Abstract: An enclosure for an electronic device has a staggered materials corner structure. The enclosure includes an integral metal frame defining exterior sides of the enclosure. The integral metal frame has a tab inset and not visible at a corner of the enclosure. The enclosure includes either or both of first and second materials molded around the tab. The tab of the integral metal frame and either or both of the first and second materials define the staggered materials corner structure of the enclosure.

Abstract: A semiconductor device includes a first die having a first bonding layer; a second die having a second bonding layer disposed over and bonded to the first bonding layer; a plurality of bonding members, wherein each of the plurality of bonding members extends within the first bonding layer and the second bonding layer, wherein the plurality of bonding members includes a connecting member electrically connected to a first conductive pattern in the first die and a second conductive pattern in the second die, and a dummy member electrically isolated from the first conductive pattern and the second conductive pattern; and an inductor disposed within the first bonding layer and the second bonding layer. A method of manufacturing a semiconductor device includes bonding a first inductive coil of a first die to a second inductive coil of a second die to form an inductor.

Abstract: An optical film comprising a first surface and a second surface is provided and the first surface and the second surface face in opposite directions. The first surface is disposed with a plurality of first microstructures and a plurality of second microstructures, which are closely adjacent to each other. The first microstructures are upwardly convex quadrangular pyramid structures or triangular pyramid structures, while the second microstructures are downwardly concave quadrangular pyramid structures or triangular pyramid structures.

Abstract: An automatic locking device for assembling a part to a workpiece is provided. The device includes a feeding mechanism, a fixture mechanism, a loading and unloading mechanism, a lifting mechanism, a rotating mechanism, and a locking mechanism. The feeding mechanism feeds the part to the fixture mechanism. The loading and unloading mechanism places the workpiece on the part. The lifting mechanism lifts up the fixture mechanism together with the part and the workpiece. The rotating mechanism rotates the fixture mechanism. The locking mechanism locks the part to the workpiece after the part and the workpiece are rotated by the rotating mechanism. The automatic locking device integrates multiple functions in a single station, reduces the number of the work stations and operatives, lowers the cost, and improves accuracy of the assembly. An assembling apparatus including the automatic locking device is also provided.

Abstract: A pH sensor for detecting a pH of a sample includes a reference electrode and a glass electrode. The reference electrode includes a hollow tubular housing, and at least one water absorbing unit disposed in the housing and including a porous junction member configured to contact the sample, and a water absorbing member disposed on one side of the porous junction member that is opposite to the sample. The water absorbing member is made by soaking a superabsorbent polymer in potassium chloride solution. The glass electrode is inserted into the water absorbing member, and protrudes from the junction member toward the sample.

Abstract: A multi-type industrial robot control system may include: an automation controller; and a programmable logic controller (PLC)-robot bridge. The controller stores a general-purpose robot control function block generated using a unified design standard, calls a corresponding robot control function block for a robot and using robot state data and puts out corresponding first command data to the PLC-robot bridge. The PLC-robot bridge virtualizes robot interfaces of corresponding offline programming functions of different types of robot as a unified virtual interface, calls a corresponding offline programming function via the unified virtual interface according to the first command data, and generates second command data for output to a corresponding robot controller. The corresponding robot controller controls a corresponding robot. At the same time, robot state data from a corresponding type of robot is received via the unified virtual interface and the robot state data is fed back to the automation controller.

Abstract: A pH sensor for detecting a pH of a sample includes a reference electrode and a glass electrode. The reference electrode includes a hollow tubular housing, and at least one water absorbing unit disposed in the housing and including a porous junction member configured to contact the sample, and a water absorbing member disposed on one side of the porous junction member that is opposite to the sample. The water absorbing member is made by soaking a superabsorbent polymer in potassium chloride solution. The glass electrode is inserted into the water absorbing member, and protrudes from the junction member toward the sample.

Abstract: The present invention discloses a hybrid (mixed) formulation composition for 3D additive manufacturing and a manufacturing process. The hybrid formulation composition possesses capability of UV radiation curing and thermal curing. The hybrid formulation composition is designed to be cured by UV radiation in the 3D printing/additive manufacturing process and then post cure by heat to get its final properties. The hybrid formulation composition consists of acrylates (oligomer, monomer, and diluent), photoinitiators, and isocyanate-containing prepolymers which comprises polyols (di-ol, tri-ol) and isocyanates. The hybrid formulation composition may also include reaction accelerator, dye, pigment, and fillers. The finished products of the hybrid formulation composition possess rubber-like properties and can be used in the applications such as shoe sole, toys, medical, and wearables goods . . . etc.

Abstract: Capacitors for use in semiconductor devices including a plurality of first trenches in a first region of a substrate, the first trenches extending in a first direction, a plurality of second trenches in the first region of the substrate, the second trenches extending in a second direction other than the first direction, with the adjacent second trenches and first trenches cooperating to define protruding structures and island structures having an upper surface that is at or below a plane defined by a portion of an upper surface of a substrate surrounding the first region with a series of film pairs including a dielectric layer and a conductive layer formed in the first and second trenches and the protruding and island structures.

Abstract: Various embodiments of the teachings herein include a method for controlling a plurality of execution mechanisms. The method may include: determining a dependency relationship of synchronous motions among the plurality of execution mechanisms, wherein the dependency relationship represents motions of a second group of execution mechanisms in the plurality of execution mechanisms depending on motions of a first group of execution mechanisms in the plurality of execution mechanisms; determining an execution order of the first group of execution mechanisms and the second group of execution mechanisms according to the dependency relationship; determining rotation angles of joints coupled to corresponding execution mechanisms; and sequentially controlling the joints to respectively rotate by the determined rotation angles according to the determined execution order.

