Patents by Inventor William Louis Brodsky
William Louis Brodsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20030124880Abstract: An electrical connection of a transfer station releasably, repeatably electrically couples with respect to a matching connection of a portable cartridge. A substrate in the portable cartridge has electrical contacts on a facing surface. In the transfer station, a matching circuitized flexible substrate has electrical contacts on a facing surface thereof, which are arranged to match the portable cartridge electrical contacts when in a face-to-face relationship. An elastomeric compression element, at the rear of the matching substrate, has individual protruding compression members contacting the rear surface and registered with corresponding individual electrical contacts. Elongated electrical contacts are registered with two adjacent individual compression members.Type: ApplicationFiled: December 23, 2002Publication date: July 3, 2003Applicant: International Business Machines CorporationInventors: William Louis Brodsky, Dennis Hurley Byrne, Alex Chliwnyj, David Michael Davis, James Mitchell Karp, George G. Zamora
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Publication number: 20030116351Abstract: The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.Type: ApplicationFiled: February 10, 2003Publication date: June 26, 2003Applicant: International Business Machines CorporationInventors: William Louis Brodsky, Benson Chan, Michael Anthony Gaynes, Voya Rista Markovich
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Patent number: 6545226Abstract: The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.Type: GrantFiled: May 31, 2001Date of Patent: April 8, 2003Assignee: International Business Machines CorporationInventors: William Louis Brodsky, Benson Chan, Michael Anthony Gaynes, Voya Rista Markovich
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Patent number: 6540528Abstract: An electrical connection of a transfer station releasably, repeatably electrically couples with respect to a matching connection of a portable cartridge. A substrate in the portable cartridge has electrical contacts on a facing surface. In the transfer station, a matching circuitized flexible substrate has electrical contacts on a facing surface thereof, which are arranged to match the portable cartridge electrical contacts when in a face-to-face relationship. An elastomeric compression element, at the rear of the matching substrate, has individual protruding compression members contacting the rear surface and registered with corresponding individual electrical contacts. Elongated electrical contacts are registered with two adjacent individual compression members.Type: GrantFiled: April 26, 2001Date of Patent: April 1, 2003Assignee: International Business Machines CorporationInventors: William Louis Brodsky, Dennis Hurley Byrne, Alex Chliwnyj, David Michael Davis, James Mitchell Karp, George G. Zamora
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Publication number: 20020182900Abstract: A method and structure for electrically and mechanically interconnecting an array of printed circuit board contacts to an array of module contacts with a plurality of deformable resilient electrical conductors with two ends. Each of the conductor ends are electrically connected to one of the contact arrays. A portion of the conductor may deform longitudinally and laterally responsive to movement of the printed circuit board relative to the module responsive to heating and cooling cycles and mechanical vibrations, while maintaining the electrical connection of the contact arrays. An interposer with apertures extending through the interposer carries the conductors in the apertures and is used to align the conductors with the contacts. A method for excluding a rigid adhesive means from a portion of the resilient conductor is also taught.Type: ApplicationFiled: May 31, 2001Publication date: December 5, 2002Applicant: International Business Machines CorporationInventors: William Louis Brodsky, David V. Caletka, Michael Anthony Gaynes, Voya Rista Markovich
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Publication number: 20020179331Abstract: The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.Type: ApplicationFiled: May 31, 2001Publication date: December 5, 2002Applicant: International Business Machines CorporationInventors: William Louis Brodsky, Benson Chan, Michael Anthony Gaynes, Voya Rista Markovich
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Publication number: 20020173175Abstract: An interposer member having strategically positioned apertures for electrically connecting an electronic device to a circuitized substrate. The member includes a homogeneous elastomer core having strategically positioned apertures. The apertures are positioned through the member approximately equidistant between adjacent plated through holes and/or conductive pads. Such positioning relieves stress from the plated through holes and/or conductive pads, and increases the contact compliancy of the member.Type: ApplicationFiled: May 15, 2001Publication date: November 21, 2002Applicant: International Business Machines CorporationInventors: William Louis Brodsky, David Vincent Caletka
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Publication number: 20020160633Abstract: An electrical connection of a transfer station releasably, repeatably electrically couples with respect to a matching connection of a portable cartridge. A substrate in the portable cartridge has electrical contacts on a facing surface. In the transfer station, a matching circuitized flexible substrate has electrical contacts on a facing surface thereof, which are arranged to match the portable cartridge electrical contacts when in a face-to-face relationship. An elastomeric compression element, at the rear of the matching substrate, has individual protruding compression members contacting the rear surface and registered with corresponding individual electrical contacts. Elongated electrical contacts are registered with two adjacent individual compression members.Type: ApplicationFiled: April 26, 2001Publication date: October 31, 2002Applicant: International Business Machines CorporationInventors: William Louis Brodsky, Dennis Hurley Byrne, Alex Chliwnyj, David Michael Davis, James Mitchell Karp, George G. Zamora
