Abstract: Methods and apparatus for a first photodetector array die having pixels from a first end to a second end and a second photodetector array die having pixels from a first end to a second end. A readout integrated circuit (ROIC) can be electrically coupled to the first and second photodetector array die. One or more microlenses can steer light onto the photodetector arrays.

Abstract: A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.

Abstract: Methods and apparatus for a controlling a stimulus source to direct photons to a pixel in a pixel array contained in a detector system, analyzing a response of the pixel in the pixel array; and generating an alert based on the response of the pixel in the pixel array. Example stimulus sources include a conductive trace, a PN junction, and a current source.

Abstract: Methods and apparatus for a controlling a stimulus source to direct photons to a pixel in a pixel array contained in a detector system, analyzing a response of the pixel in the pixel array; and generating an alert based on the response of the pixel in the pixel array. Example stimulus sources include a conductive trace, a PN junction, and a current source.

Abstract: A magnetic field sensor includes a lead frame, a semiconductor die, a conductive coil, a mandrel, and a non-conductive mold material. The lead frame has a first surface, a second opposing surface, at least one slot, and a plurality of leads. The semiconductor die has a first surface in which a magnetic field sensing element is disposed and a second opposing surface attached to the first surface of the lead frame. The conductive coil is secured to the second surface of the lead frame and configured to operate as a back bias magnet to provide a magnetic field used to detect movement of a target. The coil is would around the mandrel and the mandrel is comprised of a ferromagnetic material. The non-conductive mold material encloses the die, the conductive coil, the mandrel, and at least a portion of the lead frame.

Abstract: Methods and apparatus for detecting a magnetic field include a semiconductor substrate, a coil configured to provide a changing magnetic field in response to a changing current in the coil; and a magnetic field sensing element supported by the substrate. The coil receives the changing current and, in response, generates a changing magnetic field. The magnetic field sensing element detects the presence of a magnetic target by detecting changes to the magnetic field caused by the target and comparing them to an expected value.

Abstract: A joystick assembly for use with a device including a joystick surface and a first magnet having north and south magnetic poles includes a second magnet having north and south magnetic poles and a movable elongated shaft having first and second opposing ends arranged along a major axis of the shaft. The first end of the shaft is coupled to the second magnet such that movement of the shaft results in movement of the second magnet relative to the first magnet such that a line between centers of the north and south magnetic poles of the second magnet is movable relative to a line between the north and south magnetic poles of the first magnet. An attraction of the second magnet to the first magnet results in a restoring force upon the shaft, and the shaft and the second magnet are removable from the joystick surface.

Abstract: Methods and apparatus for a signal isolator having enhanced creepage characteristics. In embodiments, a signal isolator IC package comprises a leadframe including a die paddle having a first surface to support a die and an exposed second surface. A die is supported by a die paddle wherein a width of the second surface of the die paddle is less than a width of the die.

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

Abstract: Methods and apparatus for providing an integrated circuit having a drive current source, a magnetic sensing element coupled to the drive current source, the magnetic sensing element having first and second differential outputs, and first and second current elements to provide respective currents in relation to the drive current source, wherein the first current element is coupled to the first differential output and the second current element is coupled to the second differential output. In illustrative embodiments, an IC output can output a voltage corresponding to the currents of the first and second current elements.

Abstract: Methods and apparatus for detecting a magnetic field include a semiconductor substrate, a coil configured to provide a changing magnetic field in response to a changing current in the coil; and a magnetic field sensing element supported by the substrate. The coil receives the changing current and, in response, generates a changing magnetic field. The magnetic field sensing element detects the presence of a magnetic target by detecting changes to the magnetic field caused by the target and comparing them to an expected value.

Abstract: A magnetic field sensor has a plurality of magnetic field sensing elements and operates as a motion detector for sensing a rotation or other movement of a target object.

Abstract: An electronics module assembly for detecting photons is provided to include: a substrate layer; a buried layer deposited upon a first surface area of the substrate layer; an intrinsic layer deposited upon a first portion of a first surface area of the buried layer; a plug layer deposited upon a second portion of the first surface area of the buried layer; a p-plus layer deposited upon a first surface area of the intrinsic layer; an n-plus layer deposited upon a first surface area of the plug layer; a pre-metal dielectric (PMD) layer deposited upon the p-plus layer and n-plus layer; a first node coupled, through the PMD layer, to the p-plus layer; and a second node coupled, through the PMD layer, to the n-plus layer.

Abstract: Methods and apparatus for a signal isolator having enhanced creepage characteristics. In embodiments, a signal isolator IC package comprises a leadframe including a die paddle having a first surface to support a die and an exposed second surface. A die is supported by a die paddle wherein a width of the second surface of the die paddle is less than a width of the die.

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

Abstract: Methods and apparatus for compensating for bad pixels in a sensor array. In embodiments, a detector system receives an image on a sensor array of pixels for a first frame via a lens when the lens and the sensor array are configured in a first positional relationship. The array includes at least one bad pixel. The system moves the lens and/or the sensor array based on a position of the at least one bad pixel in the image such that the lens and the sensor array are configured in a second positional relationship. The image on the sensor array for a second frame is received via the lens when the lens and the sensor array are configured in a second positional relationship. The system compensates for the location of the at least one bad pixel in the image for the first and second frames to output a processed image.

Abstract: A magnetic field sensor has first and second rows of magnetic field sensing elements coupled to an electronic circuit. A magnet can be disposed under or over the magnetic field sensor. The magnetic field sensor is operable to use the first and second rows of magnetic field sensing elements and the electronic circuit to detect a relative rotation angle between the magnet and the first and second rows of magnetic field sensing elements.

Abstract: According to an embodiment of the present disclosure, a photodetector device can include a substrate layer; a bottom contacting layer disposed over a surface of the substrate layer and having a first contacting region and a second contacting region, the bottom contacting layer providing a low resistance path between the first and second contacting regions; an insulating layer disposed over a surface of the bottom contacting layer; an intrinsic region disposed within the insulating layer, the intrinsic region in electrical contact with the first contacting region of the bottom contacting layer, the intrinsic region comprising a low band-gap material; a metal contact disposed within the insulating layer and in electrical contact with the second contacting region of the bottom contacting layer; an anode in electrical contact with the intrinsic region; and a cathode in electrical contact with the metal contact.

Abstract: A pressure sensor includes a conductive substrate having a cavity which forms a thin portion that can be deformed by a pressure differential. A magnetic field sensor has at least one coil responsive to a changing coil drive signal and positioned proximate to the thin portion of the substrate that induces eddy currents in the thin portion that generate a reflected magnetic field. Magnetic field sensing elements detect the reflected magnetic field and generate a magnetic field signal. The magnetic field sensor is positioned so that deformation of the thin portion of the substrate causes a distance between the thin portion of the substrate and the magnetic field sensor to change.

Abstract: A magnetic field sensor has first and second rows of magnetic field sensing elements coupled to an electronic circuit. A magnet can be disposed under or over the magnetic field sensor. The magnetic field sensor is operable to use the first and second rows of magnetic field sensing elements and the electronic circuit to detect a relative rotation angle between the magnet and the first and second rows of magnetic field sensing elements.