Patents by Inventor Weifeng Liu

Weifeng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170064068
    Abstract: Systems and methods can support application development in a movable object environment. A movable object manager can establish a connection with a movable object, and receives one or more data packets from the movable object. Then, the movable object manager can provide information in said one or more data packets to an application on a user terminal.
    Type: Application
    Filed: November 11, 2016
    Publication date: March 2, 2017
    Applicant: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Weifeng LIU, Xiaojun LI, Caihua ZHAO, Nanning LI, Changjian XU
  • Publication number: 20170061813
    Abstract: System and method can support a simulated movement of a movable object, such as a simulated flight of an unmanned aircraft vehicle (UAV). A process, which can be on a user terminal, can receive state information about the simulated flight from a flight simulator that is associated with the UAV. Then, the process can determine flight information for the simulated flight by associating the received state information with context information obtained by the process on the user terminal, and provides the determined flight information to a display that is associated with the user terminal.
    Type: Application
    Filed: November 11, 2016
    Publication date: March 2, 2017
    Applicant: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Ye TAO, Shunnian Li, Zhiyuan ZHANG, Liutao ZHANG, Weifeng LIU
  • Patent number: 9566764
    Abstract: Two substrates are mechanically and electrically coupled together using a combination of a fast cure electrically non-conductive epoxy for mechanical attachment and a slow cure electrically conductive epoxy for electrical interconnects. The two epoxies are selectively applied between the two substrates as a stack, and the stack is subjected to a temperature that is sufficient to cure the fast cure electrically non-conductive epoxy in a short period of time but does not damage the substrates or components coupled thereto. In some applications, the temperature is less than 100 degrees Celsius and the time period is less than 5 seconds. The stack is removed from the heat and the slow cure electrically conductive epoxy continues to cure over a longer second period of time, such as a few hours to a day.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: February 14, 2017
    Assignee: Flextronics AP, LLC
    Inventors: Anwar Mohammed, Weifeng Liu, David Geiger, Dennis Willie, Gervasio Mutarelli, Murad Kurwa
  • Patent number: 9554465
    Abstract: A stretchable interconnect includes a plurality of electrically conductive traces formed as a complex pattern on an elastic substrate. The form of the electrically conductive traces is such that when the elastic substrate is in a relaxed, or non-stretched, state each of the electrically conductive traces forms a tortuous path, such as a waveform, along the elastic substrate. The tortuous path of the electrically conductive traces provides slack such that as the elastic substrate is stretched the slack is taken up. Once released, the elastic substrate moves from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the electrically conductive traces in the form of the original tortuous path.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: January 24, 2017
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, Anwar Mohammed, Dick Pang, Murad Kurwa
  • Publication number: 20170010611
    Abstract: Systems, devices and methods are provided for training a user to control a gimbal in an environment. The systems and methods provide a simulation environment to control a gimbal in a virtual environment. The virtual environment closely resembles a real control environment. A controller may be used to transmit simulation commands and receive simulated data for visual display.
    Type: Application
    Filed: September 15, 2016
    Publication date: January 12, 2017
    Inventors: Ye Tao, Zihan Chen, Zhiyuan Zhang, Weifeng Liu, Chaobin Chen
  • Patent number: 9510649
    Abstract: A disconnectable snap button connection for connecting electronic devices to fabrics, the disconnectable snap button connection and a method for making the same is described herein. The disconnectable snap button connection includes a component, a piece of conductive material, a piece of non-conductive material; wherein the piece of conductive material is attached to the piece of non-conductive material, a male portion of the disconnectable snap button, wherein the male portion of the disconnectable snap button is attached to the component, and a female portion of the disconnectable snap button, wherein the female portion of the disconnectable snap button is attached to the piece of conductive material. When the male portion of the disconnectable snap button is inserted into the female portion of the disconnectable snap button, a connection is made between the component and the piece of conductive material.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: December 6, 2016
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, Murad Kurwa, Anwar Mohammed, Zhen Feng
  • Publication number: 20160309584
    Abstract: A method and apparatus for forming a circuit on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface of an object is described. An amount of electrically conductive material to form a circuit between two points on the object is determined. The determined amount of electrically conductive material is deposited on a first surface of a stretchable substrate. The stretchable substrate with the deposited electrically conductive material is applied to the object to form a circuit between two points on the object.
