Patents by Inventor Wei Shan

Wei Shan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11135847
    Abstract: Printing techniques for print media are described herein. In an example, a printer includes print head and a feed roller to move a medium under the print head along a print path. The print head includes a first set of nozzles such that the first set of nozzles is proximal to the feed roller. Further, the print head is to print on a Top-of-Form (TOF) of the medium through the first set of nozzles.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: October 5, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Pui Wen Huang, Wei Shan Gwenda Teo, Khee Peng Ngoon, Yi Xiong Anselm Lim, Sook Shin Chang
  • Patent number: 11104796
    Abstract: A polycarbonate composition contains, based on the total weight of the polycarbonate composition: one or more polycarbonate homopolymers; a poly(carbonate-siloxane) copolymer comprising siloxane units with an average block length of 5 to 120, preferably 10 to 100, the poly(carbonate-siloxane) copolymer being present in an amount effective to provide 2.5 to 10 wt % of siloxane units based on the total weight of the polycarbonate composition; 1 to 8 wt % of an elastomer-modified graft copolymer; 0.01 to 5 wt % of a silicone oil; and 0.1 to 8 wt % of an additive; and wherein the composition has a melt mass flow rate higher than 16 g/10 min, determined in accordance with ASTM D1238 under a load of 1.2 kg at 300° C. with a dwelling time of 300 seconds; and an Izod notched impact energy of at least 700 J/m measured at 23° C. on a sample of 3.2 mm thickness according to ASTM D256-10.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: August 31, 2021
    Assignee: SHPP GLOBAL TECHNOLOGIES B.V.
    Inventors: Yagang Chen, Wei Shan, Shijie Song, Yaming Niu
  • Patent number: 11100399
    Abstract: Systems and methods for training a neural network model are disclosed. In the method, training data is obtained by a deep neural network (DNN) first, the deep neural network comprising at least one hidden layer. Then features of the training data are obtained from a specified hidden layer of the at least one hidden layer, the specified hidden layer being connected respectively to a supervised classification network for classification tasks and an autoencoder based reconstruction network for reconstruction tasks. And at last the DNN, the supervised classification network and the reconstruction network are trained as a whole based on the obtained features, the training being guided by the classification tasks and the reconstruction tasks.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: August 24, 2021
    Assignee: International Business Machines Corporation
    Inventors: Wei Shan Dong, Peng Gao, Chang Sheng Li, Chun Yang Ma, Kai AD Yang, Ren Jie Yao, Ting Yuan, Jun Zhu
  • Patent number: 11079405
    Abstract: A method of detecting a ferroelectric signal from a ferroelectric film and a piezoelectric force microscopy (PFM) apparatus are provided. The method includes following steps. An input waveform signal is generated, wherein the input waveform signal includes a plurality of read voltage steps with different voltage levels. The input waveform signal to the ferroelectric film is applied. An atomic force microscope probe scans over a surface of the ferroelectric film to measure a surface topography of the ferroelectric film. A deflection of the atomic force microscope probe is detected when the input waveform signal is applied to a pixel of the ferroelectric film to generate a deflection signal. Spectrum data of the pixel based on the deflection signal is generated. The spectrum data of the pixel is analyzed to determine whether the spectrum data of the pixel is a ferroelectric signal or a non-ferroelectric signal.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: August 3, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Shan Hu, Dong Gui, Jang-Jung Lee
  • Publication number: 20210222002
    Abstract: A thermoplastic polycarbonate composition comprising: 10 to 30 wt % of a brominated polycarbonate; 10 to 80 wt % of a homopolycarbonate; optionally, 1 to 60 wt % of an aromatic poly(ester-carbonate) comprising carbonate units derived from bisphenol A, resorcinol, or a combination thereof, and ester units derived from a bisphenol, preferably bisphenol A, or resorcinol, and terephthalic acid, isoterephthalic acid, or a combination thereof, wherein a molar ratio of carbonate units to ester units ranges from 1:99 to 99:1; 5 to 15 wt % of a core-shell impact modifier; 1 to 10 wt % of an ?,?-unsaturated glycidyl ester copolymer impact modifier; 0.01 to 1 wt % of a hydrostabilizer, preferably an epoxy hydrostabilizer; optionally, 0.1 to 10 wt % of an additive composition; wherein the wt % of each component is based on the total weight of the composition, which totals 100 wt %.
