Abstract: A display module and a plant cultivation apparatus equipped with a display module are provided. The display module in which a control panel that controls a plant cultivation environment and an output that outputs a state of the plant cultivation environment are provided in a front surface thereof coupled to a structure of a bed and withdrawable and insertable into the plant cultivation apparatus together with the bed. The display module may be located at a front surface of the bed, so that usability and space efficiency may be increased.

Abstract: An optical device is provided. The optical device includes a ring waveguide and a bus waveguide. The ring waveguide includes a coupling region. The bus waveguide is disposed adjacent to and spaced apart from the coupling region of the ring waveguide. The bus waveguide includes a coupling structure corresponding to the coupling region.

Abstract: A composition for an organic optoelectronic device an organic optoelectronic device, and a display device, the composition including a first compound; a second compound; and a third compound, wherein the first compound, the second compound, and the third compound are different from each other, the first compound is represented by Chemical Formula I, the second compound is represented by Chemical Formula I, and the third compound is represented by Chemical Formula II or Chemical Formula III:

Abstract: The present application relates to creamer comprising vegetable lipids, casein, maltose, phosphates, and allulose.

Abstract: A display apparatus includes a base substrate, a light emitting structure disposed on the base substrate, and a thin film encapsulation layer disposed on the light emitting structure and including at least one inorganic layer and at least one organic layer. The at least one inorganic layer includes a high density layer having a density of greater than or equal to about 2.0 g/cm3 and a low density layer having a density of less than about 2.0 g/cm3. The high density layer and the low density layer are in contact with each other.

Abstract: A display module and a plant cultivation apparatus equipped with a display module are provided. The display module in which a control panel that controls a plant cultivation environment and an output that outputs a state of the plant cultivation environment are provided in a front surface thereof coupled to a structure of a bed and withdrawable and insertable into the plant cultivation apparatus together with the bed. The display module may be located at a front surface of the bed, so that usability and space efficiency may be increased.

Abstract: A photonic structure and a method for manufacturing the same are provided. The photonic structure includes a substrate, an insulating structure, a first waveguide layer, a second waveguide layer and a high-dielectric constant material. The insulating structure is located over the substrate. The first waveguide layer is embedded in the insulating structure. The second waveguide layer is embedded in the insulating structure and longitudinally spaced apart from the first waveguide layer. The high-dielectric constant material is disposed between the first waveguide layer and the second waveguide layer.

Abstract: A wafer level fan out semiconductor device and a manufacturing method thereof are provided. A first sealing part is formed on lateral surfaces of a semiconductor die. A plurality of redistribution layers are formed on surfaces of the semiconductor die and the first sealing part, and solder balls are attached to the redistribution layers. The solder balls are arrayed on the semiconductor die and the first sealing part. In addition, a second sealing part is formed on the semiconductor die, the first sealing part and lower portions of the solder balls. The solder balls are exposed to the outside through the second sealing part. Since the first sealing part and the second sealing part are formed of materials having thermal expansion coefficients which are the same as or similar to each other, warpage occurring to the wafer level fan out semiconductor device can be suppressed.

Abstract: A method of characterizing a traveling-wave Mach-Zehnder modulator (TWMZM) includes measuring an electrooptic parameter, such as S21, of a test structure including a test TWMZM and a first instance of electrical pads which are connected to deliver a radio frequency (RF) signal to electrooptically modulate light traveling through the test TWMZM. The electrooptic parameter is similarly measured of a reference structure including a reference TWMZM and a second instance of the electrical pads which are connected to deliver the RF signal to electrooptically modulate light traveling through the reference TWMZM. A vestigial traveling-wave electrooptic phase modulator of the reference TWMZM is shorter than a traveling-wave electrooptic phase modulator of the test TWMZM. An electrooptic characteristic of the test TWMZM, such as S21 bandwidth, is determined by operations including subtracting the measured electrooptic S21 of the reference structure from the measured electrooptic S21 of the test structure.

Abstract: A device for manufacturing a double-walled paper cup by combining an inner cup and an outer cup using hot-melt comprising: an outer cup forming part which includes: a turret provided with outer cup mandrels; and an enclosing means forming an outer cup; an outer cup transporting part which includes: a rotational transporting means which has circular slits; an outer cup inserting means which inserts the outer cup into the circular slit; a shaft that moves up and down; a first pusher that firmly restrains the outer cup into the circular slit; and a second pusher for separating the outer cup from the circular slit; and an outer cup combining part which includes: a rotating table provided with rotatable inner cup mandrels; a rotating pocket which rotates the inner cup mandrel; and a first hot-melt spraying nozzle that applies the hot-melt to an outer surface of the inner cup.

Abstract: An optical device is provided. The optical device includes a ring waveguide and a bus waveguide. The ring waveguide includes a coupling region. The bus waveguide is disposed adjacent to and spaced apart from the coupling region of the ring waveguide. The bus waveguide includes a coupling structure corresponding to the coupling region.

Abstract: Provided is a method for preparing a chlorinated polyvinyl chloride resin, and more particularly, a method for preparing a chlorinated polyvinyl chloride resin including a neutralization process for neutralizing to pH of 2 to 5 using metal hydroxide as a first neutralizing agent a), and completing neutralization using a carbonate-based compound as a second neutralizing agent b), wherein residual hydrochloric acid in pores of the chlorinated polyvinyl chloride resin obtained by chlorination of a polyvinyl chloride or a vinyl chloride-based copolymer may be efficiently removed, and thermal stability and extrusion appearance of processed articles may be improved.

