Patents by Inventor Wei-Ling Lin

Wei-Ling Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240094626
    Abstract: A pellicle for an extreme ultraviolet (EUV) photomask includes a pellicle frame and a main membrane attached to the pellicle frame. The main membrane includes a plurality of nanotubes, and each of the plurality of nanotubes is covered by a coating layer containing Si and one or more metal elements.
    Type: Application
    Filed: April 12, 2023
    Publication date: March 21, 2024
    Inventors: Pei-Cheng HSU, Wei-Hao LEE, Huan-Ling LEE, Hsin-Chang LEE, Chin-Hsiang LIN
  • Publication number: 20240087988
    Abstract: The present disclosure, in some embodiments, relates an integrated chip. The integrated chip includes a substrate. A through-substrate-via (TSV) extends through the substrate. A dielectric liner separates the TSV from the substrate. The dielectric liner is along one or more sidewalls of the substrate. The TSV includes a horizontally extending surface and a protrusion extending outward from the horizontally extending surface. The TSV has a maximum width along the horizontally extending surface.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Hung-Ling Shih, Wei Chuang Wu, Shih Kuang Yang, Hsing-Chih Lin, Jen-Cheng Liu
  • Publication number: 20240081081
    Abstract: A ferroelectric memory device and a semiconductor die are provided. The ferroelectric memory device includes a gate electrode; a channel layer, overlapped with the gate electrode; source/drain contacts, in contact with separate ends of the channel layer; a ferroelectric layer, lying between the gate electrode and the channel layer; and a first insertion layer, extending in between the ferroelectric layer and the channel layer, and comprising a metal carbonitride or a metal nitride.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ya-Ling Lee, Chung-Te Lin, Han-Ting Tsai, Wei-Gang Chiu, Yen-Chieh Huang, Ming-Yi Yang
  • Patent number: 11789072
    Abstract: A clock monitor circuit includes a monitor and a tunable counter. The monitor can monitor a clock under test. The tunable counter can count an integer according to a reference clock and set a target number. If a stable signal relative to the clock under test is toggled, the tunable counter can switch the target number from a large number to a small number. The tunable counter can perform an automatic detection process, so as to transmit a check signal to the monitor. In response to the check signal, if the clock under test is undetectable, the monitor will not transmit any confirmation signal back to the tunable counter, and the tunable counter will gradually increase the integer. When the integer is equal to the target number, the tunable counter generates a failure signal.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: October 17, 2023
    Assignee: NUVOTON TECHNOLOGY CORPORATION
    Inventor: Wei-Ling Lin
  • Publication number: 20230152371
    Abstract: A clock monitor circuit includes a monitor and a tunable counter. The monitor can monitor a clock under test. The tunable counter can count an integer according to a reference clock and set a target number. If a stable signal relative to the clock under test is toggled, the tunable counter can switch the target number from a large number to a small number. The tunable counter can perform an automatic detection process, so as to transmit a check signal to the monitor. In response to the check signal, if the clock under test is undetectable, the monitor will not transmit any confirmation signal back to the tunable counter, and the tunable counter will gradually increase the integer. When the integer is equal to the target number, the tunable counter generates a failure signal.
    Type: Application
    Filed: September 19, 2022
    Publication date: May 18, 2023
    Inventor: Wei-Ling LIN
  • Patent number: 10742203
    Abstract: A delay line circuit with a calibration function, includes N delay modules and a calibration module. The N delay modules are serially coupled to each other. The calibration module generates a calibration start signal and a calibration stop signal according to a calibration signal and a clock signal, and the calibration start signal is outputted to the N delay modules, so that the N delay modules output N delay signals according to N control signals and the calibration start signal. The calibration module calibrates the N control signals according to the N delay signals and the calibration stop signal, so that the N delay modules generate N calibrated delay signals according to the N calibrated control signals and the clock signal. A generation time instant of the calibration stop signal is later than a generation time instant of the calibration start signal.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: August 11, 2020
    Assignee: NUVOTON TECHNOLOGY CORPORATION
    Inventor: Wei-Ling Lin
  • Publication number: 20200177171
    Abstract: A delay line circuit with a calibration function, includes N delay modules and a calibration module. The N delay modules are serially coupled to each other. The calibration module generates a calibration start signal and a calibration stop signal according to a calibration signal and a clock signal, and the calibration start signal is outputted to the N delay modules, so that the N delay modules output N delay signals according to N control signals and the calibration start signal. The calibration module calibrates the N control signals according to the N delay signals and the calibration stop signal, so that the N delay modules generate N calibrated delay signals according to the N calibrated control signals and the clock signal. A generation time instant of the calibration stop signal is later than a generation time instant of the calibration start signal.
