Abstract: An action recognition system is illustrated. The action recognition system has an annular body, at least one light emitting unit, at least one light sensing unit and an action recognition module. The annular body is worn on a movable part of a user. One end of the light emitting unit is exposed on an inner side of the annular body, wherein the light emitting unit emits a first light beam illuminating at least a portion of the movable part. One end of the light sensing unit is exposed on the inner side of the annular body. The light sensing unit operatively senses a second light beam reflected by the at least portion of the movable part and generates a light sensing signal. The action recognition module is configured to operatively determine an action of the user according to the light sensing signal.

Abstract: A chip on film package including a chip and a flexible film. The chip includes bumps disposed on the chip and is mounted on the flexible film. The flexible film includes first vias, second vias, upper leads and lower leads. The first vias and the second vias penetrate the flexible film and are arranged on two opposite sides of a reference line respectively. A distance between one of the first vias and one of the second vias, which are closer to a first side of the chip, is longer than that between another one of the first vias and another one of the second, which are further from the first side. The upper leads are disposed on the upper surface connected between the vias and the bumps. The lower leads are disposed on the lower surface and connected to the vias.

Abstract: An action recognition system is illustrated. The action recognition system has an annular body, at least one light emitting unit, at least one light sensing unit and an action recognition module. The annular body is worn on a movable part of a user. One end of the light emitting unit is exposed on an inner side of the annular body, wherein the light emitting unit emits a first light beam illuminating at least a portion of the movable part. One end of the light sensing unit is exposed on the inner side of the annular body. The light sensing unit operatively senses a second light beam reflected by the at least portion of the movable part and generates a light sensing signal. The action recognition module is configured to operatively determine an action of the user according to the light sensing signal.

Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.

Abstract: An electronic device includes a substrate and first bumps. The first bumps are disposed on the substrate and arranged in a first bump row. Each first bump has a first end and a second end opposite to each other. Centers of the first ends of the first bumps are on a first axial line. A first axial coordinate of a center of the second end of a respective first bump relative to a second axial line perpendicular to the first axial line is XA(1+?AYA), in which XA is a first axial coordinate of the center of the first end of the respective first bump relative to the second axial line, YA is a second axial coordinate of the center of the second end of the respective first bump relative to the first axial line, and ?A is a slope coefficient of the respective first bump.

Abstract: A cooking apparatus for cooking ingredients packaged together in a package is provided. The cooking apparatus includes a cooking device and a barcode reader. The cooking device includes a housing defining a cooking room for accommodating the ingredients therein, a cooking unit for heating contents in the cooking room, and a control module electrically connected to the cooking unit for controlling operation of the cooking unit. The barcode reader is electrically connected to the control module, and scans a barcode on the package representing data related to information about the ingredients, decodes the barcode so as to obtain the data, and transmits the data to the control module that controls operation of the cooking unit based on the information.

Abstract: An electronic device includes a substrate and first bumps. The first bumps are disposed on the substrate and arranged in a first bump row. Each first bump has a first end and a second end opposite to each other. Centers of the first ends of the first bumps are on a first axial line. A first axial coordinate of a center of the second end of a respective first bump relative to a second axial line perpendicular to the first axial line is XA(1+?AYA), in which XA is a first axial coordinate of the center of the first end of the respective first bump relative to the second axial line, YA is a second axial coordinate of the center of the second end of the respective first bump relative to the first axial line, and ?A is a slope coefficient of the respective first bump.

Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.

Abstract: In one example, an apparatus includes an extreme ultraviolet illumination source and an illuminator. The extreme ultraviolet illumination source is arranged to generate a beam of extreme ultraviolet illumination to pattern a resist layer on a substrate. The illuminator is arranged to direct the beam of extreme ultraviolet illumination onto a surface of a photomask. In one example, the illuminator includes a field facet mirror and a pupil facet mirror. The field facet mirror includes a first plurality of facets arranged to split the beam of extreme ultraviolet illumination into a plurality of light channels. The pupil facet mirror includes a second plurality of facets arranged to direct the plurality of light channels onto the surface of the photomask. The distribution of the second plurality of facets is denser at a periphery of the pupil facet mirror than at a center of the pupil facet mirror.

Abstract: A waste gas treatment method with the application of nano-bubbles and a waste gas treatment system using the same are provided. The method includes the steps of: feeding waste gas to an accommodating space; flowing a predetermined body of water in the accommodating space and generating the predetermined body of water including nano-bubbles; directing the waste gas mixed with the predetermined body of water including the nano-bubbles to a swirling unit; and discharging the treated gas waste. The predetermined body of water including the nano-bubbles is mixed with the waste gas so that the nano-bubbles of the predetermined water and the waste gas may be sufficiently subjected to the cavitation effect and supercritical water oxidation, and harmful substances such as sulfur dioxide, nitrogen monoxide and other nitrogen oxides, volatile organic compounds, heavy metals and the like, of the waste gas may be removed.

