Abstract: A mounting device (10) for mounting a heat sink (20) to a printed circuit board (40) on which a heat generating electronic component (30) is disposed, includes a mounting frame (100), two clasping legs (104) and four resilient arms (105). The mounting frame includes two first mounting arms (101) and two second mounting arms (102) disposed above the first mounting arms. The first mounting arms abut on the circuit board. The clasping legs connect with the second mounting arms and are inserted through the printed circuit board to be attached to the printed circuit board. The resilient arms connect with the second mounting arms and exert a downward resilient force on the heat sink toward the heat generating electronic component.

Abstract: An LED assembly (10) includes an LED (12) and a lens (16). The lens covers on an outer periphery of the LED. The LED has an encapsulant (125) and an LED chip (121) received in the encapsulant (125) and having a light emitting surface (122). The lens has a light output surface (161) over the light emitting surface. The light output surface defines a plurality of annular, concentric grooves (163). Each groove (163) is cooperatively enclosed by a first groove wall (165) and a second groove wall (166). The first groove wall is a portion of a periphery of an imaginary cone and a conical tip of the imaginary cone is located on the light emitting surface of the LED chip.

Abstract: A light emitting diode (10) includes an LED chip (14) and an encapsulant (16) enclosing the LED chip. The LED chip has a light emitting surface (141), and the encapsulant has a light output surface (161) over the light emitting surface. The light output surface defines a plurality of annular, concentric grooves (163). Each groove is cooperatively enclosed by a first groove wall (165) and a second groove wall (166). The first groove wall is a portion of a circumferential side surface of a cone, and a conical tip of the cone is located on the light emitting surface of the LED chip.

Abstract: A light source module (100) includes a plurality of light emitting diodes (13), a heat dissipation device (30) and a thermoelectric cooler (20). The thermoelectric cooler has a cold side (21) and a hot side (23). The light emitting diodes are in thermal engagement with the cold side of the thermoelectric cooler. The heat dissipation device is in thermal engagement with the hot side of the thermoelectric cooler.

Abstract: A reading lamp (100) includes a lamp holder (20), a lampshade (40), a bracket (30) connecting the lamp holder with the lampshade, and a white light illuminator (50) received in the lampshade. The white light illuminator includes a light mixer (52), and at least a group of solid-state, light emitting elements (544) arranged to at least one side of the light mixer. The at least a group of solid-state, light emitting elements includes three kinds of solid-state, light emitting elements which respectively emit red, green and blue lights. The light mixer reflects, refracts and mixes the red, green and blue lights to obtain white light which directly radiates and spreads from a light emitting surface (521) of the light mixer.

Abstract: A reading lamp (100) includes a lamp holder (20), a lampshade (30), a bracket (40) connecting the lamp holder with the lampshade, and a white light illuminator (50) received in the lampshade. The white light illuminator includes a light mixer (52) having a light emitting surface (521), and a plurality of light emitting diodes (542) arranged at one side of the light mixer. At least a phosphor layer (523) is disposed on the light emitting surface of the light mixer. Lights emitted by the light emitting diodes enter into the light mixer and spread out of the light mixer from the light emitting surface. The lights spread from the light mixer activate the at least a phosphor layer to emit lights and mix with the light emitted by the at least a phosphor layer thereby obtaining white lights.

Abstract: An LED lamp (100) includes a frame (12), at least one LED module (20), a heat sink (32) and a cover (50). The LED module has a plurality of LEDs (220). The heat sink is mounted on the frame. The at least one LED module is attached to a bottom of the heat sink, whereby heat generated by the LEDs can be dissipated by the heat sink. A heat pipe (35) interconnects the heat sink and the cover. Thus, the heat generated by the LEDs can also be dissipated by the cover via the heat pipe. The cover is secured so as to shield a top portion of the heat sink and space from the top portion of the heat sink.