Patents by Inventor Weifeng Liu

Weifeng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9858023
    Abstract: Systems, devices and methods are provided for training a user to control a gimbal in an environment. The systems and methods provide a simulation environment to control a gimbal in a virtual environment. The virtual environment closely resembles a real control environment. A controller may be used to transmit simulation commands and receive simulated data for visual display.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: January 2, 2018
    Assignee: SZ DJI TECHNOLOGY CO., LTD
    Inventors: Ye Tao, Zihan Chen, Zhiyuan Zhang, Weifeng Liu, Chaobin Chen
  • Patent number: 9839125
    Abstract: An electronics assembly includes multiple electronic components coupled to a fabric. Each of the multiple electronic components includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. One of the electrically conductive wire braids interconnects two electronic components, thereby providing an electrical connection between the two electronic components. The electrically conductive wire braid can be attached to the fabric by an adhesive, a stitched thread, which can be either electrically insulated or electrically conductive, or both adhesive and stitched thread. The fabric can be a wearable fabric, such as a shirt or pants, or other form to be worn by a user, such as an armband, waistband, hat or shoes.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: December 5, 2017
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, Zhen Feng, Anwar Mohammed
  • Patent number: 9801277
    Abstract: A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: October 24, 2017
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, Zhen Feng, Anwar Mohammed, David Geiger, Murad Kurwa
  • Publication number: 20170280058
    Abstract: An image processing method includes, when an edit triggering event for a target image is detected, acquiring description information associated with the target image. The description information includes interference information that affects image quality occurred in a shooting process of the target image. The method further includes editing image clips in the target image which are associated with respective interference information of the description information to obtain a processed target image.
    Type: Application
    Filed: June 14, 2017
    Publication date: September 28, 2017
    Inventors: Weifeng LIU, Shunnian LI, Ye TAO, Yayun ZHENG
  • Publication number: 20170280038
    Abstract: An image processing system includes an image receiving unit configured to receive a picture sent by a remote shooting apparatus, an image analysis unit configured to analyze the picture to obtain exposure situations of respective parts in the picture, an exposure evaluation unit configured to evaluate exposure conditions of the respective parts in the picture based on the exposure situations of the respective parts in the picture to determine whether the respective parts in the picture are overexposed and determine overexposed parts, and an exposure information prompt unit configured to prompt an evaluation result in accordance with evaluation of the exposure evaluation unit.
    Type: Application
    Filed: June 13, 2017
    Publication date: September 28, 2017
    Inventors: Chuyue AI, Weifeng LIU
  • Patent number: 9763326
    Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. The electrically conductive wire braid is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire braid.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: September 12, 2017
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, Zhen Feng, Anwar Mohammed
  • Publication number: 20170256288
    Abstract: Methods and systems are provided for video processing. Video may be captured using an image capture device at a first definition. The image capture device may optionally be, or may be on board, an aerial vehicle, such as an unmanned aerial vehicle. A first set of video data may be transmitted to a user terminal at a second definition, which may be less than the first definition. A user may interact with the user terminal to edit the video and generate a video edit request. The video edit request may be transmitted to the image capture device, which may accordingly produce a second set of video data in accordance with the video edit request, at a third definition. The third definition may be greater than the second definition.
    Type: Application
    Filed: May 17, 2017
    Publication date: September 7, 2017
    Inventors: Chuyue Ai, Gaoping Bai, Weifeng Liu, Taiwen Liang, Yajun Lai
  • Publication number: 20170242578
    Abstract: A method and a device for controlling a moving object and a mobile apparatus are provided. The method comprises detecting a contact operation on a touch display, detecting, if the detected contact operation is a sliding cot tact operation in a preset image region, whether the sliding contact operation is a control trigger operation for the moving object, and, if yes, generating a control instruction for the moving object.
    Type: Application
    Filed: May 11, 2017
    Publication date: August 24, 2017
    Inventors: Heli ZHONG, Zhiyuan ZHANG, Weifeng LIU
  • Patent number: 9736932
    Abstract: A method of and device for making a three dimensional electronic circuit. The method comprises coupling one or more magnet wires with a substrate along a surface contour of the substrate, immobilizing the one or more magnet wires on the substrate, and forming the electronic circuit by electrically coupling the one or more magnet wires with an integrated circuit chip.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: August 15, 2017
    Assignee: Flextronics AP, LLC.
    Inventors: Weifeng Liu, Anwar Mohammed, Murad Kurwa
  • Publication number: 20170199053
    Abstract: A method, a device and a system for processing a flight task are provided. The method comprises receiving a loading request for flight data, searching for corresponding flight data according to the loading request, processing located flight data in response to the loading request, and loading the located flight data to control a corresponding aerial vehicle to perform a corresponding flight task.
