Abstract: A method and apparatus of cooling electronic components when replacing a cooling device in an information technology system are disclosed. The apparatus may include first and second cooling device trays that may be slidably mounted within an information technology system. The cooling device trays may include one or more cooling devices that are movably mounted to the cooling device trays. The apparatus may pivot one or more of the cooling devices when a pivot member contacts a fixed member with the chassis.

Abstract: Selectively filtering incoming communications events in a communications device, including: receiving, by a communications event filtering module, an incoming communications event; determining, by the communications event filtering module, whether the communications device is currently servicing a call; responsive to determining that the communications device is currently servicing a call, determining, by the communications event filtering module, whether the call is interruptible; and responsive to determining that the call is not interruptible, blocking, by the communications event filtering module, the incoming communications event from presentation by the communications device until the call has ended.

Abstract: Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives.

Abstract: A computer determines a characteristic corresponding to each of a first power source and a second power source. The first and second power sources are connected to one or more power distribution units and are configured to provide power in a datacenter. The characteristic includes at least one of a current, a resistance, a voltage, a frequency, a phase, and a magnetic field. The computer generates a comparison of the characteristic corresponding to the first power source and the second power source, to a threshold value of the characteristic. The computer determines if the comparison violates the threshold value of the characteristic. In response to determining the comparison does not violate the threshold value of the characteristic, the computer determines that the first power source and the second power source are connected to a given power distribution unit included in the one or more power distribution units.

Abstract: A method and apparatus of cooling electronic components when replacing a cooling device in an information technology system are disclosed. The apparatus may include first and second cooling device trays that may be slidably mounted within an information technology system. The cooling device trays may include one or more cooling devices that are movably mounted to the cooling device trays. The apparatus may pivot one or more of the cooling devices when a pivot member contacts a fixed member with the chassis.

Abstract: A heat exchanger door is provided which includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger core and a heat exchanger casing coupled to the core. The core includes at least one coolant-carrying channel which loops through the casing. The structural support is attached to the heat exchanger casing to define with the casing a tubular door support structure. The looping of the coolant-carrying channel(s) through the heat exchanger casing resides within the tubular door support structure.

Abstract: A method is provided which includes providing a heat exchanger door that includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger core and a heat exchanger casing coupled to the core. The core includes at least one coolant-carrying channel which loops through the casing. The structural support is attached to the heat exchanger casing to define with the casing a tubular door support structure. The looping of the coolant-carrying channel(s) through the heat exchanger casing resides within the tubular door support structure.

Abstract: In one embodiment, a memory module connector includes sidewalls extending along a length of the connector body. A longitudinally oriented socket is provided between the sidewalls for receiving a card edge of a memory module. A top of the connector defines a socket opening. A bottom of the connector is for mounting to a system board. A plurality of air deflectors is provided adjacent to the connector body to manipulate airflow to improve cooling. The size, positioning, and spacing of the air deflectors may be selected to optimize cooling.

Abstract: A cooling apparatus of an array of fan cradles holding fans where a movable baffle assembly directs airflow and blocks removal of more than one fan at a time. A plurality of fans held in a fan cradle assembly in which the fan cradle for a fan to be replaced mechanically moves and is engaged with the movable baffle assembly to prevent removal of the other fans. A method is provided by which an operator may remove and replace an existing fan in an array of fans.

Abstract: A heat sink comprises a base and a fin support larger in area than the base and supporting fins that may be positioned in a plurality of orientations relative to the base. The base is adapted for being connected to a heat-generating electronic component on a circuit board, and the heat sink dissipates heat generated by the heat-generating electronic device and conducted through the base and the fin support to the fins supported thereon. The heat sink dissipates heat from the heat-generating electronic device in a first operable position and in a second operable position. The heat sink may be moved from the first to the second operable position to facilitate access to electrical contacts proximal the heat-generating electronic component.