    Type: Application
    Filed: July 18, 2019
    Publication date: June 4, 2020
    Inventor: Wei-Ling LIN
  • Patent number: 8909598
    Abstract: A method for managing an electronic phone book is used in a communication device which includes a universal subscriber identity module (USIM), a system for executing the method, a storage device, and a processor. The USIM includes elementary files. The system and the method identify information updated by users for saving the electronic phone book, a contact name, a contact phone number, and a contact email address according to link information of each elementary file. The system and the method update the contact information of USIM according to the information updated by the users. The contact information of USIM can be quickly updated by utilizing the method and the system.
    Type: Grant
    Filed: January 5, 2013
    Date of Patent: December 9, 2014
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Wei-Ling Lin
  • Publication number: 20130262375
    Abstract: A method for managing an electronic phone book is used in a communication device which includes a universal subscriber identity module (USIM), a system for executing the method, a storage device, and a processor. The USIM includes elementary files. The system and the method identify information updated by users for saving the electronic phone book, a contact name, a contact phone number, and a contact email address according to link information of each elementary file. The system and the method update the contact information of USIM according to the information updated by the users. The contact information of USIM can be quickly updated by utilizing the method and the system.
    Type: Application
    Filed: January 5, 2013
    Publication date: October 3, 2013
    Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.
    Inventor: WEI-LING LIN
  • Publication number: 20110001221
    Abstract: A dielectric layer is provided. The dielectric layer includes a photo-sensitive polymer or a non-photo-sensitive polymer and an amorphous metal oxide disposed in the photo-sensitive polymer or a non-photo-sensitive polymer.
    Type: Application
    Filed: September 16, 2010
    Publication date: January 6, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wei-Ling Lin, Pang LIN, Tarng-Shiang Hu, Liang-Xiang Chen
  • Patent number: 7842946
    Abstract: Electronic devices with hybrid high-k dielectric and fabrication methods thereof. The electronic device includes a substrate. A first electrode is disposed on the substrate. Hybrid high-k multi-layers comprising a first dielectric layer and a second dielectric layer are disposed on the substrate, wherein the first dielectric layer and the second dielectric layer are solvable and substantially without interface therebetween. A second electrode is formed on the hybrid multi-layers.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: November 30, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Wei-Ling Lin, Jiing-Fa Wen, Wen-Hsi Lee, Tarng-Shiang Hu, Jiun-Jie Wang, Cheng-Chung Lee
  • Patent number: 7829137
    Abstract: A composition for forming a dielectric layer includes a liquid organometallic compound serving as a precursor with high dielectric constant, a photo-sensitive polymer or a non-photo-sensitive polymer and a solvent, wherein the liquid organometallic compound includes metal alkoxide, and the metal of the metal alkoxide includes Al Ti, Zr, Ta, Si, Ba, Ge and Hf. The dielectric layer formed by the composition includes the photo-sensitive polymer or the non-photo-sensitive polymer and an amorphous metal oxide formed therein.
    Type: Grant
    Filed: March 21, 2006
    Date of Patent: November 9, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Wei-Ling Lin, Pang Lin, Tarng-Shiang Hu, Liang-Xiang Chen
  • Publication number: 20100144085
    Abstract: Substrate structures and fabrication methods thereof. A substrate structure includes a bendable substrate and an inorganic electrode structure on the bendable structure, wherein the inorganic electrode structure includes a conductive layer or a semiconductor layer. The inorganic electrode structure includes carbon nanotubes, carbon nanofibers, a nanolinear material, or a micro-linear material. The bendable substrate includes polyethylene (PE), polyimide (PI), polyvinyl alcohol (PVA), or polymethyl methacrylate (PMMA).
    Type: Application
    Filed: January 26, 2010
    Publication date: June 10, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Lih-Hsiung Chan, Ming-Chun Hsiao, Wei-Ling Lin, Gary Wei
  • Patent number: 7679081
    Abstract: Substrate structures and fabrication methods thereof. A substrate structure includes a bendable substrate and an inorganic electrode structure on the bendable structure, wherein the inorganic electrode structure includes a conductive layer or a semiconductor layer. The inorganic electrode structure includes carbon nanotubes, carbon nanofibers, a nanolinear material, or a micro-linear material. The bendable substrate includes polyethylene (PE), polyimide (PI), polyvinyl alcohol (PVA), or polymethyl methacrylate (PMMA).