    Type: Application
    Filed: March 28, 2017
    Publication date: July 13, 2017
    Inventors: Bo PENG, Jiaxiang FANG, Weifeng LIU
  • Patent number: 9699902
    Abstract: A printed circuit board is formed from a plurality of thinner PCBs stacked on top of each other with an intermediate metal interconnect material selectively positioned between adjacent PCBs. The metal interconnect material is selectively positioned on surface contact points of correspondingly aligned plated through holes on the adjacent printed circuit boards. The stacked printed circuit boards and intermediate metal interconnect material are laminated, thereby sintering the metal interconnect material and the surface contact points of the plated through holes to form electrical interconnects between plated through holes on adjacent printed circuit boards. The metal interconnect material is preferably the same as the plating material used to plate the through holes, such as copper.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: July 4, 2017
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, David Geiger, Anwar Mohammed
  • Patent number: 9684864
    Abstract: An RFID device assembly is fabricated by positioning an electrically conductive wire onto a fabric as a pattern that forms an antenna, and securing the wire to the fabric by stitching a non-electrically conductive thread over the wire and to the fabric. The two ends of the electrically conductive wire are positioned for coupling to antenna contact pads on an RFID device. The RFID device is attached to the fabric either before or after the electrically conductive wire is secured to the fabric by the stitched non-electrically conductive thread.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: June 20, 2017
    Assignee: Flextronics AP, LLC.
    Inventors: Weifeng Liu, Zhen Feng, Anwar Mohammed
  • Patent number: 9674950
    Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more metal foils, one metal foil coupled to one electrical connection point on an electronic component. The metal foil is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the metal foil.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: June 6, 2017
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, Zhen Feng, Anwar Mohammed
  • Patent number: 9674952
    Abstract: An electrical interconnect includes a copper pillar and solder cap. The copper pillar and solder cap are formed onto a contact pad or an under bump metallurgy (UBM). In some applications, the contact pad or UBM is part of an electronic component, such as a semiconductor chip. In other cases, the contact pad is part of laminated substrate, such as a printed circuit board (PCB), or a ceramic substrate. The copper pillar and the solder cap are printed using an ink printer, such as an aerosol ink jet printer. A post heat treatment solidifies the interconnection between the contact pad or UBM, the copper pillar and the solder cap.
    Type: Grant
    Filed: September 10, 2014
    Date of Patent: June 6, 2017
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, Anwar Mohammed, Zhen Feng
  • Patent number: 9674949
    Abstract: A stretchable wire assembly includes a metal wire coupled between two elastic substrates. The two elastic substrates are selectively coupled together, and the metal wire is attached to one or both elastic substrates at select locations. The form of the metal wire is such that when the elastic substrates are in a relaxed, or non-stretched, state the metal wire forms a tortuous path, such as a waveform, along the coupled elastic substrates. The tortuous path of the metal wire provides slack such that as the elastic substrates are stretched the slack is taken up. Once released, the elastic substrates move from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the metal wire in the form of the original tortuous path.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: June 6, 2017
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, Zhen Feng, Anwar Mohammed
  • Patent number: 9659359
    Abstract: Methods of and Devices for quality control that can be used with automated optical inspection (AOI), solder paste inspection (SPI), and automated x-ray inspection (AXI) are disclosed. Plurality of threshold settings are entered in a testing process. Multiple testing results are obtained from the testing process. A graphic presentation is generated showing the numerical relationship among the data points, such that a quality control person is able to fine-tune the testing process to have a predetermined ratio of Defect Escaped % to False Call ppm.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: May 23, 2017
    Assignee: Flextronics AP, LLC
    Inventors: Zhen Feng, Weifeng Liu, David Geiger, Anwar Mohammed, Murad Kurwa
  • Publication number: 20170076610
    Abstract: Systems and methods are provided for collecting information regarding flight restriction regions. The information regarding flight restriction regions may be approved of, or the identity of a user inputting such information may be verified. The designated flight restriction regions may be displayed on a three-dimensional map and be utilized by UAVs, for example, in conjunction with flight response measures.
    Type: Application
    Filed: November 23, 2016
    Publication date: March 16, 2017
    Inventors: Weifeng Liu, Jian Zhao, Yulong Deng, Nanning Li
  • Patent number: D790592
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: June 27, 2017
    Assignee: SZ DJI Technology Co., Ltd.
    Inventors: Heli Zhong, Weifeng Liu, Zhiyuan Zhang, Shunnian Li, Xiaojun Li, Yayun Zheng, Taiwen Liang, Ye Tao, Xiaohang Zhong, Liutao Zhang
  • Patent number: D790593
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: June 27, 2017
    Assignee: SZ DJI Technology Co., Ltd.
    Inventors: Heli Zhong, Weifeng Liu, Zhiyuan Zhang, Shunnian Li, Xiaojun Li, Yayun Zheng, Taiwen Liang, Ye Tao, Xiaohang Zhong, Liutao Zhang
  • Patent number: D795269
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: August 22, 2017
    Assignee: SZ DJI Technology Co., Ltd.
    Inventors: Heli Zhong, Weifeng Liu, Zhiyuan Zhang, Shunnian Li, Xiaojun Li, Yayun Zheng, Taiwen Liang, Ye Tao, Xiaohang Zhong, Liutao Zhang