Patents by Inventor Wenling Wang

Wenling Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020045146
    Abstract: A heat treatment apparatus for making a heat treatment while estimating temperatures of objects-to-be-processed can estimate correct temperatures of the objects-to-be-processed.
    Type: Application
    Filed: September 13, 2001
    Publication date: April 18, 2002
    Inventors: Wenling Wang, Koichi Sakamoto, Fujio Suzuki, Moyuru Yasuhara
  • Publication number: 20020014483
    Abstract: There is provided a batch type heat treatment system, control method and heat treatment method capable of appropriately coping with a multi-product small-lot production.
    Type: Application
    Filed: July 5, 2001
    Publication date: February 7, 2002
    Inventors: Fujio Suzuki, Wenling Wang, Koichi Sakamoto, Moyuru Yasuhara
  • Publication number: 20020001788
    Abstract: This invention is a method of determining set temperature trajectories for a heat treatment system that conducts a first heat treatment process and a second heat treatment process to an object to be processed. The method comprises the steps of: conducting the first heat treatment process to a first test object to be processed, by using a temporary first set temperature trajectory; measuring a result of the first heat treatment process produced on the first test object to be processed; and determining a first set temperature trajectory for the first heat treatment process by correcting the temporary first set temperature trajectory on the basis of the measured result of the first heat treatment process.
    Type: Application
    Filed: August 22, 2001
    Publication date: January 3, 2002
    Inventors: Koichi Sakamoto, Wenling Wang, Fujio Suzuki, Moyuru Yasuhara, Keisuke Suzuki
  • Patent number: 6329643
    Abstract: A second vertical heat treating apparatus is temperature-calibrated based on a heat treatment result obtained by a first vertical heat treating apparatus for reference. First, temperature measurement wafers is heated in the first apparatus to obtain set values of temperature controllers for a target value of temperature. Then, wafers are subjected to an oxidizing process in the first apparatus by using these set values to form an oxide film. The thickness of the oxide film is measured and recorded as a reference film thickness. Then, wafers are subjected to an oxidizing process in a second apparatus at temperatures near the target value to form an oxide film. The thickness of the oxide film is measured, and difference in thickness between the oxide film formed in the second apparatus and the reference film thickness is obtained.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: December 11, 2001
    Assignee: Tokyo Electron Limited
    Inventors: Fujio Suzuki, Koichi Sakamoto, Wenling Wang, Moyuru Yasuhara