Abstract: In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.

Abstract: In a method of de-mounting a pellicle from a photo mask, the photo mask with the pellicle is placed on a pellicle holder. The pellicle is attached to the photo mask by a plurality of micro structures. The plurality of micro structures are detached from the photo mask by applying a force or energy to the plurality of micro structures before or without applying a pulling force to separate the pellicle from the photo mask. The pellicle is de-mounted from the photo mask. In one or more of the foregoing and following embodiments, the plurality of micro structures are made of an elastomer.

Abstract: A method for forming a semiconductor device structure includes forming first nanostructures and second nanostructures over a substrate. The method also includes forming a first metal gate layer surrounding the first nanostructures and over the first nanostructures and the second nanostructures. The method also includes etching back the first metal gate layer over the first nanostructures and the second nanostructures. The method also includes removing the first metal gate layer over the second nanostructures. The method also includes forming a second metal gate layer surrounding the second nanostructures and over the first nanostructures and the second nanostructures.

Abstract: An image capturing lens assembly includes six lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The fourth lens element with positive refractive power has an object-side surface being concave in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof. The sixth lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. At least one of an object-side surface and an image-side surface of at least one lens element has at least one inflection in an off-axis region thereof.

Abstract: Provided herein are methods of treatment of AML comprising administering 2-(4-chlorophenyl)-N-((2-(2,6-dioxopiperidin-3-yl)-1-oxoisoindolin-5-yl)methyl)-2,2-difluoroacetamide or a stereoisomer or mixture of stereoisomers, pharmaceutically acceptable salt, tautomer, prodrug, solvate, hydrate, co-crystal, clathrate, or polymorph thereof in a combination therapy.

Abstract: A semiconductor device includes a semiconductor substrate, a gate dielectric, a gate electrode, and a pair of source/drain regions. The gate dielectric is disposed in the semiconductor substrate having an upper boundary lower than an upper surface of the semiconductor substrate, and an upper surface flush with the upper surface of the semiconductor substrate. The gate electrode is disposed over the gate dielectric having a first section over the upper boundary of the gate dielectric and a second section over the upper surface of the gate dielectric. The second section partially covers and partially exposes the upper surface of the gate dielectric. The pair of source/drain regions are disposed on opposing sides of the gate dielectric.

Abstract: A relay node and method for encapsulating a packet based on a tunneling protocol. The relay node includes a communication device, a storage device, and a processor. The communication device communicates with a receiving node and a transmitting node; the storage device stores multiple instructions; and the processor is coupled to the communication device and the storage device for loading and executing the multiple instructions stored in the storage device to: control the communication device to receive a packet transmitted by the transmitting node; generate a protocol header related to the packet based on the packet, and calculate a checksum as a checksum block in the multiple sections using multiple sections in the protocol header at least; generate an encapsulated packet including the protocol header and the packet; and transmit the encapsulated packet to the receiving node through the communication device for verifying the checksum block.

Abstract: A broadband interferometer lightning positioning method based on pulse matching and a system thereof that improves the positioning accuracy of the interferometer to the lightning radiation source. The method includes acquiring a very high frequency radiation pulse signal set of lightning; determining a first very high frequency radiation pulse signal within a set time period as a reference pulse signal; determining a first comparison pulse signal, and determining a second comparison pulse signal; moving both the first comparison pulse signal and the second comparison pulse signal to the position corresponding to the reference pulse signal using the cross-correlation algorithm to obtain a pulse signal set, simultaneously covering each pulse signal in the pulse signal set using a sliding window with a set width to determine the position of the lightning radiation source.

Abstract: A microcoil element, an array-type microcoil element and a device are provided. The microcoil element includes a wiring layer having continuous multiple metal line segments that form multiple loops around a starting point of the element. Every metal line segment includes a first electrode end and a second electrode end. The microcoil element includes an electrode layer having a first electrode zone and a second electrode zone that respectively collect the first electrode ends and the second electrode ends of the multiple metal line segments. When designing the microcoil element, parameters such as a total length of the multiple line segments, a line width, a line spacing of adjacent line segments, a length of each line segment, turns of the microcoil, and a loop distance according to impedance requirement. The single microcoil element or the array-type microcoil element can be used as a magnetic component of a device.