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Publication number: 20020127894Abstract: An electronic subassembly comprises a printed circuit board and an electronic module, particularly a ceramic module, electrically connected to one another through a planar interposer. The interposer comprises an insulator sheet and electrical spring elements joining contact sites on the module with contact pads on the PCB. The invention includes modifications that improve the integrity of electrical connections between the printed circuit board and the electronic module. This is achieved by compensating for non-planarity between the surfaces of the interposer and the module, particularly resulting from a convex curvature of the module, by minimizing relative movement, such as rocking in the x-z and y-z planes. It also includes modifications to the suspension of the module within the interposer housing to reduce the effects caused by any sliding that may occur between the interposer and the module in the x-y plane.Type: ApplicationFiled: January 29, 2002Publication date: September 12, 2002Applicant: International Business Machines CorporationInventor: William Louis Brodsky
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Patent number: 6386890Abstract: The present invention provides a method and structure for connecting a module to a printed circuit board, wherein a substantially rigid interposer having resilient conductors is disposed between a module and a printed circuit board. A clamping means urges the module and printed circuit board toward each other with compressive force upon an interposer positioned therebetween, preferably causing the module and printed circuit board to deform and thereby align their electrical contacts with the surfaces of the interposer. The interposer further comprises a plurality of apertures, each aperture further having a deformable resilient conductor means for connecting a module contact to a PCB contact. The conductor is deformable in shear, which may travel and, therefore, makeup the CTE dimensional mismatch between the module and the PCB. The conductors are detachable, electrically connecting the module and PCB contacts without the requirement of solder or other permanent means.Type: GrantFiled: March 12, 2001Date of Patent: May 14, 2002Assignee: International Business Machines CorporationInventors: Anilkumar Chinuprasad Bhatt, William Louis Brodsky, Benson Chan
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Patent number: 6375475Abstract: An electronic subassembly includes a printed circuit board and an electronic module, particularly a ceramic module, electrically connected to one another through a planar interposer. The interposer includes an insulator sheet and electrical spring elements joining contact sites on the module with contact pads on the PCB. The invention includes modifications that improve the integrity of electrical connections between the printed circuit board and the electronic module. This is achieved by compensating for non-planarity between the surfaces of the interposer and the module, particularly resulting from a convex curvature of the module, by minimizing relative movement, such as rocking in the x-z and y-z planes. It also includes modifications to the suspension of the module within the interposer housing to reduce the effects caused by any sliding that may occur between the interposer and the module in the x-y plane.Type: GrantFiled: March 6, 2001Date of Patent: April 23, 2002Assignee: International Business Machines CorporationInventor: William Louis Brodsky
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Patent number: 6267860Abstract: Electrolytic plating of a workpiece is enhanced by providing a resistor between the workpiece and electrically conductive support member.Type: GrantFiled: July 27, 1999Date of Patent: July 31, 2001Assignee: International Business Machines CorporationInventor: William Louis Brodsky
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Patent number: 6190530Abstract: An anode container, electroplating system, method and object so plated. A feature of the invention is that an anode container has an interior cross-sectional area, at or near a lower end thereof, that is larger than an interior cross-sectional area of an upper end thereof. An anode-receiving container also has a body with a plurality of sides and a lower end having a larger cross-sectional interior area than an upper end. The container may also include punched out apertures positioned to provide strength to the container and an apparatus to vibrate the container coupled to a lower end of the container.Type: GrantFiled: April 12, 1999Date of Patent: February 20, 2001Assignee: International Business Machines CorporationInventors: William Louis Brodsky, Donald W. Henderson, Lawrence Philip Lehman
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Patent number: 6037658Abstract: An electronic package including as part thereof a thermally conductive arrangement for restricting thermal fluid material motion about a heat-generating device, thereby assuring effective heat transference from the heat-generating device (e.g., module) to a cooling member (e.g., spaced heat sink), this arrangement preferably including: (1) a thermal fluid (e.g., thermal grease); and (2) structural elements (e.g., wire mesh, heat sink ridges, etc.). For restricting fluid movement, sealing structures (e.g., external gaskets) may be used to further assure fluid containment to a specified location. Pressure generation means (e.g., a plunger) can be used to increase fluid pressure when pressure droppages occur.Type: GrantFiled: October 7, 1997Date of Patent: March 14, 2000Assignee: International Business Machines CorporationInventors: William Louis Brodsky, Glenn Lee Kehley, Sanjeev Balwant Sathe, John Robert Slack
