Abstract: A server chassis, including: a first compartment configured to receive one or more central electronics complexes (‘CECs’); and a second compartment configured to receive one or more fans for cooling the one or more CECs, wherein the second compartment is coupled to the first compartment such that: the second compartment is inserted within the first compartment when the second compartment is in an operational position; and the second compartment is outside of the first compartment and rotated relative to the first compartment when the second compartment is in a service position.

Abstract: Reconfigurable processors and methods for collecting computer program instruction execution statistics are disclosed. According to an aspect, a method includes providing a reconfigurable processor configured to execute a set of central processing unit (CPU) instructions that each have a function. The method also includes modifying the function of one or more of the CPU instructions that identifies an instruction address and a destination address pair of the CPU instruction(s) based on a defined test case. Further, the method includes using the reconfigurable processor to execute the set of CPU instructions. The method also includes identifying an instruction address and destination address pair of the CPU instruction(s) having the modified function when the CPU instruction(s) having the modified function is executed during execution of the set of CPU instructions.

Abstract: A method includes sensing ambient conditions in a datacenter containing a server, and determining whether the ambient conditions exceed predetermined threshold conditions representing risk of electrostatic discharge. A lid to the server is locked in a closed position in response to the ambient conditions exceeding the predetermined threshold conditions. However, the lid to the server is unlocked in response to a grounding strap being connected to the server. Optionally, the grounding strap may be identified and the server lid will only unlock if the identified grounding strap is associated with authorization to unlock the server lid.

Abstract: A heat exchanger core optimization method is provided for a heat exchanger door which resides at an air inlet or outlet side of an electronics rack, and includes an air-to-coolant heat exchanger with a heat exchanger core. The core includes a first coolant channel coupled to a coolant inlet manifold downstream from a second coolant channel, and the first channel has a shorter channel length than the second channel. Further, coolant channels of the core are coupled to provide counter-flow cooling of an airflow passing across the core. The core optimization method determines at least one combination of parameters that optimize for a particular application at least two performance metrics of the heat exchanger. This method includes obtaining performance metrics for boundary condition(s) of possible heat exchanger configurations with different variable parameters to determine a combination of parameters that optimize the performance metrics for the heat exchanger.

Abstract: One embodiment of the present invention provides a method of three-dimensional printing. The method includes a three-dimensional printer printing a first layer of an object onto a surface that is not part of the three-dimensional printer, wherein the first layer is printed while a printing platform of the three dimensional printer is in a first position. The printer is autonomously repositioned in a second position elevated above the first position by being supported either on the three-dimensional object itself or on a scaffold printed separate from the object. The printer prints a second layer of the three-dimensional object onto the first layer of the three-dimensional object while the printing platform is in the second position. The printer may have a plurality of legs for controllably repositioning the printing platform.

Abstract: A computer program product includes a computer readable storage medium having program instructions embodied therewith and executable by a processor to cause the processor to perform a method. The method includes a three-dimensional printer printing a first layer of an object onto a surface that is not part of the three-dimensional printer, wherein the first layer is printed while a printing platform of the three dimensional printer is in a first position. The printer is autonomously repositioned in a second position elevated above the first position by being supported either on the three-dimensional object itself or on a scaffold printed separate from the object. The printer prints a second layer of the three-dimensional object onto the first layer of the three-dimensional object while the printing platform is in the second position. The printer may have a plurality of legs for controllably repositioning the printing platform.

Abstract: Detecting TIM between a heat sink and an integrated circuit, the integrated circuit including TIM detection points adapted to receive TIM upon installation of the heat sink and including a TIM detection device configured to be activated upon contact with TIM, including: receiving, upon installation of the heat sink on the integrated circuit and the TIM, TIM in one or more of the TIM detection points; activating, by the TIM in each of the one or more TIM detection points receiving the TIM, a TIM detection device; determining, by a TIM detection module of the integrated circuit in dependence upon the activations of the TIM detection devices, sufficiency of the TIM; and responsive to determining that the TIM between the heat sink and the integrated circuit is insufficient, controlling, in real-time by the TIM detection module, operation of the integrated circuit to reduce heat generated by the integrated circuit.