Abstract: A pyrazole metal complex for absorption of carbon dioxide, a method for preparing the pyrazole metal complex, and a method for absorbing carbon dioxide are provided; wherein the product produced by reacting pyrazole metal complex and carbon dioxide may be transformed into several economically valuable compounds.

Abstract: A testing device for testing an integrated circuit package is provided, including a printed circuit board, a testing socket, a conductive fastener, a cover, and a conductive element assembly. The printed circuit board includes a first metal layer formed on the bottom surface thereof. The testing socket is disposed above the printed circuit board. The conductive fastener is configured to secure the testing socket to the printed circuit board, wherein the conductive fastener is electrically connected to the first metal layer and the testing socket. The cover is disposed above the testing socket to form a space for accommodating the integrated circuit package between the cover and the testing socket, wherein the cover makes electrical contact with the integrated circuit package. The conductive element assembly is disposed between and electrically connected to the cover and the testing socket.

Abstract: A backlight module is provided. The backlight module includes a substrate; a plurality of light-emitting elements, disposed on the substrate along a first direction and a second direction; and at least one optical film, including: a first surface, having a plurality of cone structures, top points of the cone structures being arranged to form a plurality of first ridges. In addition, an angle is between the first ridge and the first direction; and a second surface, corresponding to the first surface and toward the substrate, the plurality of light-emitting elements being between the substrate and the second surface.

Abstract: A testing device for testing an integrated circuit package is provided, including a printed circuit board having a first surface, a second surface, and multiple conductive layers between the first and second surfaces. A metal layer is formed on the second surface and is electrically connected to one of the conductive layers that is grounded. A testing socket is disposed over the first surface. A conductive fastener secures the testing socket to the printed circuit board and is electrically connected to the metal layer. A cover is disposed over the testing socket to form a space for accommodating the integrated circuit package between the cover and the testing socket. The cover has a conductive surface in contact with the integrated circuit package. A conductive element assembly is disposed between the cover and the testing socket and is electrically connected to the conductive surface and the conductive fastener.

Abstract: A testing device for testing an integrated circuit package is provided, including a printed circuit board having a first surface, a second surface, and multiple conductive layers between the first and second surfaces. A metal layer is formed on the second surface and is electrically connected to one of the conductive layers that is grounded. A testing socket is disposed over the first surface. A conductive fastener secures the testing socket to the printed circuit board and is electrically connected to the metal layer. A cover is disposed over the testing socket to form a space for accommodating the integrated circuit package between the cover and the testing socket. The cover has a conductive surface in contact with the integrated circuit package. A conductive element assembly is disposed between the cover and the testing socket and is electrically connected to the conductive surface and the conductive fastener.

Abstract: The present disclosure provides a bioprinting system (100) for printing a liquid directly onto a subject. The bioprinting system (100) comprises a bioprinting assembly (102). Optionally, a robotic arm (104) and a control system (150) are provided. The bioprinting assembly (102) may be coupled to the robotic arm (104) to be positionable relative to the subject. The bioprinting assembly (102) is configured to dispense the liquid onto the subject and comprises a reservoir (120) for holding the liquid and a loading mechanism (134) to prime the reservoir (120) with the liquid directly prior to printing. The loading mechanism (134) has a one way inlet to permit liquid to be loaded into the reservoir (120) and prevent fluid from exiting the reservoir via the one way inlet. There is also provided associated methods.

Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.

Abstract: A pyrazole metal complex for absorption of carbon dioxide, a method for preparing the pyrazole metal complex, and a method for absorbing carbon dioxide are provided; wherein the product produced by reacting pyrazole metal complex and carbon dioxide may be transformed into several economically valuable compounds.

Abstract: The present invention discloses a hybrid (mixed) formulation composition for 3D additive manufacturing and a manufacturing process. The hybrid formulation composition possesses capability of UV radiation curing and thermal curing. The hybrid formulation composition is designed to be cured by UV radiation in the 3D printing/additive manufacturing process and then post cure by heat to get its final properties. The hybrid formulation composition consists of acrylates (oligomer, monomer, and diluent), photoinitiators, and isocyanate-containing prepolymers which comprises polyols (di-ol, tri-ol) and isocyanates. The hybrid formulation composition may also include reaction accelerator, dye, pigment, and fillers. The finished products of the hybrid formulation composition possess rubber-like properties and can be used in the applications such as shoe sole, toys, medical, and wearables goods . . . etc.

Abstract: The present invention discloses a hybrid (mixed) formulation composition for 3D additive manufacturing and a manufacturing process. The hybrid formulation composition possesses capability of UV radiation curing and thermal curing. The hybrid formulation composition is designed to be cured by UV radiation in the 3D printing/additive manufacturing process and then post cure by heat to get its final properties. The hybrid formulation composition consists of acrylates (oligomer, monomer, and diluent), photoinitiators, and isocyanate-containing prepolymers which comprises polyols (di-ol, tri-ol) and isocyanates. The hybrid formulation composition may also include reaction accelerator, dye, pigment, and fillers. The finished products of the hybrid formulation composition possess rubber-like properties and can be used in the applications such as shoe sole, toys, medical, and wearables goods . . . etc.