Patents by Inventor Wei Fang

Wei Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11855164
    Abstract: A semiconductor device includes a substrate, a semiconductor fin extending from the substrate, a gate dielectric layer over the semiconductor fin, a metal nitride layer comprising a first portion over the gate dielectric layer and a second portion over the first portion, and a fill layer over the metal nitride layer. The second portion has an aluminum concentration greater than an aluminum concentration of the first portion.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Cheng-Ming Lin, Peng-Soon Lim, Zi-Wei Fang
  • Patent number: 11854762
    Abstract: The present invention provides a MEMS sample holder comprising an observation section. The observation section includes a first layer, a second layer, and a sample compartment between the first layer and the second layer. The sample compartment is configured for filling a liquid sample and observing the liquid sample filled therewithin. The sample compartment has one, two or more windows through which an electron beam can pass. Each of the windows is formed on two cavities including a first cavity on the first layer and a second cavity on the second layer that is opposite to the first cavity across the sample compartment.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: December 26, 2023
    Assignee: BORRIES PTE. LTD.
    Inventors: Wei Fang, Xiaoming Chen, Daniel Tang, Liang-Fu Fan, Zhongwei Chen
  • Patent number: 11854763
    Abstract: The present invention provides a backscattered electron (BSE) detector comprising two or more detection components that are electrically isolated from each other. Each of the detection components includes a single continuous top metal layer configured for directly receiving incident backscattered electrons and for backscattered electron to penetrate therethrough. The thickness of one of the top metal layers is different from the thickness of another one of the top metal layers. The BSE detector can be used in an apparatus of charged-particle beam for imaging a sample material. Signals from the detection components having top metal layers of different thicknesses can be inputted into different signal amplifier circuits to get different energy bands of BSE image.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: December 26, 2023
    Assignee: BORRIES PTE. LTD.
    Inventors: Wei Fang, Xiaoming Chen, Daniel Tang, Liang-Fu Fan, Zhongwei Chen
  • Publication number: 20230411389
    Abstract: Disclosed are semiconductor devices including a substrate, a first transistor formed over a first portion of the substrate, wherein the first transistor comprises a first nanosheet stack including N nanosheets and a second transistor over a second portion of the substrate, wherein the second transistor comprises a second nanosheet stack including M nanosheets, wherein N is different from M in which the first and second nanosheet stacks are formed on first and second substrate regions that are vertically offset from one another.
    Type: Application
    Filed: August 10, 2023
    Publication date: December 21, 2023
    Inventors: Te-Hsin CHIU, Kam-Tou SIO, Shang-Wei FANG, Wei-Cheng LIN, Jiann-Tyng TZENG
  • Publication number: 20230401372
    Abstract: An integrated circuit (IC) includes first through fourth nano-sheet structures extending in a first direction and having respective first through fourth widths along a second direction perpendicular to the first direction, and first through fourth via structures electrically connected to corresponding ones of the first through fourth nano-sheet structures. The second width has a value greater than that of the third width. A width of the second via structure along the second direction has a value greater than that of a width of the third via structure along the second direction. The second and third nano-sheet structures are positioned between the first and fourth nano-sheet structures. The second and third via structures are configured to electrically connect the second and third nano-sheet structures to a first portion of a back-side power distribution structure configured to carry one of a power supply voltage or a reference voltage.
    Type: Application
    Filed: August 10, 2023
    Publication date: December 14, 2023
    Inventors: Shang-Wei FANG, Kam-Tou SIO, Wei-Cheng LIN, Jiann-Tyng TZENG, Lee-Chung LU, Yi-Kan CHENG, Chung-Hsing WANG
  • Patent number: 11842420
    Abstract: A method for aligning a wafer image with a reference image, comprising: searching for a targeted reference position on the wafer image for aligning the wafer image with the reference image; and in response to a determination that the targeted reference position does not exist: defining a current lock position and an area that encloses the current lock position on the wafer image; computing an alignment score of the current lock position; comparing the alignment score of the current lock position with stored alignment scores of positions previously selected in relation to aligning the wafer image with the reference image; and aligning the wafer image with the reference image based on the comparison.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: December 12, 2023
    Assignee: ASML Netherlands B.V.
