Abstract: A micro-electrical-mechanical system (MEMS) actuator includes: a MEMS actuation core, and a multi-piece MEMS electrical connector assembly electrically coupled to the MEMS actuation core and configured to be electrically coupled to a printed circuit board, wherein the multi-piece MEMS electrical connector includes: a plurality of subcomponents, and a plurality of coupling assemblies configured to couple the plurality of subcomponents together.

Abstract: A micro-electrical-mechanical system (MEMS) cantilever assembly includes an intermediary cantilever portion, a main cantilever arm configured to couple a moveable portion of a micro-electrical-mechanical system (MEMS) and the intermediary cantilever portion, and a plurality of intermediary links configured to couple the intermediary cantilever portion to a portion of the micro-electrical-mechanical system (MEMS).

Abstract: A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.

Abstract: INVENTION #7 A micro-electrical-mechanical system (MEMS) device includes one or more slidable connection assemblies for releasably coupling the micro-electrical-mechanical system (MEMS) device to a wafer from which the micro-electrical-mechanical system (MEMS) device was made.

Abstract: A micro-electrical-mechanical system (MEMS) assembly includes a stationary stage, a rigid stage, at least one flexure configured to slidably couple the stationary stage and the rigid stage, at least one flexible electrode coupled and essentially orthogonal to one of the stationary stage and the rigid stage, and at least one rigid electrode coupled and essentially orthogonal to the other of the stationary stage and the rigid stage.

Abstract: In one embodiment, an electrostatic actuator includes a generally planar fixed frame, a generally planar moving frame coupled to the fixed frame by a flexure for substantially coplanar, perpendicular movement relative to the fixed frame, a plurality of interdigitated teeth, a fixed portion of which is attached to the fixed frame and a moving portion of which is attached to the moving frame, and an elongated output shaft having opposite input and output ends, the input end being coupled to the moving frame.

Abstract: A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.

Abstract: Electric connection flexures for moving stages of microelectromechanical systems (MEMS) devices are disclosed. The disclosed flexures may provide an electrical and mechanical connection between a fixed frame and a moving frame, and are flexible in the moving frame's plane of motion. In implementations, the flexures are formed using a process that embeds the two ends of each flexure in the fixed frame and moving frame, respectively.

Abstract: Caging structures are disclosed for caging or otherwise reducing the mechanical shock pulse experienced by MEMS device beam structures during events that may cause mechanical shock to the MEMS device. The caging structures at least partially surround the beam such that they limit the motion of the beam in a direction perpendicular to the beam's longitudinal axis, thereby reducing stress on the beam during a mechanical shock event. The caging structures may be used in combination with mechanical shock-resistant beams.

Abstract: In one example, a camera is provided that includes: a plurality of MEMS electrostatic comb actuators, each actuator operable to exert a force on at least one lens; and an optical image stabilization (OIS) algorithm module operable to command the plurality of actuators to actuate the at least one lens responsive to motion of the camera.

Abstract: A system and method for manipulating the structural characteristics of a MEMS device include etching a plurality of holes into the surface of a MEMS device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the MEMS device.

Abstract: A heel test block comprises a semi-cylinder, a first flat plate and a second flat plate, wherein the side surface of the semi-cylinder comprises a circular arc-shaped surface and a first plane, the first flat plate and the second flat plate are arranged on one side of the first plane, all the parts of the first flat plate have the same thickness, all the parts of the second flat plate have the same thickness, the first flat plate and the second flat plate are arranged in parallel to the first plane, the first flat plate and the second flat plate are arranged on the two sides of the mother line of the semi-cylinder respectively, and the thickness of the first flat plate is less than that of the second flat plate.

Abstract: A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.

Abstract: A device can have an outer frame and an actuator. The actuator can have a movable frame and a fixed frame. At least one torsional flexure and at least one hinge flexure can cooperate to provide comparatively high lateral stiffness between the outer frame and the movable frame and can cooperate to provide comparatively low rotational stiffness between the outer frame and the movable frame.

Abstract: A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made.

Abstract: Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

Abstract: Caging structures are disclosed for caging or otherwise reducing the mechanical shock pulse experienced by MEMS device beam structures during events that may cause mechanical shock to the MEMS device. The caging structures at least partially surround the beam such that they limit the motion of the beam in a direction perpendicular to the beam's longitudinal axis, thereby reducing stress on the beam during a mechanical shock event. The caging structures may be used in combination with mechanical shock-resistant beams.

Abstract: A system and method for manipulating the structural characteristics of a MEMS device include etching a plurality of holes into the surface of a MEMS device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the MEMS device.

Abstract: In one example, a camera is provided that includes: a plurality of MEMS electrostatic comb actuators, each actuator operable to exert a force on at least one lens; and an optical image stabilization (OIS) algorithm module operable to command the plurality of actuators to actuate the at least one lens responsive to motion of the camera.

Abstract: A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package.