Abstract: A composite cable has a reinforcing layer with conductors disposed on opposed planar surfaces. Dielectric film layers electrically separate the conductors on the planar reinforcing layer from respective layers of additional conductors. The flexible cable is manufactured by laminating a layer of dielectric film and a layer of electrically conductive material onto both sides of a double clad core which provides a strain relief reinforcement for the cable.

Abstract: A computer system having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate mounted in the computer system enclosure, along with a power supply, a bus system, and connectors for communicating with units external to the enclosure. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.

Abstract: A flexible circuitized interposer (50) and method of making same wherein the interposer includes at least one flexible circuitized substrate (53) having a dielectric (e.g., polyimide) layer (54) with a conductor (55) and plated elements (56), e.g., copper pad, including possibly with dendrites (57) thereon for enhanced connection, an apertured support member (58) aligning with the conductor, and a support member (60) having the apertured member thereon. When the interposer is engaged, the flexible circuitized substrate (53) is depressed within the aperture (59). Various alternatives, including a support (60") formed with compressible portions (69) that extend into respective apertures (59) in the support member (58), and an interim, compressible support (60""), are disclosed. The support member may also be metallic, e.g., for use as an electrical ground shield.

Abstract: A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e.g., copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is utilized, this elastomeric-pad structure being bonded to the flexible circuit at locations relative to respective ones of the conductive members so as to assure substantially independent force exertion thereon, e.g., when the flexible circuit is electrically coupled to a separate, circuitized substrate such as a printed circuit board. A method for making an elastomeric support member for use in such a circuitized substrate is also provided.

Abstract: A heat sink structure with a heat-conducting base and wound wire heat conductors thermally attached to the base for use in electronic packaging structures, e.g., those used in computers. The method of making such a structure, as taught herein, provides a unique structure using wire to form the thermally conductive members in a corrugated shape and aligning these with and thermally coupling to a base structure. In one embodiment, the base structure may be excluded with a heat conductive spacer member used instead.