    Inventors: Wei Fang, Lingling Pu
  • Patent number: 11839062
    Abstract: A cooling assembly includes an evaporator containing a primary cooling medium, a passive condenser, and a heat exchanger. When a secondary cooling medium is provided to the heat exchanger, the primary cooling medium in the gas phase switches from being received by the passive condenser to the heat exchanger without operating any valves located between the evaporator and the passive condenser and between the evaporator and the heat exchanger. The primary cooling medium circulates between the evaporator and the passive condenser and between the evaporator and the heat exchanger by natural circulation and gravity without a pump in the flow path of the primary cooling medium between the heat exchanger and the evaporator and between the passive condenser and the evaporator to circulate the primary cooling medium.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: December 5, 2023
    Assignee: Munters Corporation
    Inventors: Michael Boucher, Rafael Neuwald, Bryan Keith Dunnavant, John Roberts, Paul A. Dinnage, Wei Fang
  • Publication number: 20230386021
    Abstract: A pattern grouping method may include receiving an image of a first pattern, generating a first fixed-dimensional feature vector using trained model parameters applying to the received image, and assigning the first fixed-dimensional feature vector a first bucket ID. The method may further include creating a new bucket ID for the first fixed-dimensional feature vector in response to determining that the first pattern does not belong to one of a plurality of buckets corresponding to defect patterns, or mapping the first fixed-dimensional feature vector to the first bucket ID in response to determining that the first pattern belongs to one of a plurality of buckets corresponding to defect patterns.
    Type: Application
    Filed: August 3, 2023
    Publication date: November 30, 2023
    Inventors: Wei FANG, Zhaohui GUO, Ruoyu ZHU, Chuan LI
  • Patent number: 11829474
    Abstract: The present invention provides a text classification backdoor attack method, system, device and a computer storage medium. The method includes: training a pretraining model by using a clean training set to obtain a clean model; generating a pseudo label data set by using a positioning label generator; performing multi-task training on a Sequence-to-Sequence model by using the pseudo label data set to obtain a locator model; generating a backdoor data set by using the locator model; and training the clean model by using the backdoor data set to obtain a dirty model. A pseudo label data set is generated by using a pretrained clean model without manual annotation. A backdoor attack location in a text sequence may be dynamically predicted by using a locator model based on a Sequence-to-Sequence and multi-task learning architecture without manual intervention, and a performance indicator obtained by dynamically selecting an attack location is better.
    Type: Grant
    Filed: July 21, 2023
    Date of Patent: November 28, 2023
    Assignee: JIANGNAN UNIVERSITY
    Inventors: Hengyang Lu, Chenyou Fan, Wei Fang, Jun Sun, Xiaojun Wu
  • Patent number: 11818049
    Abstract: Disclosed are a system comprising a computer-readable storage medium storing at least one program, and a computer-implemented method for event messaging over a network. A subscription interface receives data indicative of a subscription request for sessionized data. An allocation module allocates a sessionizer bank linked to the subscription request. A messaging interface module provisions identifiers linked to the respective processing engines of the sessionizer bank. The messaging interface module registers the allocated sessionizer bank as available to process event messages matching the subscription request by providing the provisioned identifiers. The messaging interface module receives event messages from a producer device linked by a collection server to a selected one of the processing engines of the sessionizer bank. The selected one of the processing engine processes the received event messages in accordance with session rule data linked to the subscription request to generate sessionized data.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: November 14, 2023
    Assignee: eBay Inc.
    Inventors: Sharad R. Murthy, Bhaven Avalani, Hongyue Nemo Chen, Tony Chung Tung Ng, Weiwei Jin, Xinglang Wang, Mingming Wang, Wei Fang
  • Publication number: 20230357670
    Abstract: Provided are a polysaccharide composition and method capable of reducing, whether during pre-wear immersion or during post-wear cleaning, the amount of protein adsorbed on hard contact lenses and orthokeratology lenses. The polysaccharide composition and method reduce the amount of protein adsorbed on hard contact lenses and thereby prevent corneal abrasions and inflammations of the conjunctiva and cornea.
    Type: Application
    Filed: August 8, 2022
    Publication date: November 9, 2023
    Applicant: National Taipei University of Technology
    Inventors: Hsu-Wei Fang, Chen-Ying Su, You-Cheng Chang, Pin-Hsuan Huang, Ling-Hsiang Hsu
  • Publication number: 20230355394
    Abstract: Provided is an orthopedic composition, including: a powder composition including calcium sulfate hemihydrate, ?-tricalcium phosphate and hydroxypropyl methylcellulose; and a solvent including glycerol and water. The orthopedic composition exhibits improved washout resistance. A method of manufacturing the orthopedic composition and a bone graft set including the orthopedic composition are further provided.