Abstract: A horizontal linear-vibration generating apparatus that includes: a case coupled to a bracket so as to provide mounting space therein; a stator mounted in the mounting space and including a coil-yoke unit electrically connected to a circuit substrate on the bracket; a vibrator having magnets corresponding to the coil-yoke unit and weighted bodies configured to amplify vibration and vibrating in a first direction with respect to the stator in the mounting space; and first and second springs correspondingly provided between the case and the vibrator and elastically supporting a shaking motion of the vibrator in the first direction with respect to the stator in the mounting space, at opposite sides of the vibrator, where the first spring and the second spring are integrally provided with first and second spring feet, respectively, for mounting the vibrator.

Abstract: The present invention relates to a side paper feeding apparatus for feeding raw side paper for paper cup manufacturing, the side paper feeding apparatus comprising: a shuttle cam which is rotated by interlocking with a drive shaft and which horizontally reciprocates a shuttle plate which transfers raw side paper disposed on an upper part to a paper cup former; a driving cam unit provided under the shuttle cam and provided with a rotary cam formed on a rotary shaft fixedly coupled to the shuttle cam to intermittently rotate a first turret, an oscillator cam formed on the rotary shaft to oscillate a second turret, and link arms, wherein one end of each link arm is coupled to one end of a first shaft of the first turret and one end of a second shaft of the second turret, and the other ends are rotatably coupled; and a side paper transfer arm unit including an arm plate coupled to the other end of the first turret, rotational arms each having one end rotatably coupled to the outer circumferential surface of the a

Abstract: Provided is a method for preparing a chlorinated polyvinyl chloride resin, and more particularly, a method for preparing a chlorinated polyvinyl chloride resin including a neutralization process for neutralizing to pH of 2 to 5 using metal hydroxide as a first neutralizing agent a), and completing neutralization using a carbonate-based compound as a second neutralizing agent b), wherein residual hydrochloric acid in pores of the chlorinated polyvinyl chloride resin obtained by chlorination of a polyvinyl chloride or a vinyl chloride-based copolymer may be efficiently removed, and thermal stability and extrusion appearance of processed articles may be improved.

Abstract: A method of diagnosing systemic lupus erythematosus using an antigen protein that binds specifically to an SMYD3 autoantibody present in body fluid of a patient with systemic lupus erythematosus. The diagnostic method uses a non-invasive biological sample such as blood, and thus may diagnose systemic lupus erythematosus very conveniently without burdening the patient, unlike conventional methods. In addition, the method has high specificity and sensitivity, and thus may be effectively used for early diagnosis of systemic lupus erythematosus.

Abstract: A wafer level fan out semiconductor device and a manufacturing method thereof are provided. A first sealing part is formed on lateral surfaces of a semiconductor die. A plurality of redistribution layers are formed on surfaces of the semiconductor die and the first sealing part, and solder balls are attached to the redistribution layers. The solder balls are arrayed on the semiconductor die and the first sealing part. In addition, a second sealing part is formed on the semiconductor die, the first sealing part and lower portions of the solder balls. The solder balls are exposed to the outside through the second sealing part. Since the first sealing part and the second sealing part are formed of materials having thermal expansion coefficients which are the same as or similar to each other, warpage occurring to the wafer level fan out semiconductor device can be suppressed.

Abstract: Methodologies and an apparatus for enabling magnetic shielding of stand alone MRAM are provided. Embodiments include placing MRAM dies and logic dies on a first surface of a mold frame; forming a top magnetic shield over top and side surfaces of the MRAM dies; forming a mold cover over the MRAM dies, FinFET dies and mold frame; removing the mold frame to expose a bottom surface of the MRAM dies and FinFET dies; and forming a bottom magnetic shield over the bottom surface of the MRAM dies.

Abstract: A display apparatus includes a panel, a backlight module, a cover, an integrated plastic frame and an optical adhesive. The panel is disposed over the backlight module. The cover is disposed over the panel, which is located between the cover and the backlight module. The integrated plastic frame includes a first accommodating portion, a second accommodating portion and an adhesive-restricting portion. The second accommodating portion is coupled between the first accommodating portion and the adhesive-restricting portion. The combination of the first accommodating portion, the second accommodating portion and the adhesive-restricting portion is integrally formed. The first accommodating portion accommodates at least a portion of the backlight module, the second accommodating portion accommodates the panel, and the adhesive-restricting portion is coupled between the second accommodating portion and the cover to define an accommodating space together with the cover and the panel.

Abstract: A wafer level fan out semiconductor device and a manufacturing method thereof are provided. A first sealing part is formed on lateral surfaces of a semiconductor die. A plurality of redistribution layers are formed on surfaces of the semiconductor die and the first sealing part, and solder balls are attached to the redistribution layers. The solder balls are arrayed on the semiconductor die and the first sealing part. In addition, a second sealing part is formed on the semiconductor die, the first sealing part and lower portions of the solder balls. The solder balls are exposed to the outside through the second sealing part. Since the first sealing part and the second sealing part are formed of materials having thermal expansion coefficients which are the same as or similar to each other, warpage occurring to the wafer level fan out semiconductor device can be suppressed.