be incorporated into a pixel structure, and pixel structures may be incorporated into a display that is free of a polarizer layer.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: April 23, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Chung-Chih Wu, Po-Jui Chen, Hoang Yan Lin, Guo-Dong Su, Wei-Kai Lee, Chi-Jui Chang, Wan-Yu Lin, Byung Sung Kwak, Robert Jan Visser
  • Patent number: 11961777
    Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Hsiang Hu, Sih-Hao Liao
  • Patent number: 11962239
    Abstract: A control circuit of a power converter and a control method thereof are provided. The control circuit includes an error amplifier, a controller, a digital filter, and a digital pulse width signal modulator. The error amplifying circuit is coupled to an output terminal of the power converter and provides a digital error signal. The controller provides a first working parameter corresponding to the first external control command when receiving a first external control command. The digital filter generates a current digital compensation value. The digital pulse width signal modulator generates a pulse width modulation signal. The controller provides a second working parameter corresponding to the second external control command when receiving a second external control command. The controller calculates a transition value according to the second working parameter and the current digital compensation value. The controller provides the second working parameter and the transition value to the digital filter.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: April 16, 2024
    Assignee: uPI Semiconductor Corp.
    Inventors: Yun-Kuo Lee, Wei-Hsiang Wang, Yen-Chih Lin, Wei-Hsiu Hung
  • Patent number: 11956994
    Abstract: The present disclosure is generally related to 3D imaging capable OLED displays. A light field display comprises an array of 3D light field pixels, each of which comprises an array of corrugated OLED pixels, a metasurface layer disposed adjacent to the array of 3D light field pixels, and a plurality of median layers disposed between the metasurface layer and the corrugated OLED pixels. Each of the corrugated OLED pixels comprises primary or non-primary color subpixels, and produces a different view of an image through the median layers to the metasurface to form a 3D image. The corrugated OLED pixels combined with a cavity effect reduce a divergence of emitted light to enable effective beam direction manipulation by the metasurface. The metasurface having a higher refractive index and a smaller filling factor enables the deflection and direction of the emitted light from the corrugated OLED pixels to be well controlled.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: April 9, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Chung-Chih Wu, Hoang Yan Lin, Guo-Dong Su, Zih-Rou Cyue, Li-Yu Yu, Wei-Kai Lee, Guan-Yu Chen, Chung-Chia Chen, Wan-Yu Lin, Gang Yu, Byung-Sung Kwak, Robert Jan Visser, Chi-Jui Chang
  • Publication number: 20240111337
    Abstract: An electronic device including a body and a receptacle connector is provided. The body has a side wall surface, a receptacle slot located at the side wall surface, a waterproof protrusion protruding from the side wall surface, and two gutters located at the side wall surface, where the waterproof protrusion is located above the receptacle slot, and the two gutters are respectively located at two opposite sides of the receptacle slot. The receptacle connector is disposed in the receptacle slot.
    Type: Application
    Filed: May 8, 2023
    Publication date: April 4, 2024
    Applicant: Acer Incorporated
    Inventors: Wei-Chih Wang, Chen-Min Hsiu, Chien-Yu Lee, Szu-Wei Yang, Fang-Ying Huang
  • Publication number: 20240107731
    Abstract: The present disclosure provides a matte-type electromagnetic interference shielding film including bio-based components, which includes a bio-based insulating layer, a bio-based adhesive layer, a metal layer, and a bio-based electrically conductive adhesive layer. The matte-type electromagnetic interference shielding film including the bio-based component of the present disclosure has a matte appearance and high bio-based content and has the advantages of good surface insulation, high surface hardness, good chemical resistance, high shielding performance, good adhesion strength, low transmission loss, high transmission quality, good operability, high heat resistance, and the inner electrically conductive adhesive layer with long shelf life and storage life. The present disclosure further provides a preparation method thereof.
