Patents by Inventor Wei Fu
Wei Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240146014Abstract: The present disclosure discloses a hundred-kilowatts-level monolithic fiber laser based on auxiliary lasers and hybrid cladding pumping scheme. Multi-wavelength auxiliary lasers and a signal laser are simultaneously coupled into a core of a gain fiber, and the gain fiber provides gains for the auxiliary lasers and the signal laser under multi-wavelength cladding pumping. The multi-wavelength auxiliary lasers and the signal laser are sequentially amplified under the action of gain competition, and the amplification of signal laser is suppressed at a front segment of the gain fiber, while the signal laser is effectively amplified at a rear segment of the gain fiber after the multi-wavelength auxiliary lasers are reabsorbed; quantum defects generated are reduced, and uniformly distributed thermal loads will be achieved, and the bearing capacity of laser power is improved, thereby further achieving inhibition on the transverse mode instability effect.Type: ApplicationFiled: May 18, 2023Publication date: May 2, 2024Inventors: Wei SHI, Chaodu SHI, Shijie FU, Xun DENG, Quan SHENG, Jianquan YAO
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Publication number: 20240143322Abstract: A software developer proxy tool accesses microservice applications for a software development project by connecting the developer proxy tool to a common port on a computer network. The tool implements software and hardware to register a plurality of the microservice applications on connection ports that connect to the developer proxy tool at an address for the common port. Data requests among the microservices are handled by the developer proxy tool via the common port. The tool sequentially queries selected microservice applications on the respective connection ports to determine availability for completing a request. The tool receives responses back from microservices and directs the responses back to the requesting program. Failed requests trigger use of remote or third party microservice applications that may be available over an internet connection.Type: ApplicationFiled: October 28, 2022Publication date: May 2, 2024Inventors: Henry Spivey, Chun-Fu Chang, Wei-Yuan Lo
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Publication number: 20240140765Abstract: An overhead hoist transfer apparatus includes a rail assembly including a straight rail having an empty section, and a curved rail having a curved empty section; an engine including a first LSD having first and second wheels at two sides respectively; and a second LSD having third and fourth wheels at two sides respectively; a moving carriage driven by the engine and suspended from the rail assembly; first and second guide wheels disposed on the first LSD; third and fourth guide wheels disposed on the second LSD; and two guide boards disposed above a joining point of the straight rail and the curved rail. An elevation of the guide boards is equal to that of the guide wheels. The guide board includes a straight edge and a curved edge.Type: ApplicationFiled: September 27, 2023Publication date: May 2, 2024Inventors: Jung-Chieh Chang, Yi-Sheng Chen, Jen-Yung Hsiao, Chia-Fu Hsiao, Wei-Qi Lao, Chen-Chih Chan, Caung-Yu Liu
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Publication number: 20240147467Abstract: An apparatus for wireless communication includes a receiver configured to receive a request for data associated with an Internet-of-things (IoT) service session with an IoT cloud server. The apparatus further includes a transmitter configured to transmit, based on receiving the request and prior to transmitting a response to the request, a message indicating a timing parameter associated with availability of the data. The receiver is further configured to receive an uplink grant at a time that is based on the timing parameter, and the transmitter is further configured to transmit the response to the request based on the uplink grant. The response includes at least a subset of the data.Type: ApplicationFiled: April 19, 2021Publication date: May 2, 2024Inventors: Miao Fu, Yan Wang, Aimin Shang, Hao Zhang, Jian Li, Xuefeng Chen, Wei He, Zhongliang Fang, Pan Jiang
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Patent number: 11972363Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for obtaining a plurality of model representations of predictive models, each model representation associated with a respective user and expresses a respective predictive model, and selecting a model implementation for each of the model representations based on one or more system usage properties associated with the user associated with the corresponding model representation.Type: GrantFiled: May 22, 2020Date of Patent: April 30, 2024Assignee: Google LLCInventors: Wei-Hao Lin, Travis H. K. Green, Robert Kaplow, Gang Fu, Gideon S. Mann
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Patent number: 11969145Abstract: A medical endoscope image recognition method is provided. In the method, endoscope images are received from a medical endoscope. The endoscope images are filtered with a neural network, to obtain target endoscope images. Organ information corresponding to the target endoscope images is recognized via the neural network. An imaging type of the target endoscope images is identified according to the corresponding organ information with a classification network. A lesion region in the target endoscope images is localized according to an organ part indicated by the organ information. A lesion category of the lesion region in an image capture mode of the medical endoscope corresponding to the imaging type is identified.Type: GrantFiled: August 26, 2021Date of Patent: April 30, 2024Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITEDInventors: Zijian Zhang, Zhongqian Sun, Xinghui Fu, Hong Shang, Xiaoning Wang, Wei Yang
