Patents by Inventor WEI CHIH LEE
WEI CHIH LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9400566Abstract: A driving method for a display panel is provided. The display panel includes at least a first common signal line, at least a second common signal line and a plurality of pixels arranged as a pixel array. The pixel array includes a first pixel row and a second pixel row electrically connected to the first common signal line and the second common signal line, respectively. The driving method includes steps of: generating a first AC common signal; generating a second AC common signal, wherein the first AC common signal and the second AC common signal are inverse to each other; and providing the first and second AC common signal to the first and second pixel rows through the first and second common signal lines, respectively, by way of N-frame switch, wherein N is a positive integer.Type: GrantFiled: October 24, 2013Date of Patent: July 26, 2016Assignee: AU OPTRONICS CORP.Inventors: Wei-Chun Hsu, Yu-Hsin Ting, Wei-Chih Lee, Chung-Lin Fu, Nan-Ying Lin
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Patent number: 9177710Abstract: A SMD transformer structure includes a substrate unit, a magnetic unit, a coil unit and a shielding unit. The substrate unit includes a support substrate. The magnetic unit includes at least one magnetic material core bar disposed on the support substrate. The coil unit includes at least one transformer coil assembly wound around the magnetic material core bar. The transformer coil assembly includes a plurality of transformer coils wound around the magnetic material core bar, and each transformer coil has two opposite end portions respectively and electrically connected to the corresponding first electrode and the corresponding second electrode of the substrate unit. The shielding unit includes at least one magnetic shielding board disposed on the magnetic material core bar. Whereby, the SMD transformer structure not only can be simplified to reduce its size, but also can be automatically manufactured to increase its production efficiency and product yield (reliability).Type: GrantFiled: December 9, 2013Date of Patent: November 3, 2015Assignee: INPAQ TECHNOLOGY CO., LTD.Inventors: Wei-Chih Lee, Cgia-Uch Wu
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Publication number: 20150162121Abstract: A SMD transformer structure includes a substrate unit, a magnetic unit, a coil unit and a shielding unit. The substrate unit includes a support substrate. The magnetic unit includes at least one magnetic material core bar disposed on the support substrate. The coil unit includes at least one transformer coil assembly wound around the magnetic material core bar. The transformer coil assembly includes a plurality of transformer coils wound around the magnetic material core bar, and each transformer coil has two opposite end portions respectively and electrically connected to the corresponding first electrode and the corresponding second electrode of the substrate unit. The shielding unit includes at least one magnetic shielding board disposed on the magnetic material core bar. Whereby, the SMD transformer structure not only can be simplified to reduce its size, but also can be automatically manufactured to increase its production efficiency and product yield (reliability).Type: ApplicationFiled: December 9, 2013Publication date: June 11, 2015Applicant: INPAQ TECHNOLOGY CO., LTD.Inventors: WEI-CHIH LEE, CGIA-UCH WU
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Publication number: 20140347259Abstract: A driving method for a display panel is provided. The display panel includes at least a first common signal line, at least a second common signal line and a plurality of pixels arranged as a pixel array. The pixel array includes a first pixel row and a second pixel row electrically connected to the first common signal line and the second common signal line, respectively. The driving method includes steps of: generating a first AC common signal; generating a second AC common signal, wherein the first AC common signal and the second AC common signal are inverse to each other; and providing the first and second AC common signal to the first and second pixel rows through the first and second common signal lines, respectively, by way of N-frame switch, wherein N is a positive integer.Type: ApplicationFiled: October 24, 2013Publication date: November 27, 2014Applicant: AU OPTRONICS CORP.Inventors: Wei-Chun HSU, Yu-Hsin TING, Wei-Chih LEE, Chung-Lin FU, Nan-Ying LIN
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Patent number: 8853450Abstract: A method for hydrating a nitrile derivative to generate an amide derivative is provided. The method includes mixing the nitrile derivative with a ruthenium catalyst complex in an aqueous solution to form a mixture, and reacting the nitrile derivative with water in the aqueous solution and in the presence of the ruthenium catalyst complex to form a reacted mixture comprising the amide derivative. The ruthenium catalyst complex is represented by the following structural formula: RuX2(L)n, wherein X is an anionic ligand, L is a bifunctional phosphine ligand, and n is 3 or 4.Type: GrantFiled: October 18, 2012Date of Patent: October 7, 2014Assignee: Board of Regents of the Nevada System of Higher Education, on behalf of the University of Nevada, RenoInventors: Brian J. Frost, Wei-Chih Lee