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Patent number: 6015301Abstract: A surface mount socket having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.Type: GrantFiled: July 23, 1998Date of Patent: January 18, 2000Assignee: International Business Machines CorporationInventors: William Louis Brodsky, Benson Chan, Glenn Edward Myrto, John Henry Sherman
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Patent number: 5993579Abstract: A composite cable has a reinforcing layer with conductors disposed on opposed planar surfaces. Dielectric film layers electrically separate the conductors on the planar reinforcing layer from respective layers of additional conductors. The flexible cable is manufactured by laminating a layer of dielectric film and a layer of electrically conductive material onto both sides of a double clad core which provides a strain relief reinforcement for the cable.Type: GrantFiled: June 16, 1997Date of Patent: November 30, 1999Assignee: International Business Machines CorporationInventors: Donald Seton Farquhar, William Louis Brodsky, Natalie Barbara Feilchenfeld, Lisa Jeanine Jimarez, James Robert Wilcox
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Patent number: 5984691Abstract: A flexible circuitized interposer (50) and method of making same wherein the interposer includes at least one flexible circuitized substrate (53) having a dielectric (e.g., polyimide) layer (54) with a conductor (55) and plated elements (56), e.g., copper pad, including possibly with dendrites (57) thereon for enhanced connection, an apertured support member (58) aligning with the conductor, and a support member (60) having the apertured member thereon. When the interposer is engaged, the flexible circuitized substrate (53) is depressed within the aperture (59). Various alternatives, including a support (60") formed with compression portions (69) that extend into respective apertures (59) in the support member (58), and an interim, compressible support (60""), are disclosed. Flexure is also enhanced by utilization of patterns of one or more apertures (64) in the flexible substrate relative to and substantially surrounding the positioned conductors (56).Type: GrantFiled: March 10, 1998Date of Patent: November 16, 1999Assignee: International Business Machines CorporationInventors: William Louis Brodsky, Glenn Lee Kehley, Glenn Edward Myrto, John Henry Sherman
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Patent number: 5947750Abstract: An elastomeric structure including two layers, the first having patterned openings therein and adjacent web members, the second including a patterned array of upstanding projections. The openings and projections may be of cylindrical, rectangular, or other configurations and are oriented in highly dense patterns. The elastomeric is positioned with and attached to a base member having a sidewall substantially as high as the corresponding external side surface of the elastomeric's first layer. The sidewall constrains the elastomeric during compression. The invention thereby substantially prevents lateral expansion of the elastomeric's side surface and lateral deflection of both layers, resulting in a uniform distribution of compressive forces on the upstanding projections.Type: GrantFiled: April 30, 1997Date of Patent: September 7, 1999Assignee: International Business Machines CorporationInventors: David James Alcoe, William Louis Brodsky, David Vincent Caletka
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Patent number: 5938454Abstract: An electrical connector for coupling two circuitized substrates (e.g., a ball grid array module and a printed circuit board) wherein the connector includes a base member fixedly secured (e.g., soldered) to the printed circuit board and having one substrate oriented therein. The connector further includes a 2-part retention member including one part movably oriented in the base and a second part for directly engaging the retained substrate to cause it to move downwardly (and thus in a completely different direction than the direction of rotation of the movable one part within the base) to thereby provide effective connection between substrates. An interposer may be used if desired. An information handling system including a microprocessor and connector electrically coupled thereto is also disclosed.Type: GrantFiled: May 30, 1997Date of Patent: August 17, 1999Assignee: International Business Machines CorporationInventors: William Louis Brodsky, Glenn Lee Kehley, Glenn Edward Myrto, John Henry Sherman
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Patent number: 5932047Abstract: A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e.g., copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is utilized, this elastomeric-pad structure being bonded to the flexible circuit at locations relative to respective ones of the conductive members so as to assure substantially independent force exertion thereon, e.g., when the flexible circuit is electrically coupled to a separate, circuitized substrate such as a printed circuit board. A method for making an elastomeric support member for use in such a circuitized substrate is also provided.Type: GrantFiled: May 22, 1995Date of Patent: August 3, 1999Assignee: International Business Machines CorporationInventors: William Louis Brodsky, James Daniel Herard, Thomas George Macek, Timothy Lee Sharp, George Joseph Shovlowsky