Patents by Inventor William P. Taylor
William P. Taylor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11987847Abstract: Provided herein is technology relating to detecting neoplasia and particularly, but not exclusively, to methods, compositions, and related uses for detecting premalignant and malignant neoplasms such as colorectal cancer.Type: GrantFiled: December 14, 2020Date of Patent: May 21, 2024Assignees: MAYO FOUNDATION FOR MEDICAL EDUCATION AND RESEARCH, EXACT SCIENCES CORPORATIONInventors: David A. Ahlquist, William R. Taylor, Douglas W. Mahoney, Graham P. Lidgard, Hatim T. Allawi
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Patent number: 11973008Abstract: Methods and apparatus for a signal isolator having enhanced creepage characteristics. In embodiments, a signal isolator IC package comprises a leadframe including a die paddle having a first surface to support a die and an exposed second surface. A die is supported by a die paddle wherein a width of the second surface of the die paddle is less than a width of the die.Type: GrantFiled: February 14, 2022Date of Patent: April 30, 2024Assignee: Allegro MicroSystems, LLCInventors: Robert A. Briano, Shixi Louis Liu, William P. Taylor
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Patent number: 11960683Abstract: A display system for sensing a finger of a user applied to the display system includes a display panel; a sensor for sensing the finger; a sensing light source configured to emit a first light having a first wavelength W1; and a reflective polarizer disposed between the display panel and the sensor. For a substantially normally incident light, an optical transmittance of the reflective polarizer versus wavelength for a first polarization state has a band edge such that for a first wavelength range extending from a smaller wavelength L1 to a greater wavelength L2 and including W1, where 30 nm?L2?L1?50 nm and L1 is greater than and within about 20 nm of a wavelength L3 corresponding to an optical transmittance of about 50% along the band edge, the optical transmittance has an average of greater than about 75%.Type: GrantFiled: May 4, 2021Date of Patent: April 16, 2024Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Bharat R. Acharya, Robert D. Taylor, Joseph P. Attard, Benjamin J. Forsythe, David T. Yust, Matthew E. Sousa, Jason S. Petaja, Anthony M. Renstrom, William Blake Kolb, Matthew S. Cole, Matthew S. Stay, Matthew R. D. Smith, Jeremy O. Swanson, Tri D. Pham, David A. Rosen, Qunyi Chen, Lisa A. DeNicola, Quinn D. Sanford, Carl A. Stover, Lin Zhao, Gilles J. Benoit
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Patent number: 11961920Abstract: An integrated circuit package and method of fabrication are described. The integrated circuit package includes a lead frame having a first surface and a second opposing surface and a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame. A magnet attached to the second surface of the lead frame has a non-contiguous central region and at least one channel extending laterally from the central region. An overmold material forms an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.Type: GrantFiled: April 26, 2023Date of Patent: April 16, 2024Assignee: Allegro MicroSystems, LLCInventors: Ravi Vig, William P. Taylor, Paul A. David, P. Karl Scheller, Andreas P. Friedrich
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Patent number: 11952633Abstract: The present invention relates to methods and compositions for determination of and uses of specific methylation patterns indicative of adenoma and carcinoma. In particular, the invention relates to analysis of defined CpG loci that are coordinately methylated in DNAs from cancer and adenoma samples, methods for identifying coordinately methylated loci, and methods of using analysis of coordinately methylated loci in one or more marker regions in the design of assays for adenoma and cancer.Type: GrantFiled: November 23, 2020Date of Patent: April 9, 2024Assignees: Exact Sciences Corporation, Mayo Foundation for Medical Research and EducationInventors: David A. Ahlquist, William R. Taylor, Hongzhi Zou, Graham P. Lidgard
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Publication number: 20240044946Abstract: A sensor package comprising a lead frame, a current sensor die, and an interposer. The lead frame includes: (i) a primary conductor, (ii) a plurality of secondary leads, and (iii) a layer of dielectric material that is disposed between the primary conductor and the plurality of secondary leads. The current sensor die includes one or more sensing elements. The current sensor die is configured to measure a level of electrical current through the primary conductor of the lead frame. The interposer is disposed over the layer of dielectric material. The interposer includes a plurality of conductive traces that are configured to couple each of a plurality of terminals of the current sensor die to a respective one of the plurality of secondary leads.Type: ApplicationFiled: August 5, 2022Publication date: February 8, 2024Applicant: Allegro MicroSystems, LLCInventors: Robert A. Briano, Michael C. Doogue, William P. Taylor