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Publication number: 20140292462Abstract: A power inductor and its fabrication method are disclosed. The power inductor comprises a lower substrate, a coil provided on the lower substrate, and an intermediate layer which encloses the coil, wherein the lower substrate can be a soft magnetic entrainer or a non-magnetic entrainer. The coil is made of a conductive wire coated with insulated layer, and the intermediate layer is a material consisting of magnetic properties. The steps of fabrication consists of: forming a base conductive pole on the upper surface of the lower substrate, putting the coil connected to said base conductive pole, and enveloping said coil with magnetic material.Type: ApplicationFiled: March 28, 2013Publication date: October 2, 2014Applicant: INPAQ TECHNOLOGY CO., LTD.Inventor: Wei-Chih LEE
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Patent number: 8707547Abstract: A lead-frameless power inductor and its fabrication method are disclosed. The power inductor comprises a lower substrate, a coil provided on the lower substrate, and an intermediate layer which encloses the coil, wherein the lower substrate can be a soft magnetic entrainer or a non-magnetic entrainer. The coil is made of an insulated wire, and the intermediate layer is a colloid consisting of magnetic powder. A method for fabricating the lead-frameless power inductor includes steps of preparing a lower substrate; forming a plurality of conducting metal layers on the lower substrate; forming a wire package on an upper surface of said lower substrate; coating a surface of said wire package with a magnetic powder; dividing the substrate into a plurality of granulated elements by cutting process; and forming the conducting metal layer on both sides of the element to form a surface mounting device.Type: GrantFiled: July 12, 2012Date of Patent: April 29, 2014Assignee: Inpaq Technology Co., Ltd.Inventor: Wei Chih Lee
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Publication number: 20140015630Abstract: A lead-frameless power inductor and its fabrication method are disclosed. The power inductor comprises a lower substrate, a coil provided on the lower substrate, and an intermediate layer which encloses the coil, wherein the lower substrate can be a soft magnetic entrainer or a non-magnetic entrainer. The coil is made of an insulated wire, and the intermediate layer is a colloid consisting of magnetic powder. The steps of fabrication are: forming a wire package to fix on the upper surface of the lower substrate, wherein the wire package is formed of a lacquer insulated copper wire or the like, then coated with a colloid consisting of the magnetic powder, and then is cutting into granulated elements and forming in order.Type: ApplicationFiled: July 12, 2012Publication date: January 16, 2014Inventor: Wei-Chih LEE
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Patent number: 8556509Abstract: An active/self-sensing compensating hydrostatic bearing is disposed between first and second structures to allow relative movement between the first and second structures. The hydrostatic bearing includes a body and a compensator. The body, fixed to the first structure and separated from the second structure by a first gap, has a chamber and an input passage and an output passage both communicating with the chamber. The compensator is disposed in the chamber. A compensating passage, communicating with the input passage and the output passage, is formed between the body and the compensator. A pressurized fluid flows from the input passage to the output passage through the compensating passage, and the pressurized fluid in the output passage flows to the first gap to maintain the stability and the rigidity for the relative movement between the first and second structures. A hydrostatic bearing module using the hydrostatic bearing is also disclosed.Type: GrantFiled: January 24, 2012Date of Patent: October 15, 2013Assignee: National Tsing Hua UniversityInventors: Cheng-Kuo Sung, Zhang-Hua Fong, Jia-Wei Lu, Yu-Min Hung, Wei-Chih Lee
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Patent number: 8518127Abstract: A manufacturing method of solid capacitors includes the following steps. First step is forming a plurality of separated adhesive layer on an insulating substrate. Next step is disposing valve-metal wires on the adhesive layers. Next step is forming a conductive layer on the adhesive layer and the valve-metal wires. Next step is forming a dielectric structure on the exposed surface of the valve-metal wires and the conductive layer. Next step is forming a hydrophobic layer and a conductive unit. Next step is separating the formed structures as individual capacitors. Next step is packaging the formed structures and forming terminals connected to the formed structures.Type: GrantFiled: July 5, 2011Date of Patent: August 27, 2013Assignees: INPAQ Technology Co., Ltd., APAQ Technology Co., Ltd.Inventors: Wei-Chih Lee, Ming-Tsung Chen
