Abstract: A scanning electron microscopy system is disclosed. The system includes an electron beam source configured to generate a primary electron beam. The system includes a sample stage configured to secure a sample. The system includes a set of electron-optical elements configured to direct at least a portion of the primary electron beam onto a portion of the sample. The set of electron-optical elements includes an upper deflector assembly and a lower deflector assembly. The upper deflector assembly is configured to compensate for chromatic aberration in the primary electron beam caused by the lower deflector assembly. In addition, the system includes a detector assembly configured to detect electrons emanating from the surface of the sample.

Abstract: An electron-optical system for inspecting or reviewing an edge portion of a sample includes an electron beam source configured to generate one or more electron beams, a sample stage configured to secure the sample and an electron-optical column including a set of electron-optical elements configured to direct at least a portion of the one or more electron beams onto an edge portion of the sample. The system also includes a sample position reference device disposed about the sample and a guard ring device disposed between the edge of the sample and the sample position reference device to compensate for one or more fringe fields. One or more characteristics of the guard ring device are adjustable. The system also includes a detector assembly configured to detect electrons emanating from the surface of the sample.

Abstract: A magnetic gun lens and an electrostatic gun lens can be used in an electron beam apparatus and can help provide high resolutions for all usable electron beam currents in scanning electron microscope, review, and/or inspection uses. An extracted beam can be directed at a wafer through a beam limiting aperture using the magnetic gun lens. The electron beam also can pass through an electrostatic gun lens after the electron beam passes through the beam limiting aperture.

Abstract: An electron-optical system for performing electron microscopy is disclosed. The system includes an electron beam source configured to generate a primary electron beam. The system includes a source lens, a condenser lens and an objective lens disposed along an optical axis. The system includes a first Wien filter disposed along the optical axis and a second Wien filter disposed along the optical axis. The first Wien filter and the second Wien filter are disposed between the source lens and the objective lens. The first Wien filter is configured to correct chromatic aberration in the primary beam. The system also includes a detector assembly configured to detect electrons emanating from the surface of the sample.

Abstract: An electron-optical system for inspecting or reviewing an edge portion of a sample includes an electron beam source configured to generate one or more electron beams, a sample stage configured to secure the sample and an electron-optical column including a set of electron-optical elements configured to direct at least a portion of the one or more electron beams onto an edge portion of the sample. The system also includes a sample position reference device disposed about the sample and a guard ring device disposed between the edge of the sample and the sample position reference device to compensate for one or more fringe fields. One or more characteristics of the guard ring device are adjustable. The system also includes a detector assembly configured to detect electrons emanating from the surface of the sample.

Abstract: An electron-optical system for performing electron microscopy is disclosed. The system includes an electron beam source configured to generate a primary electron beam. The system includes a source lens, a condenser lens and an objective lens disposed along an optical axis. The system includes a first Wien filter disposed along the optical axis and a second Wien filter disposed along the optical axis. The first Wien filter and the second Wien filter are disposed between the source lens and the objective lens. The first Wien filter is configured to correct chromatic aberration in the primary beam. The system also includes a detector assembly configured to detect electrons emanating from the surface of the sample.

Abstract: The present disclosure provides three-dimensional (3D) printing processes and systems, including methods, apparatuses, software, and systems for transferring a particulate material from one position (e.g., on one surface) to another position (e.g., on a different surface), which particulate material may be used for the production of a 3D object. In some embodiments, the particulate material may be transferred using, for example, a charged particle optical device.

Abstract: Extractors and extractor systems minimize the generation of secondary electrons which interact with and degrade the primary electron beam. This can improve the performance of an electron beam system, such as a scanning electron microscope. The extractor may include a frustoconical aperture that widens as distance from the source of the electron beam increases. The entrance into the frustoconical aperture also can include a curved edge.

Abstract: A selectively configurable system for directing an electron beam with a limited energy spread to a sample includes an electron source to generate an electron beam having an energy spread including one or more energies, an aperture having an on-axis opening and an off-axis opening, a first assembly of one or more electron lenses with selectively configurable focal powers positioned to collect the beam from the source and direct the beam to the aperture, a second assembly of one or more selectively configurable electron lenses positioned to collect the beam, a sample stage, and an electron inspection sub-system including electron optics positioned to direct the beam onto one or more samples. The first assembly includes an off-axis electron lens for interacting with the beam at an off-axis position and introducing spatial dispersion to the beam when configured with a nonzero focal power, thus filtering the energy spread.

Abstract: An electron beam apparatus addresses blanking issues resulting from sinking high-power heat onto an aperture diaphragm by evenly spreading heat on the aperture diaphragm. The apparatus can include an aperture diaphragm and a deflector that deflects the electron beam on the aperture diaphragm. The electron beam is directed at the aperture diaphragm in a pattern around the aperture. The pattern may be a circle, square, or polygon. The pattern also may include a variable locus relative to the aperture.

Abstract: An electron beam apparatus addresses blanking issues resulting from sinking high-power heat onto an aperture diaphragm by evenly spreading heat on the aperture diaphragm. The apparatus can include an aperture diaphragm and a deflector that deflects the electron beam on the aperture diaphragm. The electron beam is directed at the aperture diaphragm in a pattern around the aperture. The pattern may be a circle, square, or polygon. The pattern also may include a variable locus relative to the aperture.