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Patent number: 11828819Abstract: A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.Type: GrantFiled: October 13, 2022Date of Patent: November 28, 2023Assignee: Allegro MicroSystems, LLCInventors: Ravi Vig, William P. Taylor, Andreas P. Friedrich, Paul A. David, Marie-Adelaide Lo, Eric Burdette, Eric G. Shoemaker, Michael C. Doogue
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Patent number: 11802945Abstract: Methods and apparatus for a controlling a stimulus source to direct photons to a pixel in a pixel array contained in a detector system, analyzing a response of the pixel in the pixel array; and generating an alert based on the response of the pixel in the pixel array. Example stimulus sources include a conductive trace, a PN junction, and a current source.Type: GrantFiled: March 10, 2021Date of Patent: October 31, 2023Assignee: Allegro MicroSystems, LLCInventors: William P. Taylor, Bryan Cadugan
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Publication number: 20230333213Abstract: Methods and apparatus for a system including an optic to receive light from near objects and far objects and a photoreceiver optically coupled to the optic, the photoreceiver including a photodetector array. A light scattering structure is positioned a distance from the photodetector array to compensate for parallax effects for the received energy from the near objects and the far objects. The light scattering structure is configured to scatter light onto pixels of the photodetector array.Type: ApplicationFiled: April 13, 2022Publication date: October 19, 2023Applicant: Allegro MicroSystems, LLCInventors: Bryan Cadugan, Andrew S. Huntington, Sapna S. Mukherjee, Adam Lee, George Williams, Richard Migliaccio, William P. Taylor
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Publication number: 20230333216Abstract: Methods and apparatus for photodetection having parallax compensation for near and far object signal return. In embodiment, a photoreceiver comprising a at least one light-sensitive pixel to transduce light to electrical signals has at least a first one of the pixels including a first subpixel region having a first light response characteristic and a second subpixel region having a second light response characteristic, wherein the first and second light characteristics are configured to correspond to variations in intensity of reflected light from objects at different distances when the portion of the reflected light reaching the first one of the pixels imaged onto the first and second subpixel regions.Type: ApplicationFiled: April 13, 2022Publication date: October 19, 2023Applicant: Allegro MicroSystems, LLCInventors: Bryan Cadugan, Andrew S. Huntington, Sapna S. Mukherjee, Adam Lee, George Williams, Richard Migliaccio, William P. Taylor
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Patent number: 11791604Abstract: Methods and apparatus for receiving a return laser pulse at a detector system having pixels in a pixel array and analyzing a response of the pixels in the pixel array including comparing the response to at least one threshold corresponding to decay of photonic energy of the laser pulse over distance and target reflectivity, wherein the at least one threshold comprises a first threshold corresponding to a low trigger for a pulse generated by a first type of laser and a second threshold corresponding to a high trigger for the pulse generated by the first type of laser. Embodiments can further include generating an alert signal based on the response of the pixels in the pixel array.Type: GrantFiled: January 11, 2023Date of Patent: October 17, 2023Assignee: Allegro MicroSystems, LLCInventors: William P. Taylor, Bryan Cadugan
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Publication number: 20230261118Abstract: An integrated circuit package and method of fabrication are described. The integrated circuit package includes a lead frame having a first surface and a second opposing surface and a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame. A magnet attached to the second surface of the lead frame has a non-contiguous central region and at least one channel extending laterally from the central region. An overmold material forms an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.Type: ApplicationFiled: April 26, 2023Publication date: August 17, 2023Applicant: Allegro MicroSystems, LLCInventors: Ravi Vig, William P. Taylor, Paul A. David, P. Karl Scheller, Andreas P. Friedrich
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Patent number: 11680996Abstract: Methods and apparatus for a magnetic sensor having a die and sensor circuitry formed in a device layer of the die with a coil integrated with the die to generate a magnetic field. A magnetoresistive magnetic field sensing element on the die detects changes in the magnetic field generated by the coil as a result of the presence of a ferromagnetic target. The sensor circuitry may process the changes in the magnetic field generated by the coil.Type: GrantFiled: September 20, 2017Date of Patent: June 20, 2023Assignee: Allegro MicroSystems, LLCInventors: Gary T. Pepka, William P. Taylor