    Type: Application
    Filed: July 14, 2023
    Publication date: March 28, 2024
    Inventors: Bo-Sian DU, Wei-Chih LEE, Chia-Hua HO, Chih-Ming LIN, Chien-Hui LEE
  • Patent number: 11935981
    Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: March 19, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Chu-Jih Su, Chia-Hsiang Chou, Wei-Chih Peng, Wen-Luh Liao, Chao-Shun Huang, Hsuan-Le Lin, Shih-Chang Lee, Mei Chun Liu, Chen Ou
  • Publication number: 20230065194
    Abstract: An electromagnetic interference shielding film includes an insulation layer, a first adhesive layer, a porous metal layer and a conductive adhesive layer including a plurality of conductive particles. The first adhesive layer is located between the insulation layer and the porous metal layer, and the porous metal layer is formed on the first adhesive layer, and making the first adhesive layer locate between the porous metal layer and the insulation layer. The conductive adhesive layer is located on the porous metal layer so that the porous metal layer is located between the first adhesive layer and the conductive adhesive layer. The present invention further provides a preparation method thereof.
    Type: Application
    Filed: August 30, 2022
    Publication date: March 2, 2023
    Inventors: Wei-Chih Lee, Chih-Ming Lin, Chia-Hua Ho, Chien-Hui Lee
  • Patent number: 11116074
    Abstract: A colored thin covering film is provided, including an upper detached layer, a colored ink film, a low dielectric glue layer, and a lower detached layer. The color ink layer is formed between the upper detached layer and the low dielectric glue layer. The low dielectric glue layer is formed between the colored ink layer and the lower detached layer. The thickness of the colored ink layer is between 1 to 10 ?m, and the thickness of the low dielectric glue layer is between 3 to 25 ?m, such that a total thickness of the colored ink layer and the low dielectric glue layer is allowed to be between 4 to 35 ?m. The colored thin covering film has an extremely low dielectric constant and loss, extremely low ion migration, good adhesion, heat dissipation, high flexibility, and low resilience, and can be processed in a low temperature.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: September 7, 2021
    Assignee: ASIA ELECTRONIC MATERIAL CO., LTD.
    Inventors: Wei-Chih Lee, Li-Chih Yang, Chien-Hui Lee
  • Patent number: 11045785
    Abstract: A metal organic framework and a method for preparing the same, and an adsorption device employing the metal organic framework are provided. The metal organic framework includes a 3,5-pyridinedicarboxylic acid and a metal ion, which is an aluminum ion, a chromium ion, or a zirconium ion, wherein the 3,5-pyridinedicarboxylic acid is coordinated to the metal ion.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: June 29, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wei-Chih Lee, Chang-Yi Shen, Jiun-Jen Chen, Yuhao Kang, Shih-Yun Yen, Yu-Xuan Wang
  • Publication number: 20200139343
    Abstract: A metal organic framework and a method for preparing the same, and an adsorption device employing the metal organic framework are provided. The metal organic framework includes a 3,5-pyridinedicarboxylic acid and a metal ion, which is an aluminum ion, a chromium ion, or a zirconium ion, wherein the 3,5-pyridinedicarboxylic acid is coordinated to the metal ion.
    Type: Application
    Filed: November 4, 2019
    Publication date: May 7, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Wei-Chih LEE, Chang-Yi SHEN, Jiun-Jen CHEN, Yuhao KANG, Shih-Yun YEN, Yu-Xuan WANG
  • Publication number: 20200139342
    Abstract: A metal organic framework and a method for preparing the same, and an adsorption device employing the metal organic framework are provided. The metal organic framework includes a 3,5-pyridinedicarboxylic acid and a metal ion, which is an aluminum ion, a chromium ion, or a zirconium ion, wherein the 3,5-pyridinedicarboxylic acid is coordinated to the metal ion.
    Type: Application
    Filed: December 10, 2018
    Publication date: May 7, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Wei-Chih LEE, Chang-Yi SHEN, Jiun-Jen CHEN, Yuhao KANG, Shih-Yun YEN
  • Publication number: 20180249572
    Abstract: A colored thin covering film is provided, including an upper detached layer, a colored ink film, a low dielectric glue layer, and a lower detached layer. The color ink layer is formed between the upper detached layer and the low dielectric glue layer. The low dielectric glue layer is formed between the colored ink layer and the lower detached layer. The thickness of the colored ink layer is between 1 to 10 ?m, and the thickness of the low dielectric glue layer is between 3 to 25 ?m, such that a total thickness of the colored ink layer and the low dielectric glue layer is allowed to be between 4 to 35 ?m. The colored thin covering film has an extremely low dielectric constant and loss, extremely low ion migration, good adhesion, heat dissipation, high flexibility, and low resilience, and can be processed in a low temperature.