Abstract: An electron-optical system for inspecting or reviewing an edge portion of a sample includes an electron beam source configured to generate one or more electron beams, a sample stage configured to secure the sample and an electron-optical column including a set of electron-optical elements configured to direct at least a portion of the one or more electron beams onto an edge portion of the sample. The system also includes a sample position reference device disposed about the sample and a guard ring device disposed between the edge of the sample and the sample position reference device to compensate for one or more fringe fields. One or more characteristics of the guard ring device are adjustable. The system also includes a detector assembly configured to detect electrons emanating from the surface of the sample.

Abstract: A scanning electron microscopy system is disclosed. The system includes an electron beam source configured to generate a primary electron beam. The system includes a sample stage configured to secure a sample. The system includes a set of electron-optical elements configured to direct at least a portion of the primary electron beam onto a portion of the sample. The set of electron-optical elements includes an upper deflector assembly and a lower deflector assembly. The upper deflect assembly is configured to compensate for chromatic aberration in the primary electron beam caused by the lower deflector assembly. In addition, the system includes a detector assembly positioned configured to detect electrons emanating from the surface of the sample.

Abstract: A selectively configurable system for directing an electron beam with a limited energy spread to a sample includes an electron source to generate an electron beam having an energy spread including one or more energies, an aperture having an on-axis opening and an off-axis opening, a first assembly of one or more electron lenses with selectively configurable focal powers positioned to collect the beam from the source and direct the beam to the aperture, a second assembly of one or more selectively configurable electron lenses positioned to collect the beam, a sample stage, and an electron inspection sub-system including electron optics positioned to direct the beam onto one or more samples. The first assembly includes an off-axis electron lens for interacting with the beam at an off-axis position and introducing spatial dispersion to the beam when configured with a nonzero focal power, thus filtering the energy spread.

Abstract: One embodiment relates to a dual Wien-filter monochromator. A first Wien filter focuses an electron beam in a first plane while leaving the electron beam to be parallel in a second plane. A slit opening allows electrons of the electron beam having an energy within an energy range to pass through while blocking electrons of the electron beam having an energy outside the energy range. A second Wien filter focuses the electron beam to become parallel in the first plane while leaving the electron beam to be parallel in the second plane. Other embodiments, aspects and features are also disclosed.

Abstract: One embodiment relates to a dual Wien-filter monochromator. A first Wien filter focuses an electron beam in a first plane while leaving the electron beam to be parallel in a second plane. A slit opening allows electrons of the electron beam having an energy within an energy range to pass through while blocking electrons of the electron beam having an energy outside the energy range. A second Wien filter focuses the electron beam to become parallel in the first plane while leaving the electron beam to be parallel in the second plane. Other embodiments, aspects and features are also disclosed.

Abstract: One embodiment relates to an apparatus for high-resolution electron beam imaging. The apparatus includes an energy filter configured to limit an energy spread of the electrons in the incident electron beam. The energy filter may be formed using a stigmatic Wien filter and a filter aperture. Another embodiment relates to a method of forming an incident electron beam for a high-resolution electron beam apparatus. Another embodiment relates to a stigmatic Wien filter that includes curved conductive electrodes. Another embodiment relates to a stigmatic Wien filter that includes a pair of magnetic yokes and a multipole deflector. Other embodiments, aspects and features are also disclosed.

Abstract: One embodiment relates to a tilt-imaging scanning electron microscope apparatus. The apparatus includes an electron gun, first and second deflectors, an objective electron lens, and a secondary electron detector. The first deflector deflects the electron beam away from the optical axis, and the second deflector deflects the electron beam back towards the optical axis. The objective lens focuses the electron beam onto a spot on a surface of a target substrate, wherein the electron beam lands on the surface at a tilt angle. Another embodiment relates to a method of imaging a surface of a target substrate using an electron beam with a trajectory tilted relative to a substrate surface. Other embodiments and features are also disclosed.

Abstract: One embodiment relates to an electron beam apparatus which includes a dual-lens electron gun for emitting an electron beam. The electron beam is a high beam-current electron beam in a first operating mode and a low beam-current electron beam in a second operating mode. The apparatus further includes a column aperture which is out of the path of the high beam-current electron beam in the first operating mode and is centered about an optical axis of the electron beam apparatus in the second operating mode. Another embodiment relates to an electron gun which includes a first gun lens, a beam limiting aperture, and a second gun lens. The first gun lens focuses the electrons before they pass through the beam-limiting aperture while the second gun lens focuses the electrons after they pass through the beam-limiting aperture. Other embodiments, aspects and features are also disclosed.

Abstract: One embodiment relates to an electron beam apparatus which includes a dual-lens electron gun for emitting an electron beam. The electron beam is a high beam-current electron beam in a first operating mode and a low beam-current electron beam in a second operating mode. The apparatus further includes a column aperture which is out of the path of the high beam-current electron beam in the first operating mode and is centered about an optical axis of the electron beam apparatus in the second operating mode. Another embodiment relates to an electron gun which includes a first gun lens, a beam limiting aperture, and a second gun lens. The first gun lens focuses the electrons before they pass through the beam-limiting aperture while the second gun lens focuses the electrons after they pass through the beam-limiting aperture. Other embodiments, aspects and features are also disclosed.