Abstract: A memory device, and method of making the same, that includes a substrate of semiconductor material of a first conductivity type, first and second regions spaced apart in the substrate and having a second conductivity type different than the first conductivity type, with a first channel region in the substrate extending between the first and second regions, a first floating gate disposed over and insulated from a first portion of the first channel region adjacent to the second region, a first coupling gate disposed over and insulated from the first floating gate, a first word line gate disposed over and insulated from a second portion of the first channel region adjacent the first region, and a first erase gate disposed over and insulated from the first word line gate.

Abstract: A high-voltage permanent magnet frequency conversion all-in-one machine according to an embodiment of the present disclosure includes a frequency converter configured to perform frequency conversion on a high-voltage alternating current, and output at least three alternating currents, a permanent magnet motor configured to receive the alternating currents subjected to the frequency conversion and output from the frequency converter, to drive the motor to operate, and a controller configured to control the frequency converter to perform the frequency conversion on the high-voltage alternating current, and control an operation state of the permanent magnet motor.

Abstract: A method of forming a device on a substrate with recessed first/third areas relative to a second area by forming a fin in the second area, forming first source/drain regions (with first channel region therebetween) by first/second implantations, forming second source/drain regions in the third area (defining second channel region therebetween) by the second implantation, forming third source/drain regions in the fin (defining third channel region therebetween) by third implantation, forming a floating gate over a first portion of the first channel region by first polysilicon deposition, forming a control gate over the floating gate by second polysilicon deposition, forming an erase gate over the first source region and a device gate over the second channel region by third polysilicon deposition, and forming a word line gate over a second portion of the first channel region and a logic gate over the third channel region by metal deposition.

Abstract: Numerous embodiments are disclosed of improved architectures for storing and retrieving system data in a non-volatile memory system. Using these embodiments, system data is much less likely to become corrupted due to charge loss, charge redistribution, disturb effects, and other phenomena that have caused corruption in prior art non-volatile memory systems.

Abstract: An atmosphere starry sky light for festival entertainment is provided. The constellation unit is configured to switch patterns of twelve constellations and perform projection display on the patterns of the twelve constellations. The starry sky unit is configured to project a starry sky background. The background unit is configured to project patterns of aurora, clouds, and ripples. The planetary unit is configured to switch patterns of a planet, and to project and display a planetary image. The constellation unit, the planetary unit, the starry sky unit and the background unit form a panoramic image of the cosmic starry sky by superimposing and combining.

Abstract: The present invention relates to a flash memory device that uses strap cells in a memory array of non-volatile memory cells as source line pull down circuits. In one embodiment, the strap cells are erase gate strap cells. In another embodiment, the strap cells are source line strap cells. In another embodiment, the strap cells are control gate strap cells. In another embodiment, the strap cells are word line strap cells.

Abstract: A method of forming a memory device that includes forming a first insulation layer, a first conductive layer, and a second insulation layer on a semiconductor substrate, forming a trench in the second insulation layer to expose the upper surface of the first conductive layer, performing an oxidation process and a sloped etch process to reshape the upper surface to a concave shape, forming a third insulation layer on the reshaped upper surface, forming a conductive spacer on the third insulation layer, removing portions of the first conductive layer leaving a floating gate under the conductive spacer with the reshaped upper surface terminating at a side surface at a sharp edge, and forming a word line gate laterally adjacent to and insulated from the floating gate. The conductive spacer includes a lower surface that faces and matches the shape of the reshaped upper surface.

Abstract: A method of forming a semiconductor device by recessing the upper surface of a semiconductor substrate in first and second areas but not a third area, forming a first conductive layer in the first and second areas, forming a second conductive layer in all three areas, removing the first and second conductive layers from the second area and portions thereof from the first area resulting in pairs of stack structures each with a control gate over a floating gate, forming a third conductive layer in the first and second areas, forming a protective layer in the first and second areas and then removing the second conductive layer from the third area, then forming blocks of conductive material in the third area, then etching in the first and second areas to form select and HV gates, and replacing the blocks of conductive material with blocks of metal material.

Abstract: A method of forming a semiconductor device by recessing the upper surface of a semiconductor substrate in first and second areas but not a third area, forming a first conductive layer in the three areas, forming a second conductive layer in all three areas, removing the first and second conductive layers from the second area and portions thereof from the first area resulting in pairs of stack structures each with a control gate over a floating gate, forming a third conductive layer in all three areas, forming a protective layer in the first and second areas and then removing the third conductive layer from the third area, then forming blocks of dummy conductive material in the third area, then etching in the first and second areas to form select and HV gates, and then replacing the blocks of dummy conductive material with blocks of metal material.

Abstract: A method of forming a memory device that includes forming a first polysilicon layer using a first polysilicon deposition over a semiconductor substrate, forming an insulation spacer on the first polysilicon layer, and removing some of the first polysilicon layer to leave a first polysilicon block under the insulation spacer. A source region is formed in the substrate adjacent a first side surface of the first polysilicon block. A second polysilicon layer is formed using a second polysilicon deposition. The second polysilicon layer is partially removed to leave a second polysilicon block over the substrate and adjacent to a second side surface of the first polysilicon block. A third polysilicon layer is formed using a third polysilicon deposition. The third polysilicon layer is partially removed to leave a third polysilicon block over the source region. A drain region is formed in the substrate adjacent to the second polysilicon block.