Abstract: A semiconductor package has central region and peripheral region surrounding central region. The semiconductor package includes dies, encapsulant, and redistribution structure. The dies include functional die and first dummy dies. Functional die is disposed in central region. First dummy dies are disposed in peripheral region. Redistribution structure is disposed on encapsulant over the dies, and is electrically connected to functional die. Vacancy ratio of central region is in the range from 1.01 to 3.00. Vacancy ratio of the peripheral region is in the range from 1.01 to 3.00. Vacancy ratio of central region is a ratio of total area of central region to total area occupied by dies disposed in central region. Vacancy ratio of peripheral region is a ratio of total area of peripheral region to total area occupied by first dummy dies disposed in peripheral region.

Abstract: A composition having sodium pyrithione and a binder is provided. The composition may also have a softener. A method of using the composition is provided. The method includes applying a composition to a textile. A method of treating the textile with the composition to impart an antimicrobial and/or antifungal efficacy and durability is also provided.

Abstract: A composition and method for treating a textile to impart a property of prolonged odor control to the textile is provided. The method includes applying a composition having sodium pyrithione and a binder to a textile, thereby imparting odor control to the textile. The composition may further contain a softener.

Abstract: A semiconductor package has central region and peripheral region surrounding central region. The semiconductor package includes dies, encapsulant, and redistribution structure. The dies include functional die and first dummy dies. Functional die is disposed in central region. First dummy dies are disposed in peripheral region. Redistribution structure is disposed on encapsulant over the dies, and is electrically connected to functional die. Vacancy ratio of central region is in the range from 1.01 to 3.00. Vacancy ratio of the peripheral region is in the range from 1.01 to 3.00. Vacancy ratio of central region is a ratio of total area of central region to total area occupied by dies disposed in central region. Vacancy ratio of peripheral region is a ratio of total area of peripheral region to total area occupied by first dummy dies disposed in peripheral region.

Abstract: A method includes depositing a plurality of layers on a substrate, patterning a first mask overlying the plurality of layers, and performing a first etching process on the plurality of layers using the first mask. The method also includes forming a polymer material along sidewalls of the first mask and sidewalls of the plurality of layers, and removing the polymer material. The method also includes performing a second etching process on the plurality of layers using the remaining first mask, where after the second etching process terminates a combined sidewall profile of the plurality of layers comprises a first portion and a second portion, and a first angle of the first portion and a second angle of the second portion are different to each other.

Abstract: A high-entropy transition metal layered oxide is an O3 type high-entropy transition metal layered oxide which is represented by the following formula (1): Na[NiaFebMncM1dM2e]O2??(1). In the formula (1), M1 and M2 are selected from a group consisting of V, Cr, Co, Cu, Zn, and Ti, a+b+c+d+e=1, 0.05?a?0.35, 0.05?b?0.35, 0.05?c?0.35, 0.05?d?0.35, and 0.05?e?0.35.

Abstract: An electrical connector includes an insulating body and first through eighth terminals sequentially arranged in a lateral direction in the insulating body, wherein the first and second terminals, the third and sixth terminals, the fourth and fifth terminals, and the seventh and eighth terminals are respectively used to transmit a pair of differential signals, each terminal including: a mating portion for mating to a mating connector; a tail portion opposite to the mating portion; and a connecting portion connected therebetween, the connecting portions of the third terminal to the fifth terminal are all provided with a coupling portion; wherein the coupling portions of the third through fifth terminals are in three different planes, respectively, and the coupling portion of the fifth terminal and the coupling portion of the third terminal at least partially overlap in a longitudinal direction perpendicular to the lateral direction.

Abstract: A light emitting apparatus, including: a first light emitting device with a first substrate having a first upper surface and first bottom surface, a plurality of first LED chips disposed on the first upper surface, emitting a light penetrating the first substrate, and a first wavelength conversion layer directly contacting the plurality of first LED chips and first upper surface, and a first shape in a cross-sectional view; a second wavelength conversion layer directly contacting the first bottom surface; a second shape in the cross-sectional view substantially the same as the first shape; a second light emitting device separated from the first light emitting device, including a second substrate and plurality of second LEDs disposed on the second substrate; a support base connected to the first light emitting device by a first angle and connected to the second light emitting device by a second angle; and a first support arranged between the support base and first light emitting device.

Abstract: A method includes forming a metal seed layer over a first conductive feature of a wafer, forming a patterned photo resist on the metal seed layer, forming a second conductive feature in an opening in the patterned photo resist, and heating the wafer to generate a gap between the second conductive feature and the patterned photo resist. A protection layer is plated on the second conductive feature. The method further includes removing the patterned photo resist, and etching the metal seed layer.