    Type: Application
    Filed: October 27, 2020
    Publication date: July 22, 2021
    Inventors: Xing Liu, Wei Shan, Jian Wang
  • Publication number: 20210189119
    Abstract: A composition includes specific amounts of a poly (phenylene ether), a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene, a polypropylene, a polybutene, a flame retardant, and an ultraviolet absorbing agent comprising a bis(benzotriazole) compound. The composition is particularly useful for forming the jacket layer of electrical and optical cables.
    Type: Application
    Filed: February 29, 2016
    Publication date: June 24, 2021
    Inventors: Hui Peng, Wei Shan, Shen Zhang
  • Patent number: 11036741
    Abstract: Identifying relations between items in transactions. Local conditional frequency pattern trees are generated in processing nodes in a computer system. The nodes in the local conditional frequency pattern trees represent items and a frequency of the items in the transactions. Global conditional frequency pattern trees are generated in the processing nodes. Each processing node in the processing nodes generates a global conditional frequency pattern tree using a set of local conditional frequency pattern trees in the processing node. The global conditional frequency pattern trees generated by the processing nodes are distributed such that each processing node in the processing nodes has the global conditional frequency pattern trees generated by other processing nodes. Patterns are generated by the computer system. A set of rules is generated using the patterns and the global conditional frequency pattern trees in the processing nodes, wherein the set of rules define the relations between the items.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: June 15, 2021
    Assignee: International Business Machines Corporation
    Inventors: Yan XA Zhou, Xing Wei, Si ER Han, Xue Ying Zhang, Wei Shan WS Kang, Hua XA Li
  • Publication number: 20210175157
    Abstract: A semiconductor device includes a carrier, a first external contact, a second external contact, and a semiconductor die. The semiconductor die has a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, a third contact pad disposed on the second main face, and a vertical transistor. The semiconductor die is disposed with the first main face on the carrier. A clip connects the second contact pad to the second external contact. A first bond wire is connected between the third contact pad and the first external contact. The first bond wire is disposed at least partially under the clip.
    Type: Application
    Filed: December 1, 2020
    Publication date: June 10, 2021
    Inventors: Ralf Otremba, Chii Shang Hong, Jo Ean Joanna Chye, Teck Sim Lee, Hui Kin Lit, Ke Yan Tean, Lee Shuang Wang, Wei-Shan Wang
  • Publication number: 20210166988
    Abstract: A semiconductor package includes a die pad having a die attach surface, a first laterally separated and vertically offset from the die pad, a semiconductor die mounted on the die attach surface and comprising a first terminal on an upper surface of the semiconductor die, an interconnect clip that is electrically connected to the first terminal and to the first lead, and a heat spreader mounted on top of the interconnect clip. The interconnect clip includes a first planar section that interfaces with the upper surface of the semiconductor die and extends past an outer edge side of the die pad. The heat spreader covers an area of the first planar section that is larger than an area of the semiconductor die. The heat spreader laterally extends past a first outer edge side of the die pad that faces the first lead.
    Type: Application
    Filed: December 2, 2019
    Publication date: June 3, 2021
    Inventors: Jo Ean Joanna Chye, Teck Sim Lee, Ke Yan Tean, Wei-Shan Wang
  • Publication number: 20210122093
    Abstract: Disclosed herein are plastic-metal hybrid materials that are formed by injection molding a plastic composition comprising a polyketone onto a surface of a metal part, the surface having nanometer-sized pores, micron-sized pores, or both, the pores having been formed by chemical etching or by electrical oxidation and surface coating. Also provided are methods for forming the plastic-metal hybrids, components for electronic devices comprising the hybrid materials, and electronic devices that include a component comprising a plastic-metal hybrid material as disclosed.
    Type: Application
    Filed: June 27, 2019
    Publication date: April 29, 2021
    Inventors: Hui PENG, Wei SHAN, Hyemin PARK, Kihyuk JANG
  • Publication number: 20210055117
    Abstract: A method and system obtaining positioning data from an object traveling on a plurality of routes; mapping the data into a plurality of points on a digital map; identifying points that are unmatched to the stored route trajectory; obtaining candidate transition points from the unmatched points; aggregating the candidate transition points by applying a clustering algorithm; selecting a first cluster of points and a plurality of second clusters of points, determining a confidence level that the first cluster of points are transition points indicating a transition between the routes, classifying the first cluster of points as a first plurality of traveling points having a first direction in response to the confidence being below a threshold confidence and automatically adjusting the stored route trajectory to indicate that the first cluster of points are on the route trajectory.