    Type: Application
    Filed: December 14, 2017
    Publication date: August 30, 2018
    Inventors: Wei-Chih Lee, Li-Chih Yang, Chien-Hui Lee
  • Patent number: 9743177
    Abstract: A waterproof structure for a microphone includes a single-directional sound head disposed within an upper sleeve, which is disposed above a fixing seat having two fixing end portions, wherein a peripheral wall interconnecting the fixing end portions is formed with an insert hole. An empty tube is inserted into the insert hole in the fixing seat. Top and bottom covers are mounted respectively on the upper fixing end portion of the upper sleeve and a lower fixing end portion of the fixing seat, wherein each of the top and bottom covers is formed with a central through hole. Three pieces of breathable waterproof fabric are disposed between the top cover and the upper fixing end portion of the upper sleeve and another six pieces are disposed between the bottom cover and the lower fixing end portion of the fixing seat.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: August 22, 2017
    Assignee: TAIWANMIC INC.
    Inventor: Wei-Chih Lee
  • Publication number: 20170164104
    Abstract: A waterproof structure for a microphone includes a single-directional sound head disposed within an upper sleeve, which is disposed above a fixing seat having two fixing end portions, wherein a peripheral wall interconnecting the fixing end portions is formed with an insert hole. An empty tube is inserted into the insert hole in the fixing seat. Top and bottom covers are mounted respectively on the upper fixing end portion of the upper sleeve and a lower fixing end portion of the fixing seat, wherein each of the top and bottom covers is formed with a central through hole. Three pieces of breathable waterproof fabric are disposed between the top cover and the upper fixing end portion of the upper sleeve and another six pieces are disposed between the bottom cover and the lower fixing end portion of the fixing seat.
    Type: Application
    Filed: April 14, 2016
    Publication date: June 8, 2017
    Applicant: TAIWANMIC INC.
    Inventor: Wei-Chih LEE
  • Publication number: 20170133150
    Abstract: A customized SMD power inductor includes a magnetic substrate, a coil structure, a magnetic coating structure, and a terminal electrode structure. The coil structure is disposed on the magnetic substrate. The magnetic coating structure is disposed on the magnetic substrate to cover the coil structure. The magnetic coating structure includes a middle coating layer and a top coating layer, and the middle coating layer has a middle filling portion and a surrounding perimeter portion. The magnetic substrate has a first predetermined relative permeability, the surrounding perimeter portion has a second predetermined relative permeability, the middle filling portion has a third predetermined relative permeability, and the top coating layer has a fourth predetermined relative permeability. The electrical property of the customized SMD power inductor is adjusted according to numerical values of the first, the second, the third, and the fourth predetermined relative permeability.
    Type: Application
    Filed: November 6, 2015
    Publication date: May 11, 2017
    Inventor: WEI-CHIH LEE
  • Patent number: 9400566
    Abstract: A driving method for a display panel is provided. The display panel includes at least a first common signal line, at least a second common signal line and a plurality of pixels arranged as a pixel array. The pixel array includes a first pixel row and a second pixel row electrically connected to the first common signal line and the second common signal line, respectively. The driving method includes steps of: generating a first AC common signal; generating a second AC common signal, wherein the first AC common signal and the second AC common signal are inverse to each other; and providing the first and second AC common signal to the first and second pixel rows through the first and second common signal lines, respectively, by way of N-frame switch, wherein N is a positive integer.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: July 26, 2016
    Assignee: AU OPTRONICS CORP.
    Inventors: Wei-Chun Hsu, Yu-Hsin Ting, Wei-Chih Lee, Chung-Lin Fu, Nan-Ying Lin