    Type: Grant
    Filed: January 22, 2007
    Date of Patent: March 16, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Lih-Hsiung Chan, Ming-Chun Hsiao, Wei-Ling Lin, Gary Wei
  • Publication number: 20090087944
    Abstract: Electronic devices with hybrid high-k dielectric and fabrication methods thereof. The electronic device includes a substrate. A first electrode is disposed on the substrate. Hybrid high-k multi-layers comprising a first dielectric layer and a second dielectric layer are disposed on the substrate, wherein the first dielectric layer and the second dielectric layer are solvable and substantially without interface therebetween. A second electrode is formed on the hybrid multi-layers.
    Type: Application
    Filed: December 11, 2008
    Publication date: April 2, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wei-Ling Lin, Jiing-Fa Wen, Wen-Hsi Lee, Tarng-Shiang Hu, Jiun-Jie Wang, Cheng-Chung Lee
  • Patent number: 7495253
    Abstract: An organic thin-film transistor and a method for manufacturing the same are described. The method forms a gate layer on a substrate, an insulator layer on the substrate, forming a semiconductor layer on the insulator layer, and a strip for defining a channel length on the semiconductor layer. An electrode layer is screen printed on the semiconductor layer, and a passivation layer is coated on the electrode layer. The organic thin-film transistor manufactured by the method of the invention has a substrate, a gate layer formed on the substrate, an insulator layer formed on the substrate, a semiconductor layer formed on the insulator layer, a strip for defining a channel length formed on the semiconductor layer, an electrode layer screen-printed on the semiconductor layer, and a passivation layer coated on the electrode layer. Thereby, an organic thin-film transistor with a top-contact/bottom-gate structure is obtained.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: February 24, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Liang-Ying Huang, Jia-Chong Ho, Cheng-Chung Lee, Tarng-Shiang Hu, Wen-Kuei Huang, Wei-Ling Lin, Cheng-Chung Hsieh
  • Publication number: 20080149922
    Abstract: Electronic devices with hybrid high-k dielectric and fabrication methods thereof. The electronic device includes a substrate. A first electrode is disposed on the substrate. Hybrid high-k multi-layers comprising a first dielectric layer and a second dielectric layer are disposed on the substrate, wherein the first dielectric layer and the second dielectric layer are solvable and substantially without interface therebetween. A second electrode is formed on the hybrid multi-layers.
    Type: Application
    Filed: September 4, 2007
    Publication date: June 26, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wei-Ling Lin, Jiing-Fa Wen, Wen-Hsi Lee, Tarng-Shiang Hu, Jiun-Jie Wang, Cheng-Chung Lee
  • Publication number: 20080054255
    Abstract: Substrate structures and fabrication methods thereof. A substrate structure includes a bendable substrate and an inorganic electrode structure on the bendable structure, wherein the inorganic electrode structure includes a conductive layer or a semiconductor layer. The inorganic electrode structure includes carbon nanotubes, carbon nanofibers, a nanolinear material, or a micro-linear material. The bendable substrate includes polyethylene (PE), polyimide (PI), polyvinyl alcohol (PVA), or polymethyl methacrylate (PMMA).
    Type: Application
    Filed: January 22, 2007
    Publication date: March 6, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Lih-Hsiung Chan, Ming-Chun Hsiao, Wei-Ling Lin, Gary Wei
  • Publication number: 20080035918
    Abstract: An organic thin-film transistor and a method for manufacturing the same are described. The method forms a gate layer on a substrate, an insulator layer on the substrate, forming a semiconductor layer on the insulator layer, and a strip for defining a channel length on the semiconductor layer. An electrode layer is screen printed on the semiconductor layer, and a passivation layer is coated on the electrode layer. The organic thin-film transistor manufactured by the method of the invention has a substrate, a gate layer formed on the substrate, an insulator layer formed on the substrate, a semiconductor layer formed on the insulator layer, a strip for defining a channel length formed on the semiconductor layer, an electrode layer screen-printed on the semiconductor layer, and a passivation layer coated on the electrode layer. Thereby, an organic thin-film transistor with a top-contact/bottom-gate structure is obtained.
    Type: Application
    Filed: July 27, 2007
    Publication date: February 14, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Liang-Ying Huang, Jia-Chong Ho, Cheng-Chung Lee, Tarng-Shiang Hu, Wen-Kuei Huang, Wei-Ling Lin, Cheng-Chung Hsieh
  • Publication number: 20070264478
    Abstract: Substrate structures for display devices and fabrication methods thereof The substrate structure comprises a substrate, an interfacial layer disposed on the substrate, and a patterned paste layer applied on the interfacial layer, wherein a contact angle of the interface between the patterned paste layer and the interfacial layer exceeds 35 degrees.
    Type: Application
    Filed: September 22, 2006
    Publication date: November 15, 2007
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jane-Hway Liao, Wei-Ling Lin, Yu-Yang Chang