    Type: Application
    Filed: June 29, 2016
    Publication date: October 20, 2016
    Applicant: FLEXTRONICS AP, LLC
    Inventors: Anwar Mohammed, Weifeng Liu, Murad Kurwa
  • Patent number: 9466597
    Abstract: Embodiments of the present invention provide a chip package structure and a chip packaging method, which is related to the field of electronic technologies, and can protect chips and effectively dissipate heat for chips. The chip package structure includes a substrate, chips, and a heat dissipating lid, where the chips include at least one master chip disposed on the substrate and at least one slave chip disposed on the substrate; the heat dissipating lid is bonded to the slave chip by using a heat conducting material, and the heat dissipating lid covers the at least one slave chip; and the heat dissipating lid includes a heat dissipating window at a position corresponding to the at least one master chip. The embodiments of the present invention are applicable to multi-chip packaging.
    Type: Grant
    Filed: August 12, 2014
    Date of Patent: October 11, 2016
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Weifeng Liu, Li Ding
  • Patent number: 9449942
    Abstract: A method for making a Radio Frequency Identification (RFID) device on fabric is described herein. In a first example, an RFID semiconductor chip is attached to a piece of fabric. The RFID semiconductor chip includes two terminals. A solid wire is stitched into the fabric making an RFID antenna. The solid wire is attached to the terminals of the RFID semiconductor chip. In a second example, a metal wire is selected. The metal wire is stitched into fabric making an RFID antenna. The metal wire includes two ends and a conductive adhesive is applied to two ends of the metal wire. An RFID semiconductor chip is attached to the fabric. The RFID semiconductor chip includes two terminals and the RFID semiconductor chip is attached to the fabric at the two terminals. The conductive adhesive is cured. In both examples, the wire and the RFID semiconductor chip are encapsulated in fabric.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: September 20, 2016
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, Murad Kurwa, Anwar Mohammed, Zhen Feng
  • Patent number: 9398714
    Abstract: A wearable electronics assembly includes one or more electronic modules coupled to a wearable electronics fabric. Each of the one or more electronic modules includes one or more metal foils, each metal foil electrically coupled at one end to an electrical connection point of the electrical module and at another end to an electrically conductive wire. The electrically conductive wire is stitched to the metal foil and to a fabric onto which the electronic module is attached. The electronic module can include one or more electronic components coupled to a printed circuit board. The metal foils can be formed from interconnects on the printed circuit board or the metal foils can be separate elements coupled to the printed circuit board.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: July 19, 2016
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, Zhen Feng, Anwar Mohammed
  • Patent number: 9398705
    Abstract: A method and apparatus for forming a conductor on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface is described. An amount of conductive material needed to form a conductor between two points on a surface of an object is determined. The determined amount of conductive material is deposited on a substrate. The substrate with the deposited conductive material is applied to the object to form a conductor between the two points on the surface of the object. The conductive material and substrate may be stretchable. The conductive material may be deposited by an inkjet printer or an embedded 3-D printer. The substrate with the deposited conductive material may be applied to the object by laminating the substrate with the deposited conductive material to the object.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: July 19, 2016
    Assignee: FLEXTRONICS AP, LLC.
    Inventors: Anwar Mohammed, Weifeng Liu, Murad Kurwa
  • Patent number: 9378864
    Abstract: A stretchable metal wire assembly includes a metal wire positioned within an elastic tube. The form of the metal wire is such that when the elastic tube is in a relaxed, or non-stretched, state the metal wire forms a tortuous path, such as a waveform, along the elastic tube. The tortuous path of the metal wire provides slack such that as the elastic tube is stretched the slack is taken up. Once released, the elastic tube moves from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the metal wire in the form of the original tortuous path. The metal wire functions as an electrical conductor, thereby providing a device having an extendable length electrical conducting element. In some applications, the metal wire is electrically coupled at each end to an electrical interconnect component.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: June 28, 2016
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, Anwar Mohammed, Murad Kurwa
  • Publication number: 20160183367
    Abstract: An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.
    Type: Application
    Filed: December 18, 2014
    Publication date: June 23, 2016
    Applicant: FLEXTRONICS AP, LLC
    Inventors: Weifeng Liu, Anwar Mohammed, Murad Kurwa
  • Publication number: 20160157363
    Abstract: A method and apparatus for forming a conductor on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface is described. An amount of conductive material needed to form a conductor between two points on a surface of an object is determined. The determined amount of conductive material is deposited on a substrate. The substrate with the deposited conductive material is applied to the object to form a conductor between the two points on the surface of the object. The conductive material and substrate may be stretchable. The conductive material may be deposited by an inkjet printer or an embedded 3-D printer. The substrate with the deposited conductive material may be applied to the object by laminating the substrate with the deposited conductive material to the object.