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Patent number: 8422200Abstract: A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.Type: GrantFiled: May 25, 2011Date of Patent: April 16, 2013Assignees: Inpaq Technology Co., Ltd., Apaq Technology Co., Ltd.Inventors: Wei-Chih Lee, Ming-Tsung Chen
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Publication number: 20130062656Abstract: A thermally enhanced optical package includes a heat conducting module configured to dissipate the heat generated from an optical device, a plurality of insulating pads disposed on a heat conducting substrate, and at least one electrical conducting pad disposed on the insulating pads. The heat conducting module includes a heat conducting substrate and a plurality of heat conducting pillars, and the optical device is a light emitting diode chip or a light emitting diode die in the present embodiments. The thermally enhanced optical package is further characterized in a simple manufacturing procedure, including substantially an electrical or electroless plating process, a metal foil laminating process, a thick film printing process, and a patterning and etching process.Type: ApplicationFiled: September 13, 2011Publication date: March 14, 2013Applicant: INPAQ TECHNOLOGY CO., LTD.Inventors: WEI CHIH LEE, SHIH KWAN LIU, HUAI LUH CHANG
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Publication number: 20130016927Abstract: An active/self-sensing compensating hydrostatic bearing is disposed between first and second structures to allow relative movement between the first and second structures. The hydrostatic bearing includes a body and a compensator. The body, fixed to the first structure and separated from the second structure by a first gap, has a chamber and an input passage and an output passage both communicating with the chamber. The compensator is disposed in the chamber. A compensating passage, communicating with the input passage and the output passage, is formed between the body and the compensator. A pressurized fluid flows from the input passage to the output passage through the compensating passage, and the pressurized fluid in the output passage flows to the first gap to maintain the stability and the rigidity for the relative movement between the first and second structures. A hydrostatic bearing module using the hydrostatic bearing is also disclosed.Type: ApplicationFiled: January 24, 2012Publication date: January 17, 2013Inventors: Cheng-Kuo SUNG, Zhang-Hua Fong, Jia-Wei Lu, Yu-Min Hung, Wei-Chih Lee
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Publication number: 20130010402Abstract: A manufacturing method of solid capacitors includes the following steps. First step is forming a plurality of separated adhesive layer on an insulating substrate. Next step is disposing valve-metal wires on the adhesive layers. Next step is forming a conductive layer on the adhesive layer and the valve-metal wires. Next step is forming a dielectric structure on the exposed surface of the valve-metal wires and the conductive layer. Next step is forming a hydrophobic layer and a conductive unit. Next step is separating the formed structures as individual capacitors. Next step is packaging the formed structures and forming terminals connected to the formed structures.Type: ApplicationFiled: July 5, 2011Publication date: January 10, 2013Applicants: APAQ TECHNOLOGY CO., LTD., INPAQ TECHNOLOGY CO., LTD.Inventors: WEI-CHIH LEE, MING-TSUNG CHEN
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Publication number: 20120300369Abstract: A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.Type: ApplicationFiled: May 25, 2011Publication date: November 29, 2012Applicants: APAQ TECHNOLOGY CO., LTD., INPAQ TECHNOLOGY CO., LTD.Inventors: WEI-CHIH LEE, Ming-Tsung Chen
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Publication number: 20120281338Abstract: An aluminum electrolytic capacitor includes an aluminum foil substrate, a porous aluminum layer, an insulating layer, an electrically conductive polymer material, an electrically conductive material, and at least two terminal electrodes. The porous aluminum layer is attached to the aluminum foil substrate. The insulating layer is formed on the porous aluminum layer. The electrically conductive polymer material overlays the insulating layer. The terminal electrodes respectively connect to the aluminum foil and the electrically conductive material.Type: ApplicationFiled: May 5, 2011Publication date: November 8, 2012Applicant: INPAQ TECHNOLOGY CO., LTD.Inventors: WEI CHIH LEE, SHIH KWAN LIU