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Patent number: 11971482Abstract: A system for providing six-dimensional position data of an object in a three-dimensional (3D) space, the system including a light source configured to emit a light beam in an x-direction, a mirror including a mirror plane disposed in an x-y plane and a beam splitter configured for reflecting the light beam from the light source onto the mirror before being directed to the object, the light beam reflected by the object onto the beam splitter before being directed through a lens to an image plane to form an image.Type: GrantFiled: August 18, 2023Date of Patent: April 30, 2024Assignee: MLOptic Corp.Inventors: Sophia Shiaoyi Wu, Gary Fu, Sean Huentelman, Wei Zhou
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Publication number: 20240134418Abstract: An electronic assembly includes an electronic device and an external device. The electronic device includes a main body and a fixing base. The main body includes a first opening. The fixing base includes an upper cover, a cam, a first spring, a button, a second spring, a pedestal, a first retractable hook and a second retractable hook. The first retractable hook includes a first inclined protrusion structure. The second retractable hook includes a second inclined protrusion structure. The external device includes a bracket. The bracket includes a first insertion piece and a second insertion piece. The first insertion piece includes a seventh opening. The second insertion piece includes an eighth opening. The first insertion piece and the second insertion piece are penetrated through the first opening. The first inclined protrusion structure is inserted into the seventh opening. The second inclined protrusion structure is inserted into the eighth opening.Type: ApplicationFiled: December 21, 2022Publication date: April 25, 2024Inventors: Wei-Ching Kuo, Rong-Fu Lee
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Publication number: 20240137221Abstract: Computer-implemented methods, non-transitory, computer-readable media, and computer-implemented systems implementing a one-touch login service are described. Information about a first IP address is obtained from a verification request sent by an application client device. A token is sent to the application client device. Information about a second IP address is obtained from a number acquisition request sent by an application server. Whether the first IP address is the same as the second IP address is determined. If the same, based on a token carried in the number acquisition request, a mobile phone number of a terminal device in which the application client device is located is obtained and the mobile phone number is sent to the application server. If not the same, sending the mobile phone number of the terminal device to the application server is refused.Type: ApplicationFiled: December 28, 2023Publication date: April 25, 2024Applicant: Alipay (Hangzhou) Information Technology Co., Ltd.Inventors: Wanqiao Zhang, Lin Huang, Juhu Nie, Yunding Jian, Wei Fu, Hongjian Cao, Yujia Liu
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Patent number: 11967563Abstract: A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.Type: GrantFiled: August 16, 2021Date of Patent: April 23, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen
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Patent number: 11968906Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a contact hole in the first IMD layer; forming a bottom electrode layer in the contact hole; forming a magnetic tunneling junction (MTJ) stack on the bottom electrode layer; and removing the MTJ stack and the bottom electrode layer to form a MTJ on a bottom electrode. Preferably, the bottom electrode protrudes above a top surface of the first IMD layer.Type: GrantFiled: May 25, 2020Date of Patent: April 23, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Jin-Yan Chiou, Wei-Chuan Tsai, Hsin-Fu Huang, Yen-Tsai Yi, Hsiang-Wen Ke
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Patent number: 11967414Abstract: This application relates to an image recognition model training method, an image recognition method, apparatus, and system. The method includes: obtaining a to-be-recognized image; extracting image feature information of the to-be-recognized image; and obtaining a lesion category recognition result of the to-be-recognized image by using the image feature information of the to-be-recognized image as an input parameter of a preset image recognition model, the image recognition model being trained by using a training image sample set comprising at least one strong-label training image sample, to determine the lesion category recognition result; and the strong-label training image sample representing an image sample having strong-label information, and the strong-label information comprising at least annotation information of a lesion category and a lesion position in the strong-label training image sample.Type: GrantFiled: May 14, 2021Date of Patent: April 23, 2024Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITEDInventors: Han Zheng, Zhongqian Sun, Hong Shang, Xinghui Fu, Wei Yang
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Publication number: 20240128217Abstract: A semiconductor device includes a first semiconductor die and a second semiconductor die connected to the first semiconductor die. Each of the first semiconductor die and the second semiconductor die includes a substrate, a conductive bump formed on the substrate and a conductive contact formed on the conductive bump. The conductive contact has an outer lateral sidewall, there is an inner acute angle included between the outer lateral sidewall and the substrate is smaller than 85°, and the conductive contact of the first semiconductor die is connected opposite to the conductive contact of the second semiconductor die.Type: ApplicationFiled: January 20, 2023Publication date: April 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Jung CHEN, Chen Chiang YU, Wei-An TSAO, Tsung-Fu TSAI, Szu-Wei LU, Chung-Shi LIU