    Type: Application
    Filed: August 20, 2019
    Publication date: February 25, 2021
    Inventors: WEI SHAN DONG, NING DUAN, PENG GAO, ZHI HU WANG, JUN CHI YAN
  • Publication number: 20210050478
    Abstract: The light-emitting diode package includes a plurality of bumps being a couple corresponding to each other. Each of the bumps has a first part and a second part placed under the first part, and a gap is formed between the bumps in a period-repeating wriggle shape or an irregular wriggle shape. Accordingly, the distance between the bumps of the light-emitting diode package is small, which results in a less stress being concentrated at the space between the bumps, as a result, a crack is difficultly caused by the stress to the light-emitting diode package. In other words, the structural strength between the bumps and the covering part is enhanced. Still, while being manufactured, the yield rate of the light-emitting diode package is also improved since there is almost no crack to reduce the yield rate.
    Type: Application
    Filed: August 13, 2019
    Publication date: February 18, 2021
    Inventors: Ying-Yong SU, Hsin-Mao LIU, Wei-Shan HU, Ching-Tai CHENG
  • Patent number: 10903787
    Abstract: Embodiments of the present disclosure are directed to a universal junction box for solar modules that comprises multiple sub-assemblies with a replaceable diode black and an open-IP plug sub-assembly. The universal junction box includes a first sub-assembly (junction box platform), a second sub-assembly (a replaceable diode block), and a third sub-assembly (an open sub-assembly or plug sub-assembly. If the electronics in the diode block becomes defective, a new replaceable diode block can be used to substitute into the defective diode black without having to replace the entire junction box. The open-IP plug sub-assembly provides the flexibility to couple a variety of cable sub-assembly or IMEs to the universal junction box as long as a particular selected cable sub-assembly fits with the dimension of the open-IP plug sub-assembly.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: January 26, 2021
    Assignee: JA SOLAR USA INC.
    Inventors: Teodor Galitev, Wei Shan
  • Patent number: 10862013
    Abstract: A high-brightness vertical light emitting diode (LED) device includes an outwardly located metal electrode having a low illumination side and a high illumination side. The LED device is formed by: forming the metal electrode on an edge of a surface of a LED epitaxy structure using a deposition method, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), evaporation, electro-plating, or any combination thereof; and then performing a packaging process. The composition of the LED may be a nitride, a phosphide or an arsenide. The LED has the following advantages: improving current spreading performance, reducing light-absorption of the metal electrode, increasing brightness, increasing efficiency, and thereby improving energy efficiency. The metal electrode is located on the edge of the device and on the light emitting side. The metal electrode has two side walls, among which one side wall can receive more emission light from the device in comparison with the other one.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: December 8, 2020
    Assignee: SemiLEDs Optoelectronics Co., Co., Ltd.
    Inventors: Wen-Huang Liu, Li-Wei Shan, Chen-Fu Chu
  • Publication number: 20200373660
    Abstract: A beam forming device, a calibration method and a calibration system using the same are provided. The beam forming device includes a processor, a memory unit, a baseband circuit, and a plurality of antenna modules. The antenna modules each includes multiple antenna elements, and multiple phase shifters and multiple of amplifiers respectively corresponding to the antenna elements. The memory unit stores a reference codebook, a plurality of calibration codebooks and instructing data, each of the plurality of calibration codebooks includes a plurality of records of calibration control data divided by a plurality of target patterns, and a plurality of predetermined phase differences that are different from each other respectively existed between the plurality of calibration codebooks and the reference codebook. The instruction data is used for instructing the beamforming device to use one of the reference codebook and the plurality of calibration codebooks in transmitting and receiving signals.