Abstract: A projector includes a first light source, a second light source, a collimating lens, a wavelength conversion module and a dichroic mirror. The first light source and the second light source respectively emit a first illumination beam and a second illumination beam. The collimating lens includes a first part and a second part and configured to receive and transmit the first illumination beam. The wavelength conversion module receives the first illumination beam from the first part, and generates an excitation beam transmitted toward the first part and the second part. The dichroic mirror corresponds to the first part, and configured to reflect the first illumination beam and the second illumination beam respectively to different directions for projecting the first illumination beam onto the first part and to be passed by the excitation beam.

Abstract: A relay node and method for encapsulating a packet based on a tunneling protocol. The relay node includes a communication device, a storage device, and a processor. The communication device communicates with a receiving node and a transmitting node; the storage device stores multiple instructions; and the processor is coupled to the communication device and the storage device for loading and executing the multiple instructions stored in the storage device to: control the communication device to receive a packet transmitted by the transmitting node; generate a protocol header related to the packet based on the packet, and calculate a checksum as a checksum block in the multiple sections using multiple sections in the protocol header at least; generate an encapsulated packet including the protocol header and the packet; and transmit the encapsulated packet to the receiving node through the communication device for verifying the checksum block.

Abstract: An image capturing lens assembly includes six lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The fourth lens element with positive refractive power has an object-side surface being concave in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof. The sixth lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. At least one of an object-side surface and an image-side surface of at least one lens element has at least one inflection in an off-axis region thereof.

Abstract: In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.

Abstract: An imaging optical lens assembly includes five lens elements. The five lens elements in order from an object side to an image side along an optical path are a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. Each of the five lens elements has an object-side surface facing the object side and an image-side surface facing the image side. The first lens element has positive refractive power, the second lens element has negative refractive power and the third lens element has negative refractive power. With specific conditions being satisfied, the imaging optical lens assembly can be miniaturized while providing good image quality.

Abstract: Low-level nodes (LLNs) that are communicatively connected to one another each have sensing capability and processing capability. High-level nodes (HLNs) that are communicatively connected to one another and to the LLNs each have processing capability more powerful than the processing capability of each LLN. The LLNs and the HLNs perform processing based on sensing events captured by the LLNs. The processing is performed by the LLNs and the HLNs to minimize data communication among the LLNs and the HLNs, and to provide for software-defined sensing.

Abstract: In a method of de-mounting a pellicle from a photo mask, the photo mask with the pellicle is placed on a pellicle holder. The pellicle is attached to the photo mask by a plurality of micro structures. The plurality of micro structures are detached from the photo mask by applying a force or energy to the plurality of micro structures before or without applying a pulling force to separate the pellicle from the photo mask. The pellicle is de-mounted from the photo mask. In one or more of the foregoing and following embodiments, the plurality of micro structures are made of an elastomer.

Abstract: A method may include receiving an unstructured question from a user having structured contextual features. The unstructured question may include tokens. The method may further include converting, using a sentence embedding model, the tokens to a question vector, assigning the question vector to a question cluster, assigning, by applying a user clustering model to the question cluster and the structured contextual features, the user to a user cluster, and assigning, using a trained machine learning model, a channel to the user cluster. The channel may be used to communicate with a customer service agent for a management application. The trained machine learning model may assign, using metrics, a channel to each user cluster. The method may further include recommending, based on assigning the channel to the user cluster, the channel to the user for the question.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a field plate, a gate electrode, and a first dielectric layer. The substrate has a top surface. The substrate includes a first drift region with a first conductivity type extending from the top surface of the substrate into the substrate, and includes a second drill region with the first conductivity type extending from the top surface of the substrate into the substrate and adjacent to the first drift region. The field plate is over the substrate. The gate electrode has a first portion and a second portion, wherein the first portion of the gate electrode is located over the field plate. The first dielectric layer is between the substrate and the field plate. The first portion of the gate electrode is overlapping with a boundary of the first drift region and the second drift region in the substrate.

Abstract: Low-level nodes (LLNs) that are communicatively connected to one another each have sensing capability and processing capability. High-level nodes (HLNs) that are communicatively connected to one another and to the LLNs each have processing capability more powerful than the processing capability of each LLN. The LLNs and the HLNs perform processing based on sensing events captured by the LLNs. The processing is performed by the LLNs and the HLNs to minimize data communication among the LLNs and the HLNs, and to provide for software-defined sensing.

Abstract: An imaging optical lens assembly includes five lens elements, which are, in order from an object side to an image side along an optical path, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. Each of the five lens elements has an object-side surface towards the object side and an image-side surface towards the image side. The third lens element has positive refractive power. At least one of the object-side surface and the image-side surface of at least one of the five lens elements includes at least one critical point in an off-axis region thereof.