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Publication number: 20240128139Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate along a predetermined direction for being electrically coupled to each other, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer is formed with at least one type of a buffering cavity, wave-shaped slots, and rectangular slots, which penetrate therethrough along the predetermined direction. The buffering cavity can be located in the adhesive layer, and any one type of the wave-shaped slots and the rectangular slots can be respectively recessed in an inner side and an outer side of the adhesive layer. A minimum width of the adhesive layer is greater than or equal to 50% of a predetermined width between the inner side and the outer side.Type: ApplicationFiled: June 6, 2023Publication date: April 18, 2024Inventors: WEI-LI WANG, JYUN-HUEI JIANG, WEN-FU YU, BAE-YINN HWANG, CHIEN-HUNG LIN
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Publication number: 20240128233Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed on the substrate, a sensor chip adhered to the fixing adhesive layer, an annular adhering layer disposed on the sensor chip, a light-permeable sheet adhered to the annular adhering layer, and a plurality of metal wires that are electrically coupled to the substrate and the sensor chip. The size of the light-permeable sheet is smaller than that of the sensor chip.Type: ApplicationFiled: June 6, 2023Publication date: April 18, 2024Inventors: CHIA-SHUAI CHANG, WEN-FU YU, BAE-YINN HWANG, WEI-LI WANG, CHIEN-HUNG LIN
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Publication number: 20240123479Abstract: A recycling apparatus for a solar cell module includes a platform for supporting and positioning the solar cell module, and at least one milling device disposed on the platform and having a milling member configured to contact a back plate of the solar cell module, and a casing defining a chip-receiving space and having an air inlet and a suction port communicating with the chip-receiving space. A drive device is connected to the at least one milling device for driving the at least one milling device to move around and mill the solar cell module through the milling member.Type: ApplicationFiled: October 28, 2021Publication date: April 18, 2024Applicant: NATIONAL UNIVERSITY OF TAINANInventors: Yao-Hsien FU, Hsueh-Pin TAI, Chia-Tsung HUNG, Cheng-Chen LIU, Chun-Chih HU, How-Wei KE
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Publication number: 20240128291Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.Type: ApplicationFiled: June 6, 2023Publication date: April 18, 2024Inventors: CHIA-SHUAI CHANG, CHIEN-HUNG LIN, WEI-LI WANG, WEN-FU YU, BAE-YINN HWANG
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Publication number: 20240118538Abstract: An electronic device may have optical components that each have first and second transparent layers such as first and second glass layers. The glass layers may have outer surfaces that face away from each other and inner surfaces that face towards each other. A polymer layer is formed between the inner surfaces of the glass layers. Along the periphery of each optical component, a hermetic seal is formed to protect the polymer material of the polymer layer. The seal may include one or more metal layers that are coupled to the first and second glass layers. Alternatively or additionally, the seal may include an internal seal, such as a metal foil layer that extends between the first and second glass layers, within the optical component to reduce the width of the optical component.Type: ApplicationFiled: December 18, 2023Publication date: April 11, 2024Inventors: Wei Lin, Boyi Fu, Nathan K Gupta
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Publication number: 20240118818Abstract: Methods and systems for managing memory usage in data learning operations. The method includes profiling one or more objects used for training in the data learning operation, in which the profiling includes determining an object size, a memory allocation timestamp, and a memory deallocation timestamp; and scheduling the memory usage. The scheduling includes grouping the one or more objects into the one or more groups based on the memory allocation and/or the memory deallocation timestamp of the one or more objects, and arranging the one or more objects in the one or more groups in descending order in a memory space. Two or more objects are provided in the descending order in the memory space, in which one of the objects having an earliest memory allocation timestamp is provided at a first value and the other object having a later memory allocation timestamp is provided at a second value.Type: ApplicationFiled: November 17, 2023Publication date: April 11, 2024Inventors: Jin ZHOU, Tongping LIU, Yong FU, Ping ZHOU, Wei XU, Jianjun CHEN
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Publication number: 20240116707Abstract: A powered industrial truck includes a lateral movement assembly including four sliding members and four pivotal members both on a wheeled carriage, four links having a first end pivotably secured to the sliding member and a second end pivotably secured to either end of the pivotal member, a motor shaft having two ends pivotably secured to the pivotal members respectively, a first electric motor on one frame member, and four mounts attached to the sliding members respectively; two lift assemblies including a second electric motor, a shaft having two ends rotatably secured to the sliding members respectively, two gear trains at the ends of the shaft respectively, a first gear connected to the second electric motor, a second gear on the shaft, and a first roller chain on the first and second gears; two electric attachments on the platform and being laterally moveable, each attachment. The mount has rollers.Type: ApplicationFiled: September 21, 2023Publication date: April 11, 2024Inventors: Jung-Chieh Chang, Yi-Sheng Chen, Jen-Yung Hsiao, Chia-Fu Hsiao, Wei-Qi Lao, Chen-Chih Chan, Chung-Yu Liu