    Type: Application
    Filed: May 18, 2020
    Publication date: November 26, 2020
    Inventors: CHIH-MIN HSU, TING-YU WU, WEI-SHAN CHANG, JIA-JIUAN WU
  • Publication number: 20200373468
    Abstract: The application discloses a light-emitting device including a carrier, a light-emitting element and a connecting structure. The carrier includes a first connecting portion and a first necking portion extended from the first connecting portion. The first connecting portion has a first width, and the first necking portion has a second width. The second width is less than the first width. The light-emitting element includes a first light-emitting layer being able to emit a first light and a first contacting electrode formed under the first light-emitting layer. The first contacting electrode is corresponded to the first connecting portion. The connecting structure includes a first electrical connecting portion and a protecting portion surrounding the first electrical connecting portion. The first electrical connecting portion is electrically connected to the first connecting portion and the first contacting electrode.
    Type: Application
    Filed: August 11, 2020
    Publication date: November 26, 2020
    Inventors: Ching-Tai CHENG, Shau-Yi CHEN, Yih-Hua RENN, Wei-Shan HU, Pei-Hsuan LAN
  • Publication number: 20200369875
    Abstract: A polycarbonate composition includes: 10 to 99 wt % of one or more bisphenol A polycarbonate homopolymers based on the total weight of the polycarbonate composition; a poly(carbonate-siloxane) having a siloxane content of 30 to 70 wt %, preferably 35 to 65 wt %, based on the total weight of the poly(carbonate-siloxane), optionally wherein the poly(carbonate-siloxane) is a poly(carbonate-siloxane) elastomer, in an amount effective to provide a total siloxane content of 0.5 to 10 wt % based on the total weight of the polycarbonate composition; and wherein a sample of the composition has improved chemical resistance as compared to a reference composition.
    Type: Application
    Filed: August 10, 2018
    Publication date: November 26, 2020
    Inventors: Wei Shan, Siguang Jiang, Ying Na, Rahul Patil
  • Publication number: 20200340807
    Abstract: Embodiments disclosed herein relate generally to methods for measuring a characteristic of a substrate. In an embodiment, the method includes scanning over the substrate with a scanning probe microscope, the substrate having fins thereon, the scanning obtaining images showing respective fin top regions of the fins, the scanning probe microscope interacting with respective portions of sidewalls of the fins by a scanning probe oscillated during the scanning, selecting images obtained at a predetermined depth below the fin top regions to obtain a line edge profile of the fins, by a processor-based system, analyzing the line edge profile of the fins using power spectral density (PSD) method to obtain spatial frequency data of the line edge profile of the fins, and by the processor-based system, calculating line edge roughness of the fins based on the spatial frequency data.
    Type: Application
    Filed: July 13, 2020
    Publication date: October 29, 2020
    Inventors: Wei-Shan HU, Dong GUI, Jang Jung LEE, Che-Liang LI, Duen-Huei HOU, Wen-Chung LIU
  • Patent number: 10817775
    Abstract: Embodiments are described for minimizing a wait time for a rider after sending a ride request for a vehicle. An example computer-implemented method includes receiving a ride request, the request being for travel from a starting location to a zone in a geographic region during a specified timeslot. The method further includes predicting travel demand based on a number of ride requests in the zone during the specified timeslot. The method further includes requesting transport of one or more vehicles to the zone in response to the predicted number of ride requests when the travel demand is predicted to exceed a number of vehicles in the zone during the specified timeslot.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: October 27, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Wei Shan Dong, Peng Gao, Chang Sheng Li, Wei Sun, Renjie Yao, Ting Yuan, Jun Zhu
  • Patent number: 10820073
    Abstract: The present disclosure relates to a speaker box. The speaker box includes a housing having a top wall, and a sounding unit accommodated in the housing. The sounding unit includes a diaphragm, which together with the top wall are disposed with a spacing therebetween to form a front acoustic cavity. The speaker box further includes a sound guiding channel. The front acoustic cavity and the sound guiding channel together constitute a front chamber of the speaker box. At least two first through-holes disposed with a spacing therebetween are provided in a region of the top wall corresponding to the front chamber. The speaker box further includes a cover plate provided on the top wall. The cover plate includes hard sheets covering the first through-holes and a soft rubber fixing portion, which surrounds and spaces the hard sheets from the top wall, and is fixedly connected with the top wall.
    Type: Grant
    Filed: December 29, 2018
    Date of Patent: October 27, 2020
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Wei Shan, Yue Ren