Abstract: A semiconductor device includes a metal oxide semiconductor device disposed over a substrate and an interconnect plug. The metal oxide semiconductor device includes a gate structure located on the substrate and a raised source/drain region disposed adjacent to the gate structure. The raised source/drain region includes a top surface above a surface of the substrate by a distance. The interconnect plug connects to the raised source/drain region. The interconnect plug includes a doped region contacting the top surface of the raised source/drain region, a metal silicide region located on the doped region, and a metal region located on the metal silicide region.

Abstract: A semiconductor device and a method of fabricating the semiconductor device are provided. The semiconductor device includes a substrate; a source/drain region having a first dopant in the substrate; a barrier layer having a second dopant formed around the source/drain region in the substrate. When a semiconductor device is scaled down, the doped profile in source/drain regions might affect the threshold voltage uniformity, the provided semiconductor device may improve the threshold voltage uniformity by the barrier layer to control the doped profile.

Abstract: A semiconductor device includes a p-type metal oxide semiconductor device (PMOS) and an n-type metal oxide semiconductor device (NMOS) disposed over a substrate. The PMOS has a first gate structure located on the substrate, a carbon doped n-type well disposed under the first gate structure, a first channel region disposed in the carbon doped n-type well, and activated first source/drain regions disposed on opposite sides of the first channel region. The NMOS has a second gate structure located on the substrate, a carbon doped p-type well disposed under the second gate structure, a second channel region disposed in the carbon doped p-type well, and activated second source/drain regions disposed on opposite sides of the second channel region.

Abstract: Embodiments of mechanisms for forming a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and an isolation structure in the semiconductor substrate and surrounding an active region of the semiconductor substrate. The semiconductor device also includes a gate over the semiconductor substrate, and the gate has an intermediate portion over the active region and two end portions connected to the intermediate portion, and the end portions are over the isolation structure. The semiconductor device further includes a support film over the isolation structure and covering the isolation structure and at least one of the end portions of the gate. The support film exposes the active region and the intermediate portion of the gate.

Abstract: Embodiments of mechanisms for forming a semiconductor device are provided. The semiconductor device includes a semiconductor substrate. The semiconductor device also includes an isolation structure in the semiconductor substrate and surrounding an active region of the semiconductor substrate. The semiconductor device includes a gate over the semiconductor substrate. The gate has an intermediate portion over the active region and two end portions connected to the intermediate portion. Each of the end portions has a first gate length longer than a second gate length of the intermediate portion and is located over the isolation structure.

Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4 and SF6, and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.

Abstract: A method of problem case packaging handling consists collecting manufacturing problem information from entities associated with fabrication of a semiconductor product; and distributing the manufacturing problem information into problem cases which are stored in a problem database, each problem case representing a respective manufacturing problem and being associated with manufacturing problem information related to that problem case.

Abstract: A method and system of providing instructions in addressing an equipment problem are provided. An indication of an equipment problem is checked against a solution database to identify at least one suggested solution to the equipment problem. A suggested solution from the at least one suggested solution is provided. An actual fix solution implemented in association with the equipment problem is recorded.

Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4 and SF6, and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.

Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4 and SF6, and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.

Abstract: A system and method thereof for experiment management. A storage device stores an experiment plan record, a merge constraint and an integration rule. A processing unit configured to acquire a first experiment plan from the experiment plan record, and a second experiment plan. The processing unit generates an integrated experiment plan by merging the first experiment plan and the second experiment plan according to the merge constraint and the integration rule, and stores the integrated experiment plan to the storage device.

Abstract: A system and method thereof for experiment management. A storage device stores an experiment plan record, a merge constraint and an integration rule. A processing unit configured to acquire a first experiment plan from the experiment plan record, and a second experiment plan. The processing unit generates an integrated experiment plan by merging the first experiment plan and the second experiment plan according to the merge constraint and the integration rule, and stores the integrated experiment plan to the storage device.

Abstract: Processing equipment for protecting equipment data. A processing unit processes an article, such as a wafer. A storage unit stores equipment data for the processing unit. A controlling unit receives a data retrieval request for the equipment data, wherein the data retrieval request comprises identification data. An authentication unit validates the identification data and retrieves corresponding equipment data form the storage unit through the controlling unit, when the identification data is validated. An encryption unit receives the equipment data from the authentication unit, and encrypts the equipment data. A controlling unit further transfers the encrypted equipment data to an external system.

Abstract: A method of building a problem troubleshooting database for use in a semiconductor manufacturing system includes storing semiconductor manufacturing problem data in a problem troubleshooting database; storing cause data in the problem troubleshooting database, the cause data being associated with respective problem data; storing solution data in the problem troubleshooting database, the solution data being associated with respective semiconductor manufacturing problem data and cause data; evaluating the effectiveness of the solution data; and updating the solution data with information with respect to the effectiveness determined in the evaluating step.

Abstract: A method of problem case packaging handling consists collecting manufacturing problem information from entities associated with fabrication of a semiconductor product; and distributing the manufacturing problem information into problem cases which are stored in a problem database, each problem case representing a respective manufacturing problem and being associated with manufacturing problem information related to that problem case.

Abstract: A method and system of providing instructions in addressing an equipment problem are provided. An indication of an equipment problem is checked against a solution database to identify at least one suggested solution to the equipment problem. A suggested solution from the at least one suggested solution is provided. An actual fix solution implemented in association with the equipment problem is recorded.

Abstract: The present disclosure provides a smart virtual assistant system to assist in the repair and maintenance of semiconductor tools The virtual assistant system includes an interface for receiving a tool alarm from a specified semiconductor tool and a database including a table for providing information as to what can and cannot be done to the specified semiconductor tool. The virtual assistant system also includes two processing subsystems, one including instructions for deducting tool alarm information from the tool alarm and the other for receiving the tool alarm information, perusing the database, and identifying one or more causes associated with the tool alarm information.

Abstract: The present invention provides a multiple platform computer network having: at least one client device; a main service platform, the main service platform in selective communication with the client device when the client device is properly authenticated and authorized for use with the main service platform; a support platform for providing support to the main service platform; a dummy log-in user interface for interfacing between the main service platform and the at least one client device; and a control handling system for handling communications between the main service platform and the support platform. Optionally, a content ID mapping table capable of associating each of a plurality of support platform user numbers with content accessible within the support platform is provided. Two methods of using a multiple platform computer network to simplify access to the network and to reduce licensing fees associated with user access is provided herewithin.

Abstract: A method of forming reflowed bumps comprising the following sequential steps. A wafer is provided. A series of spaced initial bumps is formed upon the wafer. The initial bumps having exposed side walls and top surfaces and organic residue over the initial bump side walls and/or the initial bump top surfaces. The organic residue is simultaneously removed from the initial bump side walls and top surfaces with the forming a surface oxide layer over the initial bump side walls and top surfaces. The surface oxide layer is stripped from the initial bump top surfaces and an upper portion of the initial bump side walls to form partially exposed bumps. The partially exposed bumps are heat treated to melt the partially exposed bumps to form the reflowed bumps.

Abstract: The present invention is directed to a filler assembly for dispensing liquid to and from a container capable of storing an indicated liquid. The filler assembly has a portable part and a stationary part cooperating to provide a sealed dispensing means for communicating an indicated liquid from an indicated liquid source to a container and for safely communicating the indicated liquid from the container to another location. The portable part and the stationary part are adapted to sealably mate together and further provide means for preventing misassembly of the two parts. The portable part provides dispensing means capable of communicating the liquid from the stationary part to a remote location. The stationary part is adapted to further sealably mate and communicate with a container capable of storing an indicated liquid.