    Type: Application
    Filed: September 15, 2022
    Publication date: November 9, 2023
    Applicant: National Taipei University of Technology
    Inventors: Hsu-Wei Fang, Hsiao-Hung Chiang, Chen-Ying Su
  • Patent number: 11805592
    Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: October 31, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chaojun Deng, Fei Ma, Wei Fang, Zhiwen Yang, Chungang Li, Shun Hao
  • Patent number: 11802744
    Abstract: An exhaust heat recovery boiler includes: a duct casing in which exhaust gas flows; a tubular extending portion extending upward from the duct casing; a heat exchanger tube located in the duct casing; a hammering rod connected to the heat exchanger tube in the duct casing and passing through an inside of the extending portion, the hammering rod including an upper part projecting to an outside of the extending portion; and an annular sleeve attached to the upper part of the hammering rod through a packing. The extending portion includes an upper flat surface which is located at an upper end of the extending portion, realizes a seal between the upper flat surface and a lower surface of the sleeve, and is annular and flat.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: October 31, 2023
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Ryo Nakamura, Yukihiro Takenaka, Takuro Nozoe, Tatsuo Ino, Atsushi Yukioka, Shuji Yamamoto, Toshinori Tanaka, Hao Zhang, Wei Fang
  • Patent number: 11791127
    Abstract: A wafer inspection system includes a controller in communication with an electron-beam inspection tool. The controller includes circuitry to: acquire, via an optical imaging tool, coordinates of defects on a sample; set a Field of View (FoV) of the electron-beam inspection tool to a first size to locate a subset of the defects; determine a position of each defect of the subset of the defects based on inspection data generated by the electron-beam inspection tool during a scanning of the sample; adjust the coordinates of the defects based on the determined positions of the subset of the defects; and set the FoV of the electron-beam inspection tool to a second size to locate additional defects based on the adjusted coordinates.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: October 17, 2023
    Assignee: ASML Netherlands B.V.
    Inventors: Wei Fang, Joe Wang
  • Patent number: 11792003
    Abstract: Distributed storage system and method for transmitting storage-related messages between host computers in a distributed storage system uses a handshake operation of a first-type communication connection between a source data transport daemon of a source host computer and a target data transport daemon of a target host computer to derive a symmetric key at each of the source and target data transport daemons. The two symmetric keys are sent to a source data transport manager of the source host computer and to a target data transport manager of the target host computer. The source and target data transport managers then use the same symmetric keys to encrypt and decrypt storage-related messages that are transmitted from the source data transport manager to the target data transport manager through multiple second-type communication connections between the source and target data transport managers.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: October 17, 2023
    Assignee: VMWARE, INC.
    Inventors: Haoran Zheng, Tao Xie, Wei Fang, Anil Chintalapati, Jing Liu
  • Publication number: 20230327673
    Abstract: A main board, a hot plug control signal generator, and a control signal generating method thereof are provided. The hot plug control signal generator includes a controller and a latch. The controller provides a control signal. The latch is operated based on an operation power to generate a hot plug control signal. The latch sets the hot plug control signal to a disabled first logic value, and latches the hot plug control signal at the first logic value.
    Type: Application
    Filed: June 27, 2022
    Publication date: October 12, 2023
    Applicant: Wiwynn Corporation
    Inventors: Wei-Fang Chang, Yu-Chun Chen, Nan-Huan Lin, Chung-Hui Yen, Shi-Rui Chen
  • Publication number: 20230327004
    Abstract: A semiconductor device includes a semiconductor fin, a gate structure, a doped semiconductor layer, and a dielectric structure. The semiconductor fin has a top portion and a lower portion extending from the top portion to a substrate. The gate structure extends across the semiconductor fin. The doped semiconductor layer interfaces the top portion of the semiconductor fin. In a cross-section taken along a lengthwise direction of the gate structure, the doped semiconductor layer has an outer profile conformal to a profile of the top portion of the semiconductor fin.
    Type: Application
    Filed: May 31, 2023
    Publication date: October 12, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yao-Sheng HUANG, Hung-Chang SUN, I-Ming CHANG, Zi-Wei FANG
  • Patent number: 11769317
    Abstract: Disclosed herein is a method of automatically obtaining training images to train a machine learning model that improves image quality. The method may comprise analyzing a plurality of patterns of data relating to a layout of a product to identify a plurality of training locations on a sample of the product to use in relation to training the machine learning model. The method may comprise obtaining a first image having a first quality for each of the plurality of training locations, and obtaining a second image having a second quality for each of the plurality of training locations, the second quality being higher than the first quality. The method may comprise using the first image and the second image to train the machine learning model.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: September 26, 2023
    Assignee: ASML Netherlands B.V.
    Inventors: Wentian Zhou, Liangjiang Yu, Teng Wang, Lingling Pu, Wei Fang
  • Publication number: 20230288647
    Abstract: Embodiments of this application provide an optical fiber ferrule, where n rows of optical fiber holes are symmetrically distributed on a mating end face of the ferrule, n>=3, and n is an odd number. Based on the layout design of optical fiber holes on the optical fiber ferrule, this application provides an optical fiber connector that includes a plurality of rows of optical fiber holes and that is compatible with one row and a relatively small number of rows of optical fiber holes, so that an optical fiber connector with a large number of cores can be forward compatible with an optical fiber connector with a small number of cores, thereby improving expandability and compatibility of the optical fiber ferrule.
    Type: Application
    Filed: March 15, 2023
    Publication date: September 14, 2023
    Inventors: Hualiang SHI, Banghong HU, Wei FANG, Chungang LI, Yiguo QI, Juanjuan CAO