Abstract: One embodiment of the present invention provides a method of three-dimensional printing. The method includes a three-dimensional printer printing a first layer of an object onto a surface that is not part of the three-dimensional printer, wherein the first layer is printed while a printing platform of the three dimensional printer is in a first position. The printer is autonomously repositioned in a second position elevated above the first position by being supported either on the three-dimensional object itself or on a scaffold printed separate from the object. The printer prints a second layer of the three-dimensional object onto the first layer of the three-dimensional object while the printing platform is in the second position. The printer may have a plurality of legs for controllably repositioning the printing platform.

Abstract: A computer program product (CPP) for controlling a liquid crystal display (LCD) includes code for applying a test voltage to each liquid crystal element (LCE) disposed in an addressable array forming the LCD, and code for detecting an amount of light received by photosensors while applying the test voltage to the LCEs, wherein each photosensor is aligned behind and logically associated with one of the LCEs. The CPP further includes code for applying selected voltage levels to each LCE to display an image, and code for controlling an amount of backlight produced by backlighting elements in an addressable array while the image is displayed. Each backlighting element is aligned behind and logically associated with one LCE, and at least one backlighting element is controlled to compensate for a difference between the amount of light detected by the photosensor logically associated with at least one LCE and the other photosensors.

Abstract: A heatsink includes a rigid plate and a plurality of pin fins. The plate has a two dimensional array of holes through the rigid plate from a first face to a second face. Each pin fin is received in one of the holes and has a proximal end extending beyond the first face of the plate for conductively receiving heat, a distal end extending beyond the second face of the plate for convective heat exchange with air, a biasing member biasing the pin fin in a proximal direction, and a shoulder limiting the proximal extension of the pin fin through the hole. An apparatus may include the pin fin heatsink secured to a printed circuit board having at least two components that have different heights. Accordingly, each component is contacted by the proximal end of one or more self-adjusting pin fins that are aligned with the component.

Abstract: Thermally sensitive wear leveling for a flash memory device that includes a plurality of flash memory modules, the flash memory device included in a computing system that includes a plurality of additional computing components, including: identifying a thermal sensitivity coefficient for each flash memory module in dependence upon a physical topology of the flash memory device and one or more of the additional computing components; identifying wear leveling information for each flash memory module; receiving a request to write data to the flash memory device; selecting, in dependence upon the thermal sensitivity coefficient for each flash memory module and the wear leveling information for each flash memory module, a target flash memory module for servicing the request to write data to the flash memory device; and writing the data to the target flash memory module.

Abstract: A transversely actuated piezoelectric bellows heatsink (TAPBH) has a linkage that includes multiple rigid sections coupled by flexible joints. A first fixed support is affixed to a first end of the linkage, and a piezoelectric element is mechanically coupled to a second end of the linkage. A diaphragm is mechanically affixed to a first side of the linkage, and an air enclosure, having an open area, is affixed to the diaphragm. A second fixed support is mechanically affixed to a second side of the linkage. Cyclic power from the power supply causes the piezoelectric element to expand and contract to force the linkage to expand and contract in an analogous manner, thus causing the diaphragm to move in an amplified motion to cause air to enter and be expelled from the air enclosure via air valves.

Abstract: Thermally sensitive wear leveling for a flash memory device that includes a plurality of flash memory modules, the flash memory device included in a computing system that includes a plurality of additional computing components, including: identifying a thermal sensitivity coefficient for each flash memory module in dependence upon a physical topology of the flash memory device and one or more of the additional computing components; identifying wear leveling information for each flash memory module; receiving a request to write data to the flash memory device; selecting, in dependence upon the thermal sensitivity coefficient for each flash memory module and the wear leveling information for each flash memory module, a target flash memory module for servicing the request to write data to the flash memory device; and writing the data to the target flash memory module.

