Patents by Inventor William L. Brodsky

William L. Brodsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170094819
    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure and a tamper-respondent electronic circuit structure. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner main surface, and an inner sidewall surface which has at least one inner-sidewall corner. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner sidewall surface of the electronic enclosure. The tamper-respondent sensor includes multiple slots provided therein. The multiple slots facilitate disposing the tamper-respondent sensor to cover the at least one inner-sidewall corner of the inner sidewall surface by allowing for one or more regions of overlap of the tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventors: William L. BRODSKY, John R. DANGLER, Zachary T. DREISS, David C. LONG, Michael T. PEETS, William SANTIAGO-FERNANDEZ, Thomas WEISS
  • Publication number: 20170089729
    Abstract: Electronic circuits, electronic packages, and methods of fabrication are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventors: William L. BRODSKY, Silvio DRAGONE, Roger S. KRABBENHOFT, David C. LONG, Stefano S. OGGIONI, Michael T. PEETS, William SANTIAGO-FERNANDEZ
  • Publication number: 20170091492
    Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventors: William L. BRODSKY, John R. DANGLER, Phillip Duane ISAACS, David C. LONG, Michael T. PEETS
  • Publication number: 20170094784
    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl?200 ?m, as well as a line-to-line spacing width Ws?200 ?m. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventors: William L. BRODSKY, James A. BUSBY, Phillip Duane ISAACS, David C. LONG
  • Publication number: 20170094820
    Abstract: Methods of fabricating tamper-respondent assemblies with bond protection are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly.
    Type: Application
    Filed: November 16, 2015
    Publication date: March 30, 2017
    Inventors: William L. BRODSKY, James A. BUSBY, Zachary T. DREISS, Michael J. FISHER, David C. LONG, William SANTIAGO-FERNANDEZ, Thomas WEISS
  • Publication number: 20170094806
    Abstract: Methods of fabricating tamper-respondent assemblies are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl?200 ?m, as well as a line-to-line spacing width Ws?200 ?m. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
    Type: Application
    Filed: November 16, 2015
    Publication date: March 30, 2017
    Inventors: William L. BRODSKY, James A. BUSBY, Phillip Duane ISAACS, David C. LONG
  • Publication number: 20170094808
    Abstract: Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board.
    Type: Application
    Filed: November 16, 2015
    Publication date: March 30, 2017
    Inventors: William L. BRODSKY, Silvio DRAGONE, Roger S. KRABBENHOFT, David C. LONG, Stefano S. OGGIONI, Michael T. PEETS, William SANTIAGO-FERNANDEZ
  • Patent number: 9591776
    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure and a tamper-respondent electronic circuit structure. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner main surface, and an inner sidewall surface which has at least one inner-sidewall corner. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner sidewall surface of the electronic enclosure. The tamper-respondent sensor includes multiple slots provided therein. The multiple slots facilitate disposing the tamper-respondent sensor to cover the at least one inner-sidewall corner of the inner sidewall surface by allowing for one or more regions of overlap of the tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: March 7, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, John R. Dangler, Zachary T. Dreiss, David C. Long, Michael T. Peets, William Santiago-Fernandez, Thomas Weiss
  • Publication number: 20170062960
    Abstract: A dual in-line memory module (DIMM) connector system is provided. The DIMM connector system includes a motherboard, a DIMM card and a connector by which the DIMM card is coupled with the motherboard. The motherboard includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, ground pads disposed proximate to signal pads, signal vias connected to distal edges of signal pads and shared antipads. The DIMM card includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, signal vias connected to distal edges of signal pads and shared antipads for respective pairs of signal vias.
    Type: Application
    Filed: August 26, 2016
    Publication date: March 2, 2017
    Inventors: Wiren D. Becker, William L. Brodsky, Matteo Cocchini, Michael A. Cracraft
  • Patent number: 9554477
    Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: January 24, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, James A. Busby, Edward N. Cohen, Silvio Dragone, Michael J. Fisher, David C. Long, Michael T. Peets, William Santiago-Fernandez, Thomas Weiss
  • Patent number: 9548551
    Abstract: A dual in-line memory module (DIMM) connector system is provided. The DIMM connector system includes a motherboard, a DIMM card and a connector by which the DIMM card is coupled with the motherboard. The motherboard includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, ground pads disposed proximate to signal pads, signal vias connected to distal edges of signal pads and shared antipads. The DIMM card includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, signal vias connected to distal edges of signal pads and shared antipads for respective pairs of signal vias.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: January 17, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Wiren D. Becker, William L. Brodsky, Matteo Cocchini, Michael A. Cracraft
  • Patent number: 9537234
    Abstract: A solder tail extender connector and method are provided for implementing production of solder tail extender connectors from compliant pins. A forming fixture is provided to collapse compliant pins prior to soldering. The compliant pin is collapsed at or beyond the normal compliant pin low end dimensions and removed from the forming fixture. A solder tail extender optionally is added to the collapsed compliant pin, forming the solder tail extender connector.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: January 3, 2017
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: William L. Brodsky, John R. Dangler, Mark K. Hoffmeyer, Timothy P. Younger
  • Publication number: 20160309625
    Abstract: A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.