Abstract: An action recognition system is illustrated. The action recognition system has an annular body, at least one light emitting unit, at least one light sensing unit and an action recognition module. The annular body is worn on a movable part of a user. One end of the light emitting unit is exposed on an inner side of the annular body, wherein the light emitting unit emits a first light beam illuminating at least a portion of the movable part. One end of the light sensing unit is exposed on the inner side of the annular body. The light sensing unit operatively senses a second light beam reflected by the at least portion of the movable part and generates a light sensing signal. The action recognition module is configured to operatively determine an action of the user according to the light sensing signal.

Abstract: A method of operating a semiconductor apparatus includes forming a first electron beam passing through a first shaping aperture; modifying an energy distribution of the first electron beam by a second shaping aperture, such that the first electron beam has a main region and an edge region having a greater energy than the main region; and exposing a workpiece to the main region and the edge region of the first electron beam to create a pattern.

Abstract: An action recognition system is illustrated. The action recognition system has an annular body, at least one light emitting unit, at least one light sensing unit and an action recognition module. The annular body is worn on a movable part of a user. One end of the light emitting unit is exposed on an inner side of the annular body, wherein the light emitting unit emits a first light beam illuminating at least a portion of the movable part. One end of the light sensing unit is exposed on the inner side of the annular body. The light sensing unit operatively senses a second light beam reflected by the at least portion of the movable part and generates a light sensing signal. The action recognition module is configured to operatively determine an action of the user according to the light sensing signal.

Abstract: An integrated circuit for driving a display panel is provided. The integrated circuit includes a gamma mapping unit and a mura compensation unit. The gamma mapping unit is configured to receive a gray level of an image data, map the gray level to a gamma code according to at least one gamma table, and output the gamma code. The mura compensation unit is configured to receive the gamma code, and compensate the gamma code according to at least one de-mura table to generate a compensation result after the gamma mapping unit performs the step of mapping the gray level to the gamma code. The integrated circuit drives the display panel according to the compensation result. In addition, a method for driving a display panel is also provided.

Abstract: A method of generating a layout pattern includes determining a first energy density indirectly exposed to a first feature of one or more features of a layout pattern on an energy-sensitive material when the one or more features of the layout pattern on the energy-sensitive material are directly exposed by a charged particle beam. The method also includes adjusting a second energy density exposed the first feature when the first feature is directly exposed by the charged particle beam. A total energy density of the first feature that comprises a sum of the first energy density from the indirect exposure and the second energy density from the direct exposure is maintained at about a threshold energy level to fully expose the first feature in the energy-sensitive material.

Abstract: An action recognition system is illustrated. The action recognition system has an annular body, at least one light emitting unit, at least one light sensing unit and an action recognition module. The annular body is worn on a movable part of a user. One end of the light emitting unit is exposed on an inner side of the annular body, wherein the light emitting unit emits a first light beam illuminating at least a portion of the movable part. One end of the light sensing unit is exposed on the inner side of the annular body. The light sensing unit operatively senses a second light beam reflected by the at least portion of the movable part and generates a light sensing signal. The action recognition module is configured to operatively determine an action of the user according to the light sensing signal.

Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.

Abstract: A localization device using a magnetic field for positioning a moving object is provided. The localization device includes a magnetic landmark, a set of at least four tri-axes magnetic sensors mounted on the moving object, and a logic operation processing unit. The set of at least four tri-axes magnetic sensors forms four non-coplanar points in a three-dimension coordinate system. The logic operation processing unit is connected to the set of at least four tri-axes magnetic sensors. The set of at least four tri-axes magnetic sensors senses the magnetic field of the magnetic landmark and generates at least four magnetic signals transmitted to the logic operation processing unit.

Abstract: A chip on film package including a chip and a flexible film. The chip includes bumps disposed on the chip and is mounted on the flexible film. The flexible film includes first vias, second vias, upper leads and lower leads. The first vias and the second vias penetrate the flexible film and are arranged on two opposite sides of a reference line respectively. A distance between one of the first vias and one of the second vias, which are closer to a first side of the chip, is longer than that between another one of the first vias and another one of the second, which are further from the first side. The upper leads are disposed on the upper surface connected between the vias and the bumps. The lower leads are disposed on the lower surface and connected to the vias.