Abstract: A base station antenna includes a feed network, a cable and an adapter structure. The feed network includes a cavity, and an internal structure in the cavity. The adapter structure includes a first transmission line. A first end of the first transmission line is electrically connected to the internal structure. A second end of the first transmission is electrically connected to the cable. The first transmission line is configured to transmit a radio frequency signal. The first transmission line is at least partially located outside the cavity.

Abstract: Disclosed area scattering film, a display module and a display device. The scattering film includes: a scattering particle layer on a bearing layer, the scattering particle layer including a plurality of scattering particles and having a surface away from the bearing layer being a curved surface; 90% or more of the scattering particles in the scattering particle layer have a particle size larger than or equal to 5 ?m and less than or equal to 30 ?m.

Abstract: A method for fabricating a metal-insulator-metal (MIM) capacitor is provided. The MIM capacitor includes a substrate, a first metal layer, a deposition structure, a dielectric layer and a second metal layer. The first metal layer is disposed on the substate and has a planarized surface. The deposition structure is disposed on the first metal layer, and at least a portion of the deposition structure extends into the planarized surface, wherein the first metal layer and the deposition structure have the same material. The dielectric layer is disposed on the deposition structure. The second metal layer is disposed on the dielectric layer.

Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit. The integrated circuit includes a substrate having an upper face and a lower face. The upper face includes a central region and an outer sidewall that laterally surrounds the central region and that extends from the upper face to the lower face. An optical edge coupler is disposed over the upper face of the substrate and extends in a first direction from the central region toward the outer sidewall. An outer sidewall of the optical edge coupler corresponds to the outer sidewall of the substrate and has a concave surface or a convex surface.

Abstract: Methods, systems, and apparatus are described for transferring application data. In one aspect, a method includes causing, by a first component on a first device to establish a wireless connection with a second device; receiving, from a second component on the second device, data specifying one or more applications that are installed on the second device and supported by the second component, each of the applications being separate from the second component; determining, by the first component, that a first application installed on the first device corresponds to one of the applications installed on the second device, the first application being separate from the first component; receiving, by the first component, first application data from the first application; and causing, by the first component, the first device to send the first application data to the second component running on the second device using the wireless connection.

Abstract: A multi-link device includes a first link queue, a second link queue, a control circuit, a first transmitter and a second transmitter. The control circuit includes a common queue for buffering a plurality of packets, each packet having a sequence number. The control circuit obtains a minimum sequence number of all packets in the first link queue and the second link queue, computes a maximum sequence number according to the minimum sequence number and a block acknowledgment window size, determines whether to allocate a set of packets from the common queue according to the maximum sequence number, and if so, allocates the set of packets to the first link queue and/or the second link queue. The first transmitter transmits a packet from the first link queue to a first receiving device, and the second transmitter transmits a packet from the second link queue to a second receiving device.

Abstract: An additive formulation for reduction or prevention of microbially induced corrosion in concrete, cementitious material (such as mortar or grout), or a combination thereof. The additive formulation comprises a Quat Silane and a fungicide, wherein the ratio of the Quat Silane to the fungicide in the formulation is in a range of about 10:1 to about 1:10, preferably in a range of about 5:1 to about 1:5.

Abstract: A photonic device and related method for forming a photonic device. In some embodiments, a method of fabricating a photonic device includes forming a layer stack over a substrate. In some cases, the layer stack includes a lower cladding layer, a core layer disposed over the lower cladding layer, and an upper cladding layer disposed over the core layer. In some examples, the method further includes patterning the layer stack to form a waveguide for the photonic device. In some cases, the waveguide includes the core layer, and the core layer includes a lateral surface having a convex profile.

Abstract: Methods and systems for setting up alignment of a specimen are provided. One system includes computer subsystem(s) configured for acquiring two-dimensional (2D) images generated from output of a detector of an output acquisition subsystem at template locations in corresponding areas of printed instances on a specimen. The computer subsystem(s) determine offsets in x and y directions between the template locations using the 2D images and determine an angle of the specimen with respect to the output acquisition subsystem based on the offsets. If the angle is greater than a predetermined value, the computer subsystem(s) rotate the specimen and repeat the steps described above. If the angle is less than the predetermined value, the computer subsystem(s) store one of the 2D images for alignment of the specimen in a process performed on a specimen. The 2D images may include multi-mode images, which may be fused prior to determining the offsets.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor package comprising optically coupled integrated circuit (IC) chips. A first IC chip and a second IC chip overlie a substrate at a center of the substrate. A photonic chip overlies the first and second IC chips and is electrically coupled to the second IC chip. A laser device chip overlies the substrate, adjacent to the photonic chip and the second IC chip, at a periphery of the substrate. The photonic chip is configured to modulate a laser beam from the laser device chip in accordance with an electrical signal from the second IC chip and to provide the modulated laser beam to the first IC chip. This facilitates optical communication between the first IC chip to the second IC chip. Various embodiments of the present disclosure are further directed towards simultaneously aligning and bonding constituents of the semiconductor package.