Abstract: A method includes identifying a product warranty for each of a plurality of flash memory devices within a system, wherein the product warranty includes a maximum number of writes and a maximum age, and tracking the number of writes made to each flash memory device and the age of each flash memory device. The method further includes determining, for each flash memory device, a number of pro rata writes remaining in the product warranty, which is determined as a number of writes remaining until the flash memory device reaches the maximum number of writes identified in the product warranty divided by an amount of time remaining until the flash memory reaches the maximum age identified in the product warranty. The method then causes data to be written to the flash memory device having the greatest number of pro rata writes remaining in the product warranty.

Abstract: A computer readable storage medium embodies program instructions executable by a processor to perform a method including identifying a product warranty for each of a plurality of flash memory devices within a system, wherein the product warranty includes a maximum number of writes and a maximum age, and tracking the number of writes and the age of each flash memory device. The method further includes determining, for each flash memory device, a number of pro rata writes remaining in the product warranty, which is determined as a number of writes remaining until the flash memory device reaches the maximum number of writes divided by an amount of time remaining until the flash memory reaches the maximum age. The method then causes data to be written to the flash memory device having the greatest number of pro rata writes remaining in the product warranty.

Abstract: A cooling apparatus of an array of fan cradles holding fans where a movable baffle assembly directs airflow and blocks removal of more than one fan at a time. A plurality of fans held in a fan cradle assembly in which the fan cradle for a fan to be replaced mechanically moves and is engaged with the movable baffle assembly to prevent removal of the other fans. A method is provided by which an operator may remove and replace an existing fan in an array of fans.

Abstract: Detecting TIM between a heat sink and an integrated circuit, the heat sink including TIM detection points, each TIM detection point adapted to receive TIM upon installation of the heat sink, each TIM detection point including a TIM detection device configured to be activated upon contact with TIM, including: receiving, upon installation of the heat sink on the integrated circuit and the TIM, TIM in one or more of the TIM detection points; activating, by the TIM in each of the one or more TIM detection points receiving the TIM, a TIM detection device; and determining, by a TIM detection module in dependence upon the activations of the TIM detection devices, sufficiency of the TIM between the heat sink and the integrated circuit.

Abstract: An electronic system comprises: at least one electronic component; a cooling system condition receiver, wherein the cooling system condition receiver is capable of receiving a condition signal, and wherein the condition signal describes a current condition of a cooling system that provides conditioned air to an ambient environment of the electronic system; and a throttle, wherein the throttle, in response to the cooling system condition receiver receiving the condition signal that describes the current condition of the cooling system, adjusts an amount of heat generated by said at least one electronic component by throttling back operations of said at least one electronic component.

Abstract: A transversely actuated piezoelectric bellows heatsink (TAPBH) has a linkage that includes multiple rigid sections coupled by flexible joints. A first fixed support is affixed to a first end of the linkage, and a piezoelectric element is mechanically coupled to a second end of the linkage. A diaphragm is mechanically affixed to a first side of the linkage, and an air enclosure, having an open area, is affixed to the diaphragm. A second fixed support is mechanically affixed to a second side of the linkage. Cyclic power from the power supply causes the piezoelectric element to expand and contract to force the linkage to expand and contract in an analogous manner, thus causing the diaphragm to move in an amplified motion to cause air to enter and be expelled from the air enclosure via air valves.

Abstract: A chip package comprises: an IC substrate, wherein the IC substrate comprises at least one electronic device; a photovoltaic cell, wherein the photovoltaic cell generates an electrical current when exposed to light; a light blocking shield, wherein the light blocking shield prevents light from striking the photovoltaic cell only while the chip package is mounted on a circuit board, and wherein the light blocking shield ceases to prevent light from striking the photovoltaic cell upon the chip package being dismounted from the circuit board; and a disabling logic, wherein the electrical current, which is generated by the photovoltaic cell in response to the chip package being dismounted from the circuit board, causes the disabling logic to disable the IC substrate.