Patents by Inventor Wen-Hsi Lee

Wen-Hsi Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050095464
    Abstract: The invention is directed to an ultralow firing temperature compensating ceramic composition, which comprises a ceramic material system represented by formula (I) Baw(NdxSMy)2TizOw+3x+3y+3z and a sintering flux represented by formula (II) (Zn,Si,Cu,Al,Mg,Ba,Bi,B)O. The ceramic material system of formula (I) comprises 10 to 30 mole % barium oxide, 10 to 30 mole % neodymium oxide, 0 to 20 mole % samarium oxide and 40 to 70 mole % titanium oxide. The sintering flux of formula (II) constitutes 5 to 40 mole % of the composition and comprises 1 to 5 weight % magnesium oxide, 1 to 5 weight % copper oxide, 5 to 30 weight % zinc oxide, 20 to 60 weight % bismuth oxide, 5 to 10 weight % aluminum oxide, 5 to 15 weight % silicon dioxide, 10 to 30 weight % barium oxide and 1 to 5 weight % boron oxide. The invention is also directed to a sintering flux system and a laminated ceramic element which is produced from the ultralow firing temperature compensating ceramic composition.
    Type: Application
    Filed: October 29, 2003
    Publication date: May 5, 2005
    Inventors: Wen-Hsi Lee, Chun-Te Lee, Ching-Li Hu
  • Publication number: 20040209055
    Abstract: The present invention provides a multilayer ceramic composition comprising at least one layer of dielectric material M1 and at least one layer of dielectric material M2, wherein passive components are buried in both layers of dielectric material M1 and M2 that prevent each other from shrinkage in the X and Y dimensions during firing. Each layer of the multilayer ceramic composition according to the invention can be used as a substrate for burying the passive component and has the ability to prevent other layer with different dielectric constant from shrinkage. Hence, the multilayer ceramic composition has the advantages of smaller size and a better circuit precision.
    Type: Application
    Filed: April 18, 2003
    Publication date: October 21, 2004
    Applicant: Yageo Corpoartion
    Inventors: Wen-Hsi Lee, Che-Yi Su, Yi-Jung Ling
  • Publication number: 20040196638
    Abstract: The present invention mainly relates to a method for reducing shrinkage during sintering low-temperature-cofired ceramics, the ceramics comprising a dielectric portion and a heterogeneous material portion, the method comprising the steps of: (a) providing a monolithic structure, the monolithic structure comprising a dielectric body and a constraining layer; the dielectric body comprising at least one dielectric layer that comprises at least one active area; wherein said active area is disposed with at least one heterogeneous material pattern; the constraining layer positioned on the top of the dielectric body comprising at least one window wherein the edge of the active area of the dielectric layer each falls within the edge of the window in the vertical direction; (b) firing the monolithic structure; and (c) singulating the monolithic structure along a cutting line to provide the low-temperature-cofired ceramics, wherein the cutting line is disposed in the area formed between the edge of the window and the e
    Type: Application
    Filed: April 21, 2004
    Publication date: October 7, 2004
    Applicant: Yageo Corporation
    Inventors: Wen-Hsi Lee, Che-Yi Su, Chun-Te Lee
  • Publication number: 20030168150
    Abstract: The present invention mainly relates to a method for reducing X-Y shrinkage during sintering low temperature ceramic comprising piling a constrain layer on a dielectric layer on a green ceramic body, which is printed with heterogeneous materials for conductors, resistors, capacitors and the like and/or disposed conductors, resistors, capacitors and the like to reduce shrinkage of the dielectric layer and the green ceramic body. The invention is characterized in that the constrain layer comprises windows in positions complying with the heterogeneous materials and/or conductors, resistors, capacitors and the like printed and/or disposed on the dielectric layer and the green ceramic body to make the heterogeneous materials and/or conductors, resistors, capacitors and the like not being covered when piling the constrain layer and the dielectric layers of the green ceramic body.
    Type: Application
    Filed: August 20, 2002
    Publication date: September 11, 2003
    Applicant: Phycomp Taiwan Ltd
    Inventors: Wen-Hsi Lee, Che-Yi Su, Chun-Te Lee, Jui-Chu Jao
  • Patent number: 6437970
    Abstract: A capacitor having a ceramic dielectric and at least two electrodes, in which the dielectric is essentially a dielectric ceramic composition of a barium-calcium-manganese-zirconium-titanate having the general formula (Ba1−xCax)yO3 with 0<a≦0.25, 0<b≦0.015, 0.001≦c≦0.01, 0.005≦d≦0.02, 0<x≦0.20, 1.001≦y≦1.014, 0.0005≦z≦0.03 and is characterized by a high capacitance, small dimensions and a long lifetime.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: August 20, 2002
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Wen-Hsi Lee, Detlev Hennings, Herbert Schreinemacher
  • Patent number: 6043974
    Abstract: A ceramic composition on the basis of a doped BaTiO.sub.3, a ceramic multilayer having such ceramic composition and a monolithic capacitor having such a composition are provided according to the invention. The composition corresponds to the formula(Ba.sub.1-a-b Ca.sub.a Dy.sub.b)(Ti.sub.1-c-d-e-f Zr.sub.c Mn.sub.d Nb.sub.e).sub.f O.sub.3+.delta.wherein: 0.00<a.ltoreq.0.200.006.ltoreq.b.ltoreq.0.0160.00<c.ltoreq.0.250.3b+0.7e<d.ltoreq.0.0140.001.ltoreq.e.ltoreq.0.0051.000<f.ltoreq.1.007.Capacitors having this ceramic composition as a dielectric material show an increased life-time well as a good resistance against degradation of their electrical properties if used at high temperatures under dc conditions.
    Type: Grant
    Filed: May 20, 1998
    Date of Patent: March 28, 2000
    Assignee: U.S. Philips Corporation
    Inventors: Zhien C. Chen, Wen-Hsi Lee, Tseung-Yuen Tseng