    Type: Application
    Filed: December 2, 2014
    Publication date: June 2, 2016
    Applicant: FLEXTRONICS AP, LLC
    Inventors: Anwar Mohammed, Weifeng Liu, Murad Kurwa
  • Patent number: 9336476
    Abstract: An RFID device assembly is fabricated by stitching an electrically conductive wire into a fabric as a pattern that forms an antenna. The two ends of the electrically conductive wire are positioned for coupling to antenna contact pads on an RFID device. The RFID device is attached to the fabric either before or after the electrically conductive wire is stitched to the fabric.
    Type: Grant
    Filed: September 10, 2014
    Date of Patent: May 10, 2016
    Assignee: Flextronics AP LLC
    Inventors: Weifeng Liu, Anwar Mohammed, Zhen Feng, Murad Kurwa
  • Patent number: 9338915
    Abstract: A wearable electronics assembly includes one or more electronic modules coupled to a wearable electronics fabric. Each of the one or more electronic modules includes one or more plated through holes, through each of which is coupled an electrically conductive wire. The electrically conductive wire is stitched through the plated through hole and to a fabric onto which the electronic module is attached. The electronic module can include one or more electronic components coupled to a printed circuit board.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: May 10, 2016
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, Anwar Mohammed, Zhen Feng
  • Patent number: 9318407
    Abstract: A package on package (PoP) package structure is disclosed, the structure includes at least two layers of carrier boards that are packaged and stacked in sequence, wherein chips are arranged on the bottom side of the carrier boards, a heat sink is arranged on the bottom side of a carrier board other than a layer-1 carrier board, a pad welded to a system board is arranged on the bottom side of the layer-1 carrier board, and a chip on a carrier board other than a top-layer carrier board is surface-mounted onto the heat sink adjacent to the chip. The heat sink increases the heat dissipation area of the chip, enhances the heat dissipation capabilities of the PoP stacked packages massively, breaks the bottleneck of the high-density integration and miniaturization of the PoP stacked packages, and enhances the packaging density of the PoP stacked packages.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: April 19, 2016
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Weifeng Liu, Yuming Ye, Zhao Xiang, Zhi Xu
  • Patent number: 9269371
    Abstract: Various methods and systems are provided for related to adaptive systems using correntropy. In one embodiment, a signal processing device includes a processing unit and a memory storing an adaptive system executable in the at least one processing unit. The adaptive system includes modules that, when executed by the processing unit, cause the signal processing device to adaptively filter a desired signal using a correntropy cost function. In another embodiment, a method includes adjusting a coefficient of an adaptive filter based at least in part on a correntropy cost function signal, providing an adaptive filter output signal based at least in part on the adjusted coefficient and a reference signal, and determining an error signal based at least in part on a received signal and the adaptive filter output signal.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: February 23, 2016
    Assignee: University of Florida Research Foundation, Inc.
    Inventors: Jose Carlos Principe, Abhishek Singh, Weifeng Liu
  • Patent number: 9257358
    Abstract: A chip stacking packaging structure is provided for achieving high-density stacking and improving a heat dissipation efficiency of the chip stacking packaging structure. The chip stacking packaging structure includes a main substrate and at least one stacking substrate in which a main chip is disposed in the main substrate, at least one stacking chip is disposed on the stacking substrate, and a side edge of the stacking substrate is disposed on the main substrate, so that the stacking chip is connected to the main chip.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: February 9, 2016
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Weifeng Liu
  • Patent number: 9231327
    Abstract: An electronic circuit interconnect apparatus that includes two zipper tracks configured to zip together thereby causing a first circuit to electrically couple with a second circuit. Specifically, each of the zipper tracks include a plurality of teeth, one or more of which are electrically coupled to the first circuit or the second circuit. As a result, when the teeth coupled to the first circuit are zipped to the teeth coupled to the second circuit it causes the first and second circuits to be electrically coupled.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: January 5, 2016
    Assignee: Flextronics AP, LLC
    Inventors: Weifeng Liu, Anwar Mohammed, Murad Kurwa