Abstract: Detecting TIM between a heat sink and an integrated circuit, the heat sink including TIM detection points, each TIM detection point adapted to receive TIM upon installation of the heat sink, each TIM detection point including a TIM detection device configured to be activated upon contact with TIM, including: receiving, upon installation of the heat sink on the integrated circuit and the TIM, TIM in one or more of the TIM detection points; activating, by the TIM in each of the one or more TIM detection points receiving the TIM, a TIM detection device; and determining, by a TIM detection module in dependence upon the activations of the TIM detection devices, sufficiency of the TIM between the heat sink and the integrated circuit.

Abstract: Detecting TIM between a heat sink and an integrated circuit, the integrated circuit including TIM detection points adapted to receive TIM upon installation of the heat sink and including a TIM detection device configured to be activated upon contact with TIM, including: receiving, upon installation of the heat sink on the integrated circuit and the TIM, TIM in one or more of the TIM detection points; activating, by the TIM in each of the one or more TIM detection points receiving the TIM, a TIM detection device; determining, by a TIM detection module of the integrated circuit in dependence upon the activations of the TIM detection devices, sufficiency of the TIM; and responsive to determining that the TIM between the heat sink and the integrated circuit is insufficient, controlling, in real-time by the TIM detection module, operation of the integrated circuit to reduce heat generated by the integrated circuit.

Abstract: In one embodiment, a memory module connector includes sidewalls extending along a length of the connector body. A longitudinally oriented socket is provided between the sidewalls for receiving a card edge of a memory module. A top of the connector defines a socket opening. A bottom of the connector is for mounting to a system board. A plurality of air deflectors is provided adjacent to the connector body to manipulate airflow to improve cooling. The size, positioning, and spacing of the air deflectors may be selected to optimize cooling.

Abstract: Selectively filtering incoming communications events in a communications device, including: receiving, by a communications event filtering module, an incoming communications event; determining, by the communications event filtering module, whether the communications device is currently servicing a call; responsive to determining that the communications device is currently servicing a call, determining, by the communications event filtering module, whether the call is interruptible; and responsive to determining that the call is not interruptible, blocking, by the communications event filtering module, the incoming communications event from presentation by the communications device until the call has ended.

Abstract: A heat exchanger door and heat exchanger core optimization method are provided. The door resides at an air inlet or outlet side of an electronics rack, and includes an air-to-coolant heat exchanger with a heat exchanger core. The core includes a first coolant channel coupled to a coolant inlet manifold downstream from a second coolant channel, and the first channel has a shorter channel length than the second channel. Further, coolant channels of the core are coupled to provide counter-flow cooling of an airflow passing across the core. The core optimization method determines at least one combination of parameters that optimize for a particular application at least two performance metrics of the heat exchanger. This method includes obtaining performance metrics for boundary condition(s) of possible heat exchanger configurations with different variable parameters to determine a combination of parameters that optimize the performance metrics for the heat exchanger.

Abstract: A heat exchanger door is provided which includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger core and a heat exchanger casing coupled to the core. The core includes at least one coolant-carrying channel which loops through the casing. The structural support is attached to the heat exchanger casing to define with the casing a tubular door support structure. The looping of the coolant-carrying channel(s) through the heat exchanger casing resides within the tubular door support structure.

Abstract: An air-cooling method is provided which includes providing a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door.

Abstract: An air-cooling apparatus is provided which includes a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door.

Abstract: Improving the operating efficiency of a rear door heat exchanger, including: determining, by a ventilation management module, a temperature differential between two temperature sensors in the rear door heat exchanger, the temperature differential indicative of cooling efficiency in the rear door heat exchanger; determining, by the ventilation management module, whether the temperature differential is greater than a predetermined threshold; and responsive to determining that the temperature differential is greater than the predetermined threshold, taking corrective action by the ventilation management module.

Abstract: Dual heat sinks, apparatuses, and methods for installing a dual heat sink for distributing a thermal load are provided. Embodiments include a top base to couple with a first integrated circuit of a first board and to receive a first thermal load from the first integrated circuit; a bottom base to couple with a second integrated circuit of a second board and to receive a second thermal load from the second integrated circuit; and a thermal dissipating structure coupled between the top base and the bottom base, the thermal dissipating structure to receive and distribute the first thermal load and the second thermal load from the top base and the bottom base; wherein a height of the thermal dissipating structure is adjustable so as to change a distance separating the top base and the bottom base.