Abstract: A tea spirit and a method for preparing the same are provided. The method comprises steps crushing tea leaves and soaking the crushed tea leaves in a solvent to obtain a tea suspension; subjecting the tea suspension to distillation under reduced pressure to obtain a tea aroma extract and a remaining tea pulp; filtering the tea pulp to obtain a tea soup, and subjecting the tea soup to concentration under reduced pressure and filtering the tea soup to obtain a filtrate; adsorbing the filtrate with macroporous adsorption resin, then adding food-grade anhydrous alcohol, letting the resultant mixture stand, separating solid from the mixture and drying the solid to obtain a tea theanine extract; and mixing the tea aroma extract and the tea theanine extract with Chinese baijiu to obtain the tea wine. The tea wine as obtained has both tea aroma and wine aroma, and also has an improved intoxication tolerance time.

Abstract: An electrical connector includes an insulating body and a number of conductive terminals. The insulating body includes a mating slot. Each conductive terminal includes an elastic mating portion protruding into the mating slot and an end portion extending from the elastic mating portion. The insulating body is provided with a number of limiting blocks for limiting the conductive terminals and a terminal limiting slot located between two adjacent limiting blocks. At least one limiting block includes a limiting protrusion protruding into the terminal limiting slot for limiting a side surface of the end portion of the conductive terminal. The insulating body also includes a relief slot in communication with the terminal limiting slot. When the conductive terminal needs to be deformed, the end portion of the conductive terminal can move unimpeded in the relief slot.

Abstract: A backplane connector includes a housing, a number of terminal modules assembled to the housing, and a metal shield surrounding member. The housing includes a base, a first side wall and a second side wall. The base, the first side wall and the second side wall jointly form a receiving space for at least partially receiving a mating connector. The terminal module includes a first signal terminal, a second signal terminal and an insulating block fixed on the first signal terminal and the second signal terminal. The metal shield surrounding member at least partially surrounds the periphery of the first signal terminal and the second signal terminal. As a result, the shielding effect of the backplane connector is improved.

Abstract: A backplane connector includes a number of wafers. Each wafer includes a number of conductive terminals, a first metal shield and a second metal shield. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal has a contact portion. The first metal shield and the second metal shield respectively include a first extension portion and a second extension portion. The first extension portion and/or the second extension portion include a limiting structure for limiting the contact portion of the first ground terminal and/or the contact portion of the second ground terminal. Besides, in two adjacent wafers, the first extension portion of one wafer contacts the second extension portion of the other wafer through protruding tabs. As a result, the structural reliability of the backplane connector is improved.

Abstract: A backplane connector includes a number of wafers and a spacer for assembling the wafers together. Each wafer includes an insulating frame and a number of conductive terminals fixed to the insulating frame. The insulating bracket includes a first protrusion and a second protrusion. The spacer includes a first body portion and a second body portion. The first body portion includes a first clamping slot for clamping the first protrusion. The second body portion includes a second clamping slot for clamping the second protrusion. The present disclosure increases the ability of the spacer to resist external forces and improves the structural stability of the backplane connector.

Abstract: A backplane connector includes a housing and a number of wafers assembled to the housing. Each wafer includes a number of conductive terminals, an insulating frame and a metal shield. The housing includes an insulating housing and a metal shell fixed to the insulating housing. The insulating housing includes a number of slots for positioning the wafers. The metal shell is provided with a mating surface and a number of terminal receiving grooves. The contact portions of the conductive terminals are exposed in the corresponding terminal receiving grooves. The present disclosure improves the structural strength of the backplane connector and reduces the risk of damage the mating surface due to the push or collision of a mating connector.

Abstract: A terminal module includes a number of conductive terminals. Each conductive terminal includes a contact portion. The conductive terminals include differential signal terminals. Each differential signal terminal includes a first extending portion, a torsion portion, and a second extending portion perpendicular to the first extending portion. The differential signal terminals include a first signal terminal and a second signal terminal. Most of the two first extending portions of the differential signal terminals are narrow-side coupled, and small parts are wide-side coupled. The second extending portions of the differential signal terminals are narrow-sided coupled. The present disclosure also discloses a backplane connector having the terminal module. Compared with the prior art, the present disclosure can make the differential signal terminals tightly coupled, thereby stabilizing the insertion loss.

Abstract: A mating terminal module includes a number of mating conductive terminals. Each mating conductive terminal includes a mating portion. The mating conductive terminals include a first mating signal terminal and a second mating signal terminal. The first mating signal terminal further includes a first connecting portion. The second mating signal terminal further includes a second connecting portion. The first connecting portion extends in a direction toward the second connecting portion, and the second connecting portion extends in a direction toward the first connecting portion. The present disclosure also discloses a mating backplane connector and a backplane connector assembly having the mating terminal module. Compared with the prior art, the present disclosure can achieve a better effect of impedance stabilization.

Abstract: A connector assembly includes a card connector and a first backplane connector. The card connector includes a first terminal module, a second terminal module and a circuit board card. The circuit board card connects the first terminal module and the second terminal module to form a receiving cavity. The first backplane connector is received in the receiving cavity. The present disclosure can make full use of space to improve space utilization of the connector assembly.

