Patents by Inventor William L. Brodsky
William L. Brodsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10175064Abstract: Electronic circuits, electronic packages, and methods of fabrication are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board.Type: GrantFiled: September 25, 2015Date of Patent: January 8, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William L. Brodsky, Silvio Dragone, Roger S. Krabbenhoft, David C. Long, Stefano S. Oggioni, Michael T. Peets, William Santiago-Fernandez
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Patent number: 10172232Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.Type: GrantFiled: November 30, 2017Date of Patent: January 1, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William L. Brodsky, James A. Busby, Edward N. Cohen, Silvio Dragone, Michael J. Fisher, David C. Long, Michael T. Peets, William Santiago-Fernandez, Thomas Weiss
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Patent number: 10168185Abstract: Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board.Type: GrantFiled: November 16, 2015Date of Patent: January 1, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William L. Brodsky, Silvio Dragone, Roger S. Krabbenhoft, David C. Long, Stefano S. Oggioni, Michael T. Peets, William Santiago-Fernandez
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Patent number: 10143090Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes, for instance, a tamper-respondent sensor having at least one flexible layer and paired conductive lines disposed on the at least one flexible layer. The paired conductive lines form, at least in part, at least one tamper-detect network of the tamper-respondent sensor. The tamper-respondent electronic circuit structure further includes monitor circuitry electrically connected to the paired conductive lines to differentially monitor the paired conductive lines for a tamper event. In enhanced embodiments, multiple interconnect vias electrically connect to two or more layers of paired conductive lines and are disposed in an unfolded interconnect area of the tamper-respondent sensor when the sensor is operatively positioned about an electronic component or assembly to be protected.Type: GrantFiled: October 19, 2015Date of Patent: November 27, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William L. Brodsky, James A. Busby, Edward N. Cohen, Phillip Duane Isaacs
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Patent number: 10136519Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes, for instance, a tamper-respondent sensor having at least one flexible layer and paired conductive lines disposed on the at least one flexible layer. The paired conductive lines form, at least in part, at least one tamper-detect network of the tamper-respondent sensor. The tamper-respondent electronic circuit structure further includes monitor circuitry electrically connected to the paired conductive lines to differentially monitor the paired conductive lines for a tamper event. In enhanced embodiments, multiple interconnect vias electrically connect to two or more layers of paired conductive lines and are disposed in an unfolded interconnect area of the tamper-respondent sensor when the sensor is operatively positioned about an electronic component or assembly to be protected.Type: GrantFiled: June 20, 2016Date of Patent: November 20, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William L. Brodsky, James A. Busby, Edward N. Cohen, Phillip Duane Isaacs
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Patent number: 10109172Abstract: A first value is received and is associated with a noise level of an environment that a user is in. It is determined whether the first value exceeds a first threshold. A second computing device is notified when the first value exceeds the first threshold. The notifying indicates that the user must leave the environment.Type: GrantFiled: December 27, 2017Date of Patent: October 23, 2018Assignee: International Business Machines CorporationInventors: John S. Werner, Arkadiy O. Tsfasman, Byron S. Green, William L. Brodsky, Jeffrey A. Newcomer, Robert K. Mullady
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Publication number: 20180301011Abstract: A first value is received and is associated with a noise level of an environment that a user is in. It is determined whether the first value exceeds a first threshold. A second computing device is notified when the first value exceeds the first threshold. The notifying indicates that the user must leave the environment.Type: ApplicationFiled: December 27, 2017Publication date: October 18, 2018Inventors: John S. Werner, Arkadiy O. Tsfasman, Byron S. Green, William L. Brodsky, Jeffrey A. Newcomer, Robert K. Mullady
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Publication number: 20180303011Abstract: A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.Type: ApplicationFiled: June 14, 2018Publication date: October 18, 2018Inventors: William L. Brodsky, Robert R. Genest, John J. Loparco, Michael T. Peets
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Patent number: 10103489Abstract: In one or more aspects, a determination is made as to whether a connector is securely fastened, whether the connector connected within a socket structure is the expected connector for that socket structure, and/or whether connectors coupled to one another via one or more cables are properly positioned for communication between them. Information on selected physical connection elements of a connector is used to determine one or more structural characteristics of the cable(s) connected to the connector and to determine whether the connector is the expected connector for a particular socket structure.Type: GrantFiled: January 9, 2017Date of Patent: October 16, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William L. Brodsky, William P. Kostenko
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Patent number: 10068451Abstract: A first value is received and is associated with a noise level of an environment that a user is in. It is determined whether the first value exceeds a first threshold. A second computing device is notified when the first value exceeds the first threshold. The notifying indicates that the user must leave the environment.Type: GrantFiled: April 18, 2017Date of Patent: September 4, 2018Assignee: International Business Machines CorporationInventors: John S. Werner, Arkadiy O. Tsfasman, Byron S. Green, William L. Brodsky, Jeffrey A. Newcomer, Robert K. Mullady
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Publication number: 20180235081Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an enclosure, an in-situ-formed tamper-detect sensor, and one or more flexible tamper-detect sensors. The enclosure encloses, at least in part, one or more electronic components to be protected, and the in-situ-formed tamper-detect sensor is formed in place over an inner surface of the enclosure. The flexible tamper-detect sensor(s) is disposed over the in-situ-formed tamper-detect sensor, such that the in-situ-formed tamper-detect sensor is between the inner surface of the enclosure and the flexible tamper-detect sensor(s). Together the in-situ-formed tamper-detect sensor and flexible tamper-detect sensor(s) facilitate defining, at least in part, a secure volume about the one or more electronic components.Type: ApplicationFiled: February 13, 2017Publication date: August 16, 2018Inventors: William L. BRODSKY, James A. BUSBY, John R. DANGLER, Silvio DRAGONE, Michael J. FISHER, David C. LONG
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Patent number: 10028419Abstract: A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.Type: GrantFiled: February 6, 2017Date of Patent: July 17, 2018Assignee: International Business Machines CorporationInventors: William L. Brodsky, Robert R. Genest, John J. Loparco, Michael T. Peets
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Publication number: 20180123278Abstract: A plug comprises power contacts and a plug trip contact. During a plugging action between the plug and a receptacle, the plug trip contact makes a trip connection with mating contacts in the receptacle. Electrical power to the receptacle allows a current through the trip connection, which causes disconnection of the power to the receptacle. A receptacle comprises receptacle power contacts and receptacle trip contacts. During a plugging action between the receptacle and a plug, trip contacts in the receptacle makes a trip connection with a mating contact in the plug. Electrical power to the receptacle allows a current through the trip connection, which can cause disconnection of the power to the receptacle. The receptacle can be included in an enclosure having a trip breaker with a trip mechanism. An electrical system can have an electrical device with a line cord connected to a plug having the trip contact.Type: ApplicationFiled: November 15, 2017Publication date: May 3, 2018Inventors: William L. Brodsky, Byron S. Green, Robert K. Mullady, Jeffrey A. Newcomer, Arkadiy O. Tsfasman, John S. Werner
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Publication number: 20180123296Abstract: A plug comprises power contacts and a trip jumper having jumper contacts configured to make a trip connection, during a plugging action with the plug and a receptacle, with mating trip contacts in the receptacle. When the receptacle is connected to electrical power during the plugging action, a current over the trip connection can cause disconnection of a receptacle power contact from the power. A receptacle comprises receptacle power contacts and a trip circuit having receptacle trip contacts configured to make a trip connection, during a plugging action with the receptacle and plug, with mating trip contacts in the plug. When the receptacle is connected to electrical power during the plugging action, a current over the trip connection can cause disconnection of power to a receptacle power contact. A system can have an electrical device with a line cord connected to the plug.Type: ApplicationFiled: November 15, 2017Publication date: May 3, 2018Inventors: William L. Brodsky, Byron S. Green, Robert K. Mullady, Jeffrey A. Newcomer, Arkadiy O. Tsfasman, John S. Werner
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Publication number: 20180103537Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).Type: ApplicationFiled: December 8, 2017Publication date: April 12, 2018Inventors: William L. BRODSKY, James A. BUSBY, Zachary T. DREISS, Michael J. FISHER, David C. LONG, William SANTIAGO-FERNANDEZ, Thomas WEISS
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Publication number: 20180103538Abstract: Methods of fabricating tamper-respondent assemblies with bond protection are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly.Type: ApplicationFiled: December 8, 2017Publication date: April 12, 2018Inventors: William L. Brodsky, James A. Busby, Zachary T. Dreiss, Michael J. Fisher, David C. Long, William Santiago-Fernandez, Thomas Weiss
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Publication number: 20180096173Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.Type: ApplicationFiled: November 21, 2017Publication date: April 5, 2018Inventors: William L. BRODSKY, John R. DANGLER, Phillip Duane ISAACS, David C. LONG, Michael T. PEETS
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Publication number: 20180098423Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.Type: ApplicationFiled: November 30, 2017Publication date: April 5, 2018Inventors: William L. Brodsky, James A. Busby, Edward N. Cohen, Silvio Dragone, Michael J. Fisher, David C. Long, Michael T. Peets, William Santiago-Fernandez, Thomas Weiss
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Patent number: 9936573Abstract: Methods of fabricating tamper-respondent assemblies are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl?200 ?m, as well as a line-to-line spacing width Ws?200 ?m. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.Type: GrantFiled: November 16, 2015Date of Patent: April 3, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William L. Brodsky, James A. Busby, Phillip Duane Isaacs, David C. Long
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Patent number: 9924591Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl?200 ?m, as well as a line-to-line spacing width Ws?200 ?m. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.Type: GrantFiled: September 25, 2015Date of Patent: March 20, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William L. Brodsky, James A. Busby, Phillip Duane Isaacs, David C. Long