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Patent number: 11677032Abstract: A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.Type: GrantFiled: June 14, 2022Date of Patent: June 13, 2023Assignee: Allegro MicroSystems, LLCInventors: Ravi Vig, William P. Taylor, Paul A. David, P. Karl Scheller, Andreas P. Friedrich
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Publication number: 20230155344Abstract: Methods and apparatus for receiving a return laser pulse at a detector system having pixels in a pixel array and analyzing a response of the pixels in the pixel array including comparing the response to at least one threshold corresponding to decay of photonic energy of the laser pulse over distance and target reflectivity, wherein the at least one threshold comprises a first threshold corresponding to a low trigger for a pulse generated by a first type of laser and a second threshold corresponding to a high trigger for the pulse generated by the first type of laser. Embodiments can further include generating an alert signal based on the response of the pixels in the pixel array.Type: ApplicationFiled: January 11, 2023Publication date: May 18, 2023Applicant: Allegro MicroSystems, LLCInventors: William P. Taylor, Bryan Cadugan
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Patent number: 11600654Abstract: A method includes forming a plurality of identical arrays on a semiconductor wafer, each array having a plurality of detectors, screening each of the plurality of arrays to determine an operational status of each of the plurality of arrays, and selecting one of the plurality of arrays for use based on the determination of the operational status of the plurality of arrays. Also described is a focal plane array including a circuit having a plurality of electrical contacts and a die including a plurality of identical arrays, each including a plurality of detectors. The plurality of identical arrays includes at least one selected array that is fully functional and at least one non-selected array that is not fully functional and the selected array is positioned with respect to the circuit so that the detectors of the selected array contact the plurality of electrical contacts of the circuit.Type: GrantFiled: July 15, 2021Date of Patent: March 7, 2023Assignee: Allegro MicroSystems, LLCInventors: Logan G. Stewart, Andrew S. Huntington, William P. Taylor
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Publication number: 20230057390Abstract: A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.Type: ApplicationFiled: October 13, 2022Publication date: February 23, 2023Applicant: Allegro MicroSystems, LLCInventors: Ravi Vig, William P. Taylor, Andreas P. Friedrich, Paul A. David, Marie-Adelaide Lo, Eric Burdette, Eric G. Shoemaker, Michael C. Doogue
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Patent number: 11581697Abstract: Methods and apparatus for a controlling a stimulus source to direct photons to a pixel in a pixel array contained in a detector system, analyzing a response of the pixel in the pixel array; and generating an alert based on the response of the pixel in the pixel array. Example stimulus sources include a conductive trace, a PN junction, and a current source.Type: GrantFiled: March 10, 2021Date of Patent: February 14, 2023Assignee: Allegro MicroSystems, LLCInventors: William P. Taylor, Bryan Cadugan
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Publication number: 20230017207Abstract: A method includes forming a plurality of identical arrays on a semiconductor wafer, each array having a plurality of detectors, screening each of the plurality of arrays to determine an operational status of each of the plurality of arrays, and selecting one of the plurality of arrays for use based on the determination of the operational status of the plurality of arrays. Also described is a focal plane array including a circuit having a plurality of electrical contacts and a die including a plurality of identical arrays, each including a plurality of detectors. The plurality of identical arrays includes at least one selected array that is fully functional and at least one non-selected array that is not fully functional and the selected array is positioned with respect to the circuit so that the detectors of the selected array contact the plurality of electrical contacts of the circuit.Type: ApplicationFiled: July 15, 2021Publication date: January 19, 2023Applicant: Allegro MicroSystems, LLCInventors: Logan G. Stewart, Andrew S. Huntington, William P. Taylor
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Publication number: 20220406830Abstract: Methods and apparatus for a first photodetector array die having pixels from a first end to a second end and a second photodetector array die having pixels from a first end to a second end. A readout integrated circuit (ROIC) can be electrically coupled to the first and second photodetector array die. One or more microlenses can steer light onto the photodetector arrays.Type: ApplicationFiled: June 21, 2021Publication date: December 22, 2022Applicant: Allegro MicroSystems, LLCInventors: Bryan Cadugan, Harry Chandra, William P. Taylor