Abstract: A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. Each conductive terminal includes a connection portion and a contact portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield has a first elastic arm and a second elastic arm. The second metal shield has a third elastic arm and a fourth elastic arm. The first elastic arm and the third elastic arm are in contact with two opposite side surfaces of the contact portion of the first ground terminal. The second elastic arm and the fourth elastic arm are in contact with two opposite side surfaces of the contact portion of the second ground terminal. This arrangement increases the grounding shielding area, reduces crosstalk, and improves the quality of signal transmission.

Abstract: A backplane connector includes a wafer and a mounting block. The wafer includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The conductive terminal includes a contact portion, a tail portion and a connection portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield includes a first protruding piece. The second metal shield includes a second protruding piece. The mounting block includes a slot for passing through the tail portions of the differential signal terminals. The first protruding piece and the second protruding piece are at least partially inserted into the slot. This arrangement can provide better shielding adjacent to the tail portions of the differential signal terminals, reduce crosstalk, and improve the quality of signal transmission.

Abstract: A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The first metal shield and the second metal shield respectively include a first extension portion and a second extension portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first extension portion and the second extension portion in contact with the first ground terminal and the second ground terminal. As a result, a shielding space to enclose contact portions of the differential signal terminals is formed. This arrangement can provide better shielding for the differential signal terminals, reduce crosstalk, and improve the quality of signal transmission.

Abstract: A circuit board includes two first insertion holes, a second insertion hole located on one side of the two first insertion holes, a third insertion hole located on the other side of the two first insertion holes, and a number of grounding points. The grounding points are distributed on a periphery of the first insertion holes. The grounding points, the second insertion hole and the third insertion hole together form a shielding layer surrounding the periphery of the first insertion holes. The present disclosure also relates to a backplane connector assembly having a backplane connector and the circuit board. Compared with the prior art, the circuit board disclosed in the present disclosure improves the shielding effect of differential signal terminals, reduces crosstalk and improves the quality of signal transmission.

Abstract: A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The conductive terminal includes a connection portion and a contact portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield has a first extension portion. The second metal shield has a second extension portion. The backplane connector includes an insulating block sleeved on the contact portions of the differential signal terminal and a metal shell sleeved on the insulating block. The metal shell is in contact with the first extension portion and the second extension portion. This arrangement increases the grounding shielding area, reduces crosstalk and improves the quality of signal transmission.

Abstract: An elastic arm structure is arranged on one end of the terminal body, and includes a support part and a contact part. The support part is a bending structure formed by sequentially connecting multiple extension sections, a first end of the support part is an operation end and a second end of the support part is a connection end, from the connection end to the operation end, an included angle between each of extension directions of the multiple extension sections and a first direction is gradually reduced, and the first direction is parallel to a length direction of the terminal body. The contact part is arranged at the operation end and is bent towards an inner side of the bending structure.

Abstract: The connector terminal includes an insulation body and multiple terminal bodies. Each of the multiple terminal bodies includes: a base part, an elastic arm and a welding part. The base part includes a first base part and a second base part, the first base part and the second base part form a bending structure, a first end of the first base part is embedded in the insulation body, a second end of the first base part is connected to a first end of the second base part, and a second end of the second base part is embedded in the insulation body. The elastic arm is connected to the first end of the first base part and extends out of a first end of the insulation body. The welding part is connected to the second end of the second base part and extends out of a second end of the insulation body.

Abstract: A backplane connector includes a wafer. The wafer includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield located on opposite sides of the insulating frame. The insulating frame includes a number of first posts and a number of second posts. The first metal shield has a number of first mounting holes to receive the first posts. The second metal shield has a number of second mounting holes to receive the second posts. With this arrangement, the first metal shield and the second metal shield can be easily positioned with the insulating frame.

Abstract: A backplane connector assembly includes a first backplane connector and a second backplane connector. The first backplane connector includes a number of first conductive terminals, a first insulating frame, a first metal shield and a second metal shield. The first metal shield includes a first elastic piece, and the second metal shield includes a second elastic piece. The second backplane connector includes a number of second differential signal terminals, an insulating block sleeved on the second differential signal terminals, and a metal shell sleeved on the insulating block. When the first backplane connector is mated with the second backplane connector, the first elastic piece and the second elastic piece are in contact with the metal shell to increase the grounding shielding area, reduce crosstalk and improve the quality of signal transmission.

Abstract: A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. Each conductive terminal includes a connection portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield and the second metal shield are respectively in contact with two opposite side surfaces of the first ground terminal and the second ground terminal. As a result, a shielding cavity surrounding the connection portions of the differential signal terminals is formed. This arrangement can provide better shielding for the differential signal terminals over the length of the connection portion, reduce crosstalk, and improve the quality of signal transmission.

Abstract: A wafer includes a number of conductive terminals and an insulating frame. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal includes a connection portion and a contact portion. The connection portions of the differential signal terminals, the first ground terminal and the second ground terminal are located in a first plane. The first ground terminal includes a first torsion portion and the second ground terminal includes a second torsion portion. The contact portion of the first ground terminal and the contact portion of the second ground terminal are both perpendicular to the first plane. This present disclosure can provide better shielding effect, reduce crosstalk and improve the quality of signal transmission. In addition, the present disclosure also relates to a backplane connector having the wafer.