    Type: Application
    Filed: April 16, 2015
    Publication date: October 20, 2016
    Inventors: William L. Brodsky, Robert R. Genest, John J. Loparco, Michael T. Peets
  • Patent number: 9448902
    Abstract: In one or more aspects, a determination is made as to whether a connector is securely fastened, whether the connector connected within a socket structure is the expected connector for that socket structure, and/or whether connectors coupled to one another via one or more cables are properly positioned for communication between them. Information on selected physical connection elements of a connector is used to determine one or more structural characteristics of the cable(s) connected to the connector and to determine whether the connector is the expected connector for a particular socket structure.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: September 20, 2016
    Assignee: International Business Machines Corporation
    Inventors: William L. Brodsky, William P. Kostenko
  • Publication number: 20160266993
    Abstract: In one or more aspects, a determination is made as to whether a connector is securely fastened, whether the connector connected within a socket structure is the expected connector for that socket structure, and/or whether connectors coupled to one another via one or more cables are properly positioned for communication between them. Information on selected physical connection elements of a connector is used to determine one or more structural characteristics of the cable(s) connected to the connector and to determine whether the connector is the expected connector for a particular socket structure.
    Type: Application
    Filed: May 20, 2016
    Publication date: September 15, 2016
    Inventors: William L. BRODSKY, William P. KOSTENKO
  • Patent number: 9444162
    Abstract: A dual in-line memory module (DIMM) connector system is provided. The DIMM connector system includes a motherboard, a DIMM card and a connector by which the DIMM card is coupled with the motherboard. The motherboard includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, ground pads disposed proximate to signal pads, signal vias connected to distal edges of signal pads and shared antipads. The DIMM card includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, signal vias connected to distal edges of signal pads and shared antipads for respective pairs of signal vias.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: September 13, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Wiren D. Becker, William L. Brodsky, Matteo Cocchini, Michael A. Cracraft
  • Patent number: 9325086
    Abstract: An interconnection assembly for a motherboard uses right-angle edge connectors attached to a bottom side of the motherboard, and vertical header connectors attached to the top side. The header connectors mate with a transition card assembly which includes a transition card having plated through holes that receive pins of the header connectors. Right-angle mezzanine connectors mounted on the transition card have pins that extend into the plated through holes from the top side. The edge connectors and mezzanine connectors both face forward in a common direction. The transition card has holes along a rear edge to retain pressed-in nuts for mounting to a stabilizing bezel. Instead of pins being part of the header connectors, connector caps may be provided with pins having first ends that extend into sockets of the header connectors and second ends that extend into the plated through holes of the transition card.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: April 26, 2016
    Assignee: International Business Machines Corporation
    Inventors: William L. Brodsky, Robert R. Genest, John J. Loparco, Michael T. Peets, John G. Torok
  • Patent number: 9323631
    Abstract: In one or more aspects, a determination is made as to whether a connector is securely fastened, whether the connector connected within a socket structure is the expected connector for that socket structure, and/or whether connectors coupled to one another via one or more cables are properly positioned for communication between them. Information on selected physical connection elements of a connector is used to determine one or more structural characteristics of the cable(s) connected to the connector and to determine whether the connector is the expected connector for a particular socket structure.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: April 26, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, William P. Kostenko
  • Publication number: 20160043484
    Abstract: An interconnection assembly for a motherboard uses right-angle edge connectors attached to a bottom side of the motherboard, and vertical header connectors attached to the top side. The header connectors mate with a transition card assembly which includes a transition card having plated through holes that receive pins of the header connectors. Right-angle mezzanine connectors mounted on the transition card have pins that extend into the plated through holes from the top side. The edge connectors and mezzanine connectors both face forward in a common direction. The transition card has holes along a rear edge to retain pressed-in nuts for mounting to a stabilizing bezel. Instead of pins being part of the header connectors, connector caps may be provided with pins having first ends that extend into sockets of the header connectors and second ends that extend into the plated through holes of the transition card.
    Type: Application
    Filed: August 5, 2014
    Publication date: February 11, 2016
    Inventors: William L. Brodsky, Robert R. Genest, John J. Loparco, Michael T. Peets, John G. Torok
  • Publication number: 20160026585
    Abstract: In one or more aspects, a determination is made as to whether a connector is securely fastened, whether the connector connected within a socket structure is the expected connector for that socket structure, and/or whether connectors coupled to one another via one or more cables are properly positioned for communication between them. Information on selected physical connection elements of a connector is used to determine one or more structural characteristics of the cable(s) connected to the connector and to determine whether the connector is the expected connector for a particular socket structure.
    Type: Application
    Filed: October 7, 2015
    Publication date: January 28, 2016
    Inventors: William L